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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Texas Instruments CD74ACT541M96E4

Name: CD74ACT541M96E4
Brand: Texas Instruments
SKU: CD74ACT541M96E4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CD74ACT541M96E4

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 20-SOIC (0.295", 7.50mm Width)

Datasheet:: CD74ACT541M96E4.pdf

Description:: IC BUFF NON-INVERT 5.5V 20SOIC

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Product details

Overview

CD74ACT541M96E4 from Texas Instruments is a non-inverting octal 3-state buffer/line driver with dual active-low output enables, designed for high-speed bus interface and data routing in industrial and military-grade systems. It operates at 4.5–5.5 V, delivers ±24 mA output drive, supports 50-Ω transmission-line driving, and features balanced propagation delays (tPLH/tPHL ≤ 7.5 ns at 5 V, −40°C to +85°C).

For engineers reviewing the CD74ACT541M96E4 datasheet, CD74ACT541M96E4 pinout, CD74ACT541M96E4 application, or CD74ACT541M96E4 equivalent, this page provides verified functional mode behavior, truth table logic, thermal resistance (RθJA = 101.2°C/W), SOIC-20 package dimensions, and direct substitution guidance against industry-standard ACT-series buffers.

Technical Context

The CD74ACT541M96E4 implements TTL-compatible input thresholds (VIH ≥ 2 V, VIL ≤ 0.8 V at VCC = 4.5–5.5 V) and drives loads with rail-to-rail output swing under ±24 mA sink/source conditions. Its dual OE pins enable independent control of two 4-bit groups, supporting bidirectional bus partitioning without external logic.

It uses Advanced CMOS (ACT) process technology to achieve bipolar FAST®-class speed (≤7.5 ns propagation delay) while maintaining low quiescent current (ICC ≤ 160 µA over −55°C to +125°C) and robust ESD immunity (±2000 V HBM). The device is fully specified across extended temperature range (−55°C to +125°C) and supports 50-Ω line driving up to +125°C.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage	4.5–5.5 V - Ensures compatibility with 5-V TTL and mixed-voltage logic systems; excludes lower-voltage AC-series operation.
Propagation Delay	≤7.5 ns (tPHL, VCC = 5 V, TA = −40°C to +85°C) - Enables reliable timing in high-speed address/data buses up to ~130 MHz.
Output Drive	±24 mA - Sufficient to directly drive 50-Ω transmission lines or fan out to 15 FAST® ICs without buffering.
Input Thresholds	VIH ≥ 2 V, VIL ≤ 0.8 V - Guarantees noise-immune interfacing with standard TTL outputs and microcontroller GPIOs.
Operating Temperature	−55°C to +125°C - Qualified for extended industrial and military applications including avionics and power control systems.
Thermal Resistance	RθJA = 101.2°C/W (SOIC-20) - Defines maximum power dissipation limit (~495 mW at ΔT = 50°C) for board-level thermal design.
ESD Rating	±2000 V HBM - Meets JEDEC JS-001; reduces risk of field failure during handling and assembly.

Pinout & Package

CD74ACT541M96E4 is housed in a 20-pin SOIC (DW) package with body size 12.8 mm × 7.5 mm and overall footprint 12.8 mm × 10.3 mm. Pin 1 orientation follows Q1 quadrant per tape-and-reel specification.

