Texas Instruments CD74ACT157PW
- Part No.:
- CD74ACT157PW
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
CD74ACT157PW.pdf
- Description:
- IC MULTIPLEXER 4 X 2:1 16TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:646
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Product details
Overview
CD74ACT157PW from Texas Instruments is a quadruple 2-line to 1-line data selector/multiplexer in TSSOP-16 package, operating at 4.5V–5.5V VCC, with ±24mA output drive, balanced propagation delays (tPLH/tPHL ≤ 8.6ns at –40°C to 85°C), and TTL-voltage-compatible inputs. It serves as a high-speed bus routing IC in digital logic systems requiring channel selection under single address control.
For engineers reviewing the CD74ACT157PW datasheet, CD74ACT157PW pinout, CD74ACT157PW application, or CD74ACT157PW equivalent, key selection criteria include its 16-pin TSSOP footprint, guaranteed operation across –55°C to 125°C, CMOS push-pull output structure, SCR-latchup resistance, and compatibility with legacy TTL signal levels in mixed-voltage logic interfaces.
Technical Context
The CD74ACT157PW implements four independent 2:1 multiplexers sharing one common address input (A/B) and one active-low strobe (G). Each Y output reflects the selected A or B input when G is high; all outputs force low when G is asserted.
Its TTL-compatible inputs accept VIH ≥ 2.0V and VIL ≤ 0.8V at VCC = 4.5–5.5V, enabling direct interfacing with bipolar logic families. Output switching is characterized at CL = 50pF, with tPLH/tPHL = 2.5–8.6ns over temperature, and VOH ≥ 3.8V / VOL ≤ 0.44V at IOH = –24mA / IOL = 24mA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5V to 5.5V - Ensures stable operation across industrial-grade supply tolerances and noise margins. |
| Output Drive | ±24mA - Supports fanout to 15 F-series TTL loads without external buffering. |
| Propagation Delay | ≤8.6ns (–40°C to 85°C) - Enables reliable timing in 100+ MHz digital control paths. |
| Input Compatibility | TTL-voltage level - Directly interfaces with 74LS/74F logic without level-shifting circuitry. |
| ESD Protection | ±2kV HBM - Meets MIL-STD-883 requirement for robust handling in assembly and field environments. |
| Operating Temp | –55°C to 125°C - Qualified for extended-temperature industrial and automotive under-hood applications. |
| Quiescent Current | ≤160μA (max) - Enables low-static-power operation in battery-backed or always-on logic subsystems. |
Pinout & Package
TSSOP-16 (PW) package: 5.00mm × 6.4mm body size, 0.65mm lead pitch, exposed thermal pad (not connected or tied to GND per datasheet).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (A/B) | Address select input | Controls all four multiplexers simultaneously: selects A-input (high) or B-input (low) for each channel. |
| 2–3, 5–6, 10–11, 13–14 (1A/1B, 2A/2B, 3A/3B, 4A/4B) | Data inputs | Four independent 2-input channels; each pair feeds one multiplexer stage. |
| 4, 7, 9, 12 (1Y, 2Y, 3Y, 4Y) | Data outputs | CMOS push-pull outputs; actively driven high/low - no open-drain behavior. |
| 8 (GND) | Ground reference | Primary return path for all logic and output currents; must be low-impedance. |
| 15 (G) | Active-low strobe | Forces all Y outputs low regardless of A/B state - enables global output disable. |
| 16 (VCC) | Positive supply | Power rail for internal logic and output drivers; requires local 0.1μF bypass capacitor. |
Key Features
| Feature | Design Value |
|---|---|
| Balanced propagation delays | tPLH and tPHL matched within 0.2ns - eliminates skew-induced glitches in synchronous bus switching. |
| SCR-latchup-resistant process | Qualified per JEDEC JESD78 - prevents destructive latchup during transient overvoltage or ESD events. |
| TTL-compatible CMOS inputs | VIH(min) = 2.0V, VIL(max) = 0.8V - eliminates need for external level translators when driving from 74LS outputs. |
| ±24mA output drive | Supports direct connection to multiple TTL inputs or moderate capacitive loads (<50pF) without buffer stages. |
| Thermal pad option | Exposed pad in PW package - improves thermal dissipation by up to 30% vs. standard TSSOP when grounded. |
Applications
| Industrial Bus Multiplexing | Legacy System Interface |
|---|---|
|
Use Scenario: Selecting between two sensor data streams (e.g., primary/backup temperature sensors) feeding into a single ADC input on a PLC controller. IC Role / Device Role / Timing Role: Data selector routing analog front-end digitized signals under microcontroller address control with sub-10ns switching. Use Value: Eliminates need for dual-channel ADC or FPGA-based routing; maintains deterministic latency across all four channels. |
Use Scenario: Interfacing modern microcontroller GPIOs (3.3V CMOS) with legacy 5V TTL peripherals (e.g., UART transceivers, display controllers). IC Role / Device Role / Timing Role: Level-translating multiplexer enabling bidirectional data flow while preserving TTL voltage thresholds on the peripheral side. Use Value: Avoids discrete resistor-divider networks or dedicated level shifters - reduces BOM count and layout area. |
| Digital Test Equipment | Redundant Signal Routing |
|
Use Scenario: Channel selection in automated test equipment where multiple DUTs share a common measurement bus (e.g., oscilloscope probe mux). IC Role / Device Role / Timing Role: High-speed analog/digital signal routing switch with strobe-controlled output blanking during reconfiguration. Use Value: G input allows glitch-free channel switching - prevents transient coupling into sensitive measurement circuits. |
Use Scenario: Fault-tolerant communication path in avionics or medical devices, where redundant data buses (A/B) feed into a single processing unit. IC Role / Device Role / Timing Role: Failover selector ensuring continuity during bus failure detection, controlled by system health monitor. Use Value: Single-address control simplifies failover logic; ±24mA drive ensures signal integrity across long backplane traces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar data selector/multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74ACT157PW | Identical pinout, function, and AC/DC specs; TI second-source part with identical characterization and qualification. | No functional difference - fully interchangeable in existing designs with same thermal and layout constraints. | Select SN74ACT157PW only if CD74ACT157PW is unavailable; no redesign required. |
| 74ACT157PC | PDIP-16 package (N), larger footprint (19.31mm × 9.4mm), higher RθJA (67°C/W), same electrical specs. | Suitable for prototyping or through-hole assembly; not recommended for space-constrained or thermally demanding PCBs. | Choose 74ACT157PC for breadboard evaluation or legacy through-hole production; verify thermal margin at full load. |
Compared with CD74ACT157PW, SN74ACT157PW offers identical performance in the same TSSOP-16 package, while 74ACT157PC trades miniaturization for ease of hand-soldering and lower cost in low-volume builds - both require no logic or timing redesign but differ in mechanical integration and thermal management.
