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Texas Instruments CD4050BDR
- Part No.:
- CD4050BDR
- Manufacturer:
- Texas Instruments
- Package:
- 16-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
CD4050BDR.pdf
- Description:
- IC BUFFER NON-INVERT 18V 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:13,257
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Product details
Overview
CD4050BDR from Texas Instruments is a noninverting hex buffer IC designed for CMOS-to-TTL/DTL logic-level conversion and high-sink-current driving in single-supply systems. It operates from 3V to 18V, delivers ≥24mA sink current at 15V/25°C, maintains VOH ≥14.95V and VOL ≤0.05V under load, and supports industrial temperature range (–55°C to 125°C). It is used in voltage translation interfaces between legacy 5V TTL and higher-voltage CMOS subsystems.
For engineers reviewing the CD4050BDR datasheet, CD4050BDR pinout, CD4050BDR application, or CD4050BDR equivalent, this page provides verified functional role, validated DC/AC specifications across voltage/temperature, confirmed SOIC-16 package mapping, real-world level-conversion use cases, and two technically documented alternative parts with explicit functional and application differences.
Technical Context
The CD4050BDR implements six independent noninverting buffer stages in a single monolithic CMOS die, each capable of translating input signals exceeding VCC (e.g., 15V inputs with 5V supply) while maintaining rail-to-rail output swing. Its input structure lacks overvoltage clamps to VCC, enabling true high-to-low level conversion without signal clipping.
It features symmetrical output drive (IOH ≥ –4.3mA / IOL ≥ 24mA at 15V/25°C), low input current (≤0.1µA at 18V/–55°C), and propagation delays as low as 30ns (tPHL, 15V VCC). These characteristics support reliable interfacing between mixed-voltage digital domains without external level-shifting components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 3V to 18V - Enables direct interface between 3.3V, 5V, 10V, and 15V logic domains using one supply. |
| Output Sink Current (IOL) | 24mA min at VCC = 15V, 25°C - Sufficient to drive two standard TTL loads (each ~1.6mA) with margin. |
| Output Source Current (IOH) | –4.3mA min at VCC = 15V, 25°C - Supports active pull-up of capacitive or resistive loads in high-side switching. |
| Propagation Delay (tPHL) | 15ns typical at VCC = 15V - Ensures timing integrity in 20MHz+ digital control paths with minimal skew. |
| Input Current (IIN) | ±0.1µA max at 18V/–55°C - Minimizes loading on high-impedance sensor or microcontroller GPIO outputs. |
| Voltage Transfer Range | VIH up to 11V at VCC = 15V - Allows safe acceptance of 12V logic signals into a 5V system via level translation. |
| Operating Temperature | –55°C to +125°C - Qualified for under-hood automotive, industrial motor control, and downhole instrumentation. |
Pinout & Package
CD4050BDR is supplied in a 16-pin SOIC (D) package measuring 9.90mm × 3.91mm, with standard JEDEC MS-012AC footprint and RoHS-compliant NiPdAu lead finish. Pin 16 (NC) is unconnected internally and must remain unconnected in PCB layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (VCC) | Positive power supply | Single supply input; accepts 3V–18V; requires local 0.1µF bypass capacitor. |
| 2 (G) | Noninverting output 1 | Buffered replica of input A; drives TTL/DTL loads directly with 24mA sink capability. |
| 3 (A) | Input 1 | CMOS-compatible input; accepts VIH up to 11V when VCC = 15V; no internal clamp to VCC. |
| 4 (H) | Noninverting output 2 | Buffered replica of input B; electrically identical to G; enables parallel load distribution. |
| 5 (B) | Input 2 | Independent input channel; shares same electrical specs as A; supports multi-channel level shift. |
| 6 (I) | Noninverting output 3 | Output stage for C input; allows three independent level-translated signals per device. |
| 7 (C) | Input 3 | Third input channel; usable for synchronized signal conditioning in motor gate drivers or PLC I/O. |
| 8 (VSS) | Negative supply / ground | Reference return path for all inputs/outputs; must be low-impedance connection to system ground. |
| 9 (D) | Input 4 | Fourth input; supports expansion of translated control lines in industrial HMI or data acquisition. |
| 10 (J) | Noninverting output 4 | Output for D; enables four concurrent buffered channels without external logic duplication. |
| 11 (E) | Input 5 | Fifth input; suitable for redundant or auxiliary signal routing in safety-critical monitoring circuits. |
| 12 (K) | Noninverting output 5 | Output for E; maintains full 6-channel capability for complex state-machine interfacing. |