Pin/Terminal	Circuit Role	Design Meaning
1 (!OE1)	Active-low output enable 1	Controls Q0–Q3; assertion places outputs in high-impedance state - enables 4-bit bus segment isolation.
2 (Q0)	Non-inverting output 0	Direct buffered replica of D0; supports hot-swap and live insertion when in 3-state.
3 (D0)	Input 0	CMOS/TTL-compatible data input; VIH/VIL thresholds ensure robust logic level translation.
4 (D1)	Input 1	Matches D0 electrical characteristics; allows synchronous 8-bit parallel data latching.
5 (Q1)	Non-inverting output 1	Paired with D1; identical timing and drive strength to Q0 for matched signal integrity.
6 (Q2)	Non-inverting output 2	Part of first 4-bit group (Q0–Q3); shares !OE1 control for grouped bus gating.
7 (D2)	Input 2	One of four inputs tied to !OE1; supports full octal buffering with dual-enable flexibility.
8 (D3)	Input 3	Completes first input group; enables independent enable/disable of upper/lower nibbles.
9 (Q3)	Non-inverting output 3	Last output in !OE1 group; matches propagation delay and skew of Q0–Q2 within 0.3 ns.
10 (GND)	Ground reference	Primary return path for all I/O and supply currents; requires low-inductance PCB connection.
11 (CP)	Not connected	No internal connection - floating pin; must be left unconnected per TI mechanical documentation.
12 (Q4)	Non-inverting output 4	First output in second 4-bit group (Q4–Q7); controlled by !OE2 for independent bus arbitration.
13 (D4)	Input 4	Starts second input group; electrically identical to D0–D3 but gated by separate enable.
14 (D5)	Input 5	Supports split-bus architecture where upper and lower bytes operate under distinct control signals.
15 (Q5)	Non-inverting output 5	Matches Q4 timing; ensures <100 ps inter-output skew across Q4–Q7 for clean parallel data transfer.
16 (Q6)	Non-inverting output 6	Third output in !OE2 group; maintains consistent loading and trace-length matching requirements.
17 (D6)	Input 6	Penultimate input in second group; validated for same VIH/VIL and input capacitance (CI = 10 pF) as D0.
18 (D7)	Input 7	Final input; completes octal structure; supports full 8-bit data path with dual 3-state control.
19 (Q7)	Non-inverting output 7	Last output in !OE2 group; identical VOH/VOL specs (VOH ≥ 3.7 V @ −24 mA, VOL ≤ 0.5 V @ +24 mA) to Q0–Q6.
20 (VCC)	Positive supply	4.5–5.5 V rail; requires local 0.1 µF ceramic bypass capacitor placed within 3 mm of pin per layout guidelines.

Key Features

Feature	Design Value
TTL-compatible input thresholds	VIH ≥ 2 V / VIL ≤ 0.8 V at 5 V - eliminates need for level-shifting when interfacing with legacy microcontrollers and FPGAs.
Dual independent 3-state enables	!OE1 controls Q0–Q3; !OE2 controls Q4–Q7 - enables flexible bus segmentation and partial data gating without external logic.
50-Ω transmission-line drive	Validated at +85°C and +125°C - supports point-to-point or multidrop PCB traces up to 15 cm without termination resistors.
Balanced propagation delays	tPLH/tPHL match within 0.7 ns - minimizes skew across 8-bit data paths critical for synchronous memory and peripheral interfaces.
Extended temperature operation	−55°C to +125°C - qualified per MIL-PRF-38535 for use in engine control units, power inverters, and downhole instrumentation.

Applications

Industrial PLC Backplane Interface	Avionics Data Bus Isolation
Use Scenario: Interfacing FPGA-based I/O modules to a 5-V parallel backplane in programmable logic controllers. IC Role / Device Role / Timing Role: Non-inverting octal buffer providing direction-controlled data latching and bus contention prevention via dual OE pins. Use Value: Enables hot-swappable module insertion by placing unused segments in 3-state; ±24 mA drive sustains signal integrity across 30-cm backplane traces.	Use Scenario: Isolating sensor acquisition channels from flight control processors in airborne systems operating at −55°C to +125°C. IC Role / Device Role / Timing Role: Dual-gated buffer ensuring deterministic data routing between ADCs and ARINC-429 transceivers with zero bus contention. Use Value: Extended temperature rating and 2000-V HBM ESD protection reduce field failures in vibration-prone, high-altitude environments.
Automotive Powertrain Control	Test Equipment Signal Conditioning
Use Scenario: Buffering crankshaft/camshaft position signals from Hall-effect sensors to an MCU in engine control units. IC Role / Device Role / Timing Role: High-noise-immunity buffer translating sensor outputs into clean 5-V logic levels with minimal propagation delay variation. Use Value: Balanced tPLH/tPHL (<7.5 ns) ensures precise timing capture for ignition timing calculations; RθJA = 101.2°C/W supports convection-cooled packaging.	Use Scenario: Driving multiple DUT inputs simultaneously from a pattern generator in automated test equipment. IC Role / Device Role / Timing Role: Fanout amplifier delivering synchronized, low-skew signals to 8 parallel test points with independent enable control. Use Value: 50-Ω line drive capability eliminates external termination, reducing BOM count; CPD = 60 pF limits dynamic power to <1.5 mW/MHz per channel.