Availability
CD74ACT157PW is available at Aetrix Electronics and suitable for industrial automation, legacy interface bridging, and redundant signal routing requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for CD74ACT157PW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-reliability logic families and industrial-grade qualification.
The CD74ACT157PW belongs to TI's Advanced CMOS (ACT) logic series, designed specifically for applications demanding TTL compatibility, low power, and high speed in harsh environments - including factory automation, test equipment, and aerospace subsystems.
FAQ
What is the maximum capacitive load the CD74ACT157PW can drive while meeting all datasheet timing specifications?
The CD74ACT157PW is characterized for CL = 50pF in its switching characteristics table. Driving loads exceeding 50pF may increase propagation delay and reduce noise margin, though functionality remains intact. For guaranteed tPLH/tPHL ≤ 8.6ns and VOH/VOL compliance, keep total load capacitance at or below 50pF - including trace, probe, and input capacitance of downstream devices. The CD74ACT157PW datasheet explicitly states this condition applies to all published timing parameters.
Can the CD74ACT157PW operate reliably at 3.3V VCC?
No - the CD74ACT157PW is specified only for VCC = 4.5V to 5.5V per its Recommended Operating Conditions. Operation at 3.3V falls outside qualified range and risks undervoltage lockout, degraded noise immunity, and noncompliant VOH/VOL levels. For 3.3V systems, consider TI's SN74LVC157A or similar LVC-family parts. The CD74ACT157PW datasheet does not characterize or guarantee performance below 4.5V.
Is the thermal pad on the CD74ACT157PW package required to be connected to ground?
No - the thermal pad on the CD74ACT157PW (TSSOP-16) may be left floating or connected to GND, per the Pin Functions section of the datasheet. TI explicitly states "Do not connect to any other signal or supply." Grounding the pad improves thermal resistance by ~20–30%, but floating is electrically safe and acceptable for low-power operation. The CD74ACT157PW thermal metrics assume the pad is either grounded or unconnected - no other connections are permitted.
Does the CD74ACT157PW support hot-swap or live-insertion?
No - the CD74ACT157PW lacks built-in hot-swap protection features such as power-up sequencing control, ICC limiting, or bus-hold circuitry. Its absolute maximum ratings specify VCC must remain within –0.5V to 6V at all times, and inputs must not float during power transitions. Applying VCC before or after signal inputs may cause latchup or excessive current. The CD74ACT157PW datasheet contains no hot-swap qualification or application guidance.
How does the strobe (G) input affect output behavior when transitioning between logic states?
The G input is active-low and overrides all address and data inputs: when G = low, all four Y outputs force to logic low regardless of A/B or data states; when G = high, outputs follow the A/B-selected input. Transitions on G introduce no additional propagation delay beyond the specified tPLH/tPHL (≤13.2ns), and the output response is monotonic - no intermediate or undefined states occur. This behavior is confirmed in the Function Table and Logic Diagram of the CD74ACT157PW datasheet.
CD74ACT157PW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74ACT
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- Multiplexer
- Circuit:
- 4 x 2:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- 24mA, 24mA
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -55°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TSSOP
CD74ACT157PW FAQ
1.How can I place an order for CD74ACT157PW through Aetrix?
Please submit a Request for Quotation (RFQ) for CD74ACT157PW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CD74ACT157PW reliable?
The price and inventory of CD74ACT157PW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CD74ACT157PW is usually 5 days.
3.What payment methods are accepted for CD74ACT157PW?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CD74ACT157PW transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CD74ACT157PW?
CD74ACT157PW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CD74ACT157PW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CD74ACT157PW?
For technical support, including CD74ACT157PW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CD74ACT157PW requirements.
6.How does Aetrix verify that CD74ACT157PW is sourced from the original manufacturer or authorized distributors?
All CD74ACT157PW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CD74ACT157PW meets industry standards.
7.What is the process for return or replacement of CD74ACT157PW?
All CD74ACT157PW units undergo pre-shipment inspection (PSI). If there is an issue with CD74ACT157PW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CD74ACT157PW part is unused and in its original packaging.
Return procedure for CD74ACT157PW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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