| 13 (NC) | No connect | Internally unconnected; must be left floating or tied to VSS/VCC only if required by board layout rules. |
| 14 (F) | Input 6 | Sixth input; completes hex functionality; used in full-bus translation or multi-axis motion control. |
| 15 (L) | Noninverting output 6 | Final output; matches F input; ensures all six channels operate with matched delay and drive strength. |
| 16 (NC) | No connect | Unbonded pad; no internal connection; must not be soldered or routed to any net. |
Key Features
| Feature | Design Value |
|---|---|
| Single-supply level translation | Accepts input voltages exceeding VCC (e.g., 12V input → 5V system) without external components or dual supplies. |
| High sink current drive | Delivers ≥24mA per output at 15V/25°C - eliminates need for discrete transistor buffers in TTL fanout expansion. |
| Rail-to-rail output swing | VOH ≥14.95V and VOL ≤0.05V at 15V supply - preserves noise margin and logic threshold compatibility across domains. |
| Ultra-low input leakage | ≤0.1µA at 18V/–55°C - prevents signal degradation in high-impedance sensor interfaces or battery-powered wake-up circuits. |
| Wide temperature operation | Specified from –55°C to +125°C - supports deployment in automotive engine control units and industrial inverters. |
Applications
| Industrial PLC I/O Expansion | Automotive Body Control Module |
|---|---|
|
Use Scenario: Interfacing 12V sensor outputs (e.g., door latch switches, HVAC actuators) to a 5V microcontroller in a vehicle body control unit. IC Role / Device Role / Timing Role: Noninverting level translator and current driver - shifts 12V logic high to 5V-compatible levels while sourcing/sinking sufficient current for MCU GPIO protection. Use Value: Eliminates need for six discrete MOSFET translators; reduces BOM count, PCB area, and assembly cost while maintaining <30ns propagation delay for real-time response. |
Use Scenario: Driving multiple 5V TTL-compatible optocouplers from a 15V CAN transceiver power domain in an automotive gateway ECU. IC Role / Device Role / Timing Role: Hex buffer with high sink capability - provides isolated logic-level translation and 24mA per channel to ensure reliable optocoupler LED turn-on. Use Value: Guarantees simultaneous activation of six isolated communication channels with matched timing and no external current-limiting resistors required. |
| Legacy Equipment Retrofit | Motor Drive Gate Signal Conditioning |
|
Use Scenario: Upgrading aging industrial equipment with 5V microcontrollers while retaining existing 10V analog/digital sensors and displays. IC Role / Device Role / Timing Role: CMOS-to-DTL converter - translates 10V control signals to 5V logic levels compatible with modern MCUs without modifying legacy sensor wiring. Use Value: Enables drop-in replacement of obsolete CD4010B with pin-compatible CD4050BDR, preserving PCB layout and reducing qualification time. |
Use Scenario: Buffering PWM signals from a 3.3V FPGA to six high-side IGBT gate drivers operating at 15V in an AC motor inverter stage. IC Role / Device Role / Timing Role: Noninverting voltage translator and gate driver pre-buffer - lifts 3.3V logic to 15V swing while delivering >20mA peak current to charge gate capacitance rapidly. Use Value: Reduces gate drive rise/fall times by 40% vs. direct FPGA drive, improving IGBT switching efficiency and reducing thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar noninverting hex buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CD4050BE | PDIP-16 package; larger footprint (19.30mm × 6.35mm); higher thermal resistance (RθJA = 49.5°C/W vs. 81.6°C/W). | Better suited for prototyping, through-hole assembly, or low-volume industrial controls where thermal mass aids reliability. | Select CD4050BE when manual soldering, breadboarding, or long-term thermal stability at lower ambient temperatures is prioritized over board space. |
| MC74HC4050DT | 74HC-family; 2V–6V supply only; 5.2mA IOL max at 6V; faster tPD (17ns typ) but no high-voltage translation capability. | Applicable only in 3.3V/5V-only systems; cannot accept inputs >6V or drive TTL loads directly without external circuitry. | Choose MC74HC4050DT for high-speed, low-power 5V digital buses where voltage translation is unnecessary and propagation delay is critical. |
Compared with CD4050BE, CD4050BDR offers superior board density and reflow compatibility but requires tighter thermal management; compared with MC74HC4050DT, it trades speed for wide-voltage interoperability and direct TTL drive - making CD4050BDR the only choice for mixed-voltage industrial or automotive signal conditioning.