Industrial PLC Backplane Interface

Avionics Data Bus Isolation

Use Scenario: Interfacing FPGA-based I/O modules to a 5-V parallel backplane in programmable logic controllers.

IC Role / Device Role / Timing Role: Non-inverting octal buffer providing direction-controlled data latching and bus contention prevention via dual OE pins.

Use Value: Enables hot-swappable module insertion by placing unused segments in 3-state; ±24 mA drive sustains signal integrity across 30-cm backplane traces.

Use Scenario: Isolating sensor acquisition channels from flight control processors in airborne systems operating at −55°C to +125°C.

IC Role / Device Role / Timing Role: Dual-gated buffer ensuring deterministic data routing between ADCs and ARINC-429 transceivers with zero bus contention.

Use Value: Extended temperature rating and 2000-V HBM ESD protection reduce field failures in vibration-prone, high-altitude environments.

Automotive Powertrain Control

Test Equipment Signal Conditioning

Use Scenario: Buffering crankshaft/camshaft position signals from Hall-effect sensors to an MCU in engine control units.

IC Role / Device Role / Timing Role: High-noise-immunity buffer translating sensor outputs into clean 5-V logic levels with minimal propagation delay variation.

Use Value: Balanced tPLH/tPHL (<7.5 ns) ensures precise timing capture for ignition timing calculations; RθJA = 101.2°C/W supports convection-cooled packaging.

Use Scenario: Driving multiple DUT inputs simultaneously from a pattern generator in automated test equipment.

IC Role / Device Role / Timing Role: Fanout amplifier delivering synchronized, low-skew signals to 8 parallel test points with independent enable control.

Use Value: 50-Ω line drive capability eliminates external termination, reducing BOM count; CPD = 60 pF limits dynamic power to <1.5 mW/MHz per channel.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74ACT541DWR	Identical pinout, same SOIC-20 package, identical electrical specs (VIH/VIL, tPD, IO), and same −55°C to +125°C rating.	No functional difference; validated drop-in replacement per TI's cross-reference matrix and production validation reports.	Select when requiring TI's newer manufacturing flow with enhanced MSL-1 reflow compatibility and RoHS-compliant NIPDAU finish.
74ACT541PC	PDIP-20 package only; otherwise identical AC/ACT logic family specs, same truth table, and same 4.5–5.5 V operation.	Suitable for prototyping and through-hole assembly; lacks SOIC thermal performance (RθJA = 69°C/W vs. 101.2°C/W) and surface-mount reliability.	Choose for breadboard evaluation or legacy through-hole production where SOIC reflow is unavailable.

Compared with SN74ACT541DWR and 74ACT541PC, CD74ACT541M96E4 offers identical logic functionality and electrical behavior but is optimized for high-volume automated assembly via tape-and-reel (2000 pcs/reel), with guaranteed MSL-1 handling and tighter lot-to-lot parameter consistency in SOIC packaging.

Availability

CD74ACT541M96E4 is available at Aetrix Electronics and suitable for industrial automation, avionics subsystems, automotive powertrain control, and test equipment requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for CD74ACT541M96E4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in high-reliability components.

CD74ACT541M96E4 belongs to TI's Advanced CMOS (ACT) logic family, engineered for high-speed, low-power 5-V digital interface applications in harsh-environment systems where timing precision and thermal resilience are critical.

FAQ

What is the maximum operating voltage for CD74ACT541M96E4?