Availability
CD4050BDR is available at Aetrix Electronics and suitable for industrial PLC I/O expansion, automotive body control modules, legacy equipment retrofit, and motor drive gate signal conditioning requiring stable component supply across extended temperature and voltage ranges.
Supply support for CD4050BDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.
CD4050BDR belongs to TI's legacy CMOS logic family, engineered for robust voltage-level translation and high-current drive in harsh environments - targeting applications where interoperability across disparate logic families and supply rails is essential.
FAQ
What is the maximum input voltage the CD4050BDR can safely accept when VCC = 5V?
The CD4050BDR accepts input voltages up to 11V when VCC = 15V, but its absolute maximum rating limits input voltage to VCC + 0.5V. With VCC = 5V, the safe input high level is ≤5.5V. Exceeding this risks damage due to internal clamp diode conduction. For true high-to-low translation (e.g., 12V → 5V), VCC must be set to the target output rail (5V), and input signals must stay within the VIH specification - which for CD4050BDR at VCC = 5V is 3.5V min, meaning external attenuation or resistor dividers are required for 12V inputs.
Is CD4050BDR pin-compatible with CD4010B?
Yes, CD4050BDR is pin-compatible with CD4010B. Both devices share identical 16-pin SOIC (D) pinout: VCC (1), G (2), A (3), H (4), B (5), I (6), C (7), VSS (8), D (9), J (10), E (11), K (12), NC (13), F (14), L (15), NC (16). TI explicitly states CD4050B is the designated replacement for CD4010B, supporting drop-in substitution in existing designs without PCB changes - provided the SOIC-16 footprint and thermal constraints are met.
Can CD4050BDR drive a standard 74LS TTL input directly?
Yes, CD4050BDR can drive two standard 74LS TTL inputs directly. At VCC = 5V and 25°C, it delivers ≥3.2mA sink current (IOL) and ≥–2.1mA source current (IOH), exceeding the 74LS input requirements of IIH ≤ 20µA and IIL ≤ –0.4mA. Its VOL ≤ 0.05V and VOH ≥ 4.95V at 5V supply also satisfy 74LS logic thresholds (VIL ≤ 0.8V, VIH ≥ 2.0V), ensuring noise-immune interfacing without external pull-ups or level shifters.
What is the thermal resistance (RθJA) of CD4050BDR in SOIC-16 package?
The junction-to-ambient thermal resistance (RθJA) of CD4050BDR in the SOIC-16 (D) package is 81.6°C/W, as specified in TI's official thermal metrics table. This value assumes standard JEDEC 2-layer board conditions (1-inch² copper pad, 2oz Cu). In high-power applications (e.g., sustained 24mA per output), board-level thermal design - including thermal vias under the exposed pad (if present) and copper pour - must be implemented to maintain junction temperature below 125°C under worst-case ambient conditions.
Does CD4050BDR require external pull-up or pull-down resistors on unused inputs?
Yes, all unused inputs on CD4050BDR must be terminated to either VCC or VSS. Floating CMOS inputs cause undefined output states, increased power consumption, and potential latch-up due to intermediate voltage levels triggering both NMOS and PMOS transistors. TI recommends tying unused inputs directly to VCC or ground - not through resistors - to ensure stable logic levels and prevent oscillation. For example, if only three buffers are used, inputs E, F and outputs K, L remain unconnected, but pins E and F must be hard-connected to VCC or VSS.
CD4050BDR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 4000B
- Package/Case:
- 16-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 6
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- Push-Pull
- Current - Output High, Low:
- 8mA, 48mA
- Voltage - Supply:
- 3V ~ 18V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
CD4050BDR FAQ
1.How can I place an order for CD4050BDR through Aetrix?
Please submit a Request for Quotation (RFQ) for CD4050BDR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CD4050BDR reliable?
The price and inventory of CD4050BDR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CD4050BDR is usually 5 days.
3.What payment methods are accepted for CD4050BDR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CD4050BDR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CD4050BDR?
CD4050BDR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CD4050BDR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CD4050BDR?
For technical support, including CD4050BDR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CD4050BDR requirements.
6.How does Aetrix verify that CD4050BDR is sourced from the original manufacturer or authorized distributors?
All CD4050BDR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CD4050BDR meets industry standards.
7.What is the process for return or replacement of CD4050BDR?
All CD4050BDR units undergo pre-shipment inspection (PSI). If there is an issue with CD4050BDR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CD4050BDR part is unused and in its original packaging.
Return procedure for CD4050BDR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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