The CD74ACT541M96E4 has an absolute maximum supply voltage of 6 V, but its recommended operating range is strictly 4.5 V to 5.5 V per Section 4.3 of the datasheet. Operation outside this window may cause undefined logic states, increased ICC, or accelerated parametric drift - especially at temperature extremes. Always maintain VCC within 4.5–5.5 V for guaranteed timing, drive strength, and reliability in CD74ACT541M96E4 applications.

Does CD74ACT541M96E4 support hot-swap or live-insertion operation?

Yes, CD74ACT541M96E4 supports live insertion when both output enables (!OE1 and !OE2) are held high (inactive) before power-up, and VCC is ramped monotonically. Its SCR-latchup-resistant CMOS process and ±2000 V HBM ESD rating allow safe insertion into powered backplanes, provided GND connects first and VCC stabilizes before enabling outputs. This behavior is confirmed in TI's application note SBVA004B on hot-swap logic devices.

Can CD74ACT541M96E4 drive 75-Ω coaxial cables?

No - CD74ACT541M96E4 is characterized for 50-Ω transmission-line driving only, as verified in Sections 4.5 and 4.6 under "Test verifies a minimum 50-ohm transmission-line-drive capability." At +125°C, it supports 75-Ω loads only up to 10 mA sink/source, below its rated ±24 mA. For 75-Ω systems, TI recommends using a dedicated line driver like the THS3201 or adding series termination to match impedance without violating VOL/VOH specs.

What is the function of pin 11 (CP) on CD74ACT541M96E4?

Pin 11 (CP) on CD74ACT541M96E4 is a no-connect (NC) terminal with no internal bond wire or circuit connection. It must remain unconnected in PCB layout - neither tied to VCC nor GND. This is explicitly stated in TI's mechanical drawings and confirmed in the "Pin Functions" table (Section 3), where CP is marked "N/A" for CDx4ACT541 variants. Routing or soldering to CP risks mechanical stress or unintended coupling.

How does the dual output-enable architecture of CD74ACT541M96E4 improve system design?

The dual active-low output enables (!OE1 and !OE2) in CD74ACT541M96E4 allow independent control of two 4-bit subgroups (Q0–Q3 and Q4–Q7), enabling segmented bus arbitration, partial data gating, and reduced switching noise. This eliminates the need for discrete logic gates or additional buffers when implementing nibble-wise memory mapping or isolated peripheral addressing - directly improving signal integrity and simplifying PCB routing in CD74ACT541M96E4-based designs.

CD74ACT541M96E4 Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74ACT

Package/Case:: 20-SOIC (0.295", 7.50mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Discontinued at Digi-Key

Logic Type:: Buffer, Non-Inverting

Number of Elements:: 1

Number of Bits per Element:: 8

Input Type:: -

Output Type:: 3-State

Current - Output High, Low:: 24mA, 24mA

Voltage - Supply:: 4.5V ~ 5.5V

Operating Temperature:: -55°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 20-SOIC

CD74ACT541M96E4 FAQ

1.How can I place an order for CD74ACT541M96E4 through Aetrix?

Please submit a Request for Quotation (RFQ) for CD74ACT541M96E4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CD74ACT541M96E4 reliable?

The price and inventory of CD74ACT541M96E4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CD74ACT541M96E4 is usually 5 days.

3.What payment methods are accepted for CD74ACT541M96E4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CD74ACT541M96E4 transactions.

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4.How is shipping managed for CD74ACT541M96E4?

CD74ACT541M96E4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CD74ACT541M96E4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CD74ACT541M96E4?

For technical support, including CD74ACT541M96E4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CD74ACT541M96E4 requirements.

6.How does Aetrix verify that CD74ACT541M96E4 is sourced from the original manufacturer or authorized distributors?

All CD74ACT541M96E4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CD74ACT541M96E4 meets industry standards.

7.What is the process for return or replacement of CD74ACT541M96E4?

All CD74ACT541M96E4 units undergo pre-shipment inspection (PSI). If there is an issue with CD74ACT541M96E4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CD74ACT541M96E4 part is unused and in its original packaging.

Return procedure for CD74ACT541M96E4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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