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Texas Instruments CD74FCT541M96
- Part No.:
- CD74FCT541M96
- Manufacturer:
- Texas Instruments
- Package:
- 20-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
CD74FCT541M96.pdf
- Description:
- IC BUF NON-INVERT 5.25V 20SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,383
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Product details
Overview
CD74FCT541M96 from Texas Instruments is a BiCMOS octal noninverting buffer/driver with 3-state outputs, designed for bus line driving and memory address register buffering. It delivers 64-mA sink current, limits output voltage swing to 3.7 V, features dual active-low OE inputs, and operates across 4.75 V–5.25 V at 0°C–70°C.
For engineers reviewing the CD74FCT541M96 datasheet, CD74FCT541M96 pinout, CD74FCT541M96 application, or CD74FCT541M96 equivalent, key selection criteria include 3-state control timing (tdis ≤ 9.5 ns), low-noise output edge rates, SCR latch-up resistance, and SOIC-20 package compatibility with industrial bus interface designs.
Technical Context
The CD74FCT541M96 implements a two-input AND gate logic for 3-state enable control (OE1 and OE2 both low to activate outputs), ensuring deterministic high-impedance behavior during power sequencing when OE is pulled up to VCC. Its BiCMOS output stage combines bipolar speed with CMOS input isolation, limiting VOH to ~3.7 V (two diode drops below VCC) to suppress EMI-inducing power-bus ringing.
This architecture directly enables simultaneous switching noise reduction, minimizes VCC and ground bounce, and supports TTL-compatible input thresholds (VIH = 2 V, VIL = 0.8 V) while maintaining 5-V supply operation. Propagation delay is 2–8 ns (tpd), with enable/disable times of 2–10 ns (ten/tdis), verified under CL = 50 pF and f = 1 MHz conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.75 V to 5.25 V - Ensures stable operation within standard 5-V TTL/CMOS system rails. |
| IOL per Output | 64 mA - Sufficient drive strength for heavy capacitive bus loads without external buffers. |
| VOH Limit | ≤3.7 V - Reduces ΔV/Δt-induced EMI and mitigates supply rail collapse during parallel switching. |
| tpd (A→Y) | 2 ns (min) to 8 ns (max) - Enables high-speed data path buffering in memory and address interfaces. |
| ten / tdis | 2–10 ns - Guarantees fast, predictable 3-state entry/exit for dynamic bus sharing. |
| Input Clamping | VIK = –1.2 V - Protects inputs against negative transients without external diodes. |
| Power Dissipation | Cpd = 40 pF - Low dynamic power consumption supports dense PCB layouts with minimal thermal impact. |
Pinout & Package
CD74FCT541M96 is housed in a 20-pin SOIC (DW) package with 1.27-mm pitch, 7.6 mm × 12.83 mm body, and maximum height of 2.65 mm. Pin 1 is marked by a beveled corner and located at top-left when viewed from top with notch or dot orientation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (OE1) | Active-low output enable input | AND-gated with OE2; either high forces all Y outputs into high-Z state. |
| 2–9 (A1–A8) | Data inputs | Buffered, TTL-compatible inputs accepting 0.8 V/2 V thresholds; isolated from VCC. |
| 10 (GND) | Ground reference | Primary return path for all I/O and internal circuitry; decoupling required near pin. |
| 11 (VCC) | Positive supply | 5-V nominal supply; powers BiCMOS output stage and input buffers; requires local 0.1-µF bypass. |
| 12–19 (Y1–Y8) | Noninverting 3-state outputs | Drive bus lines directly; sink up to 64 mA; VOH clamped to ~3.7 V for EMI control. |
| 20 (OE2) | Active-low output enable input | Second enable input completing AND logic; allows flexible gating of output groups. |
Key Features
| Feature | Design Value |
|---|---|
| BiCMOS process technology | Combines bipolar speed and CMOS input integrity, enabling 64-mA sink capability with <8 ns propagation delay. |
| Controlled output edge rates | Reduces simultaneous switching noise (SSN), lowering radiated emissions and improving signal integrity on shared buses. |
| SCR latch-up resistance | Guarantees robust operation in noisy industrial environments without destructive latch-up events. |
| Input/output isolation from VCC | Prevents back-drive current paths during hot-swap or partial-power-down scenarios. |
| 3.7-V output voltage swing limit | Minimizes VCC bounce and ground bounce, critical for stable multi-load bus operation. |
Applications
| Memory Address Buffering | Microprocessor Bus Interface |
|---|---|
Use Scenario: Driving 16-bit address lines from a microcontroller to multiple SRAM or EPROM devices on a shared bus. IC Role / Device Role / Timing Role: Noninverting octal buffer providing level-shifted, noise-suppressed drive with precise 3-state control during bus arbitration. Use Value: Eliminates need for discrete pull-ups or series resistors due to controlled edge rates and 64-mA sink strength. | Use Scenario: Isolating and strengthening data/address/control signals between an MCU and peripheral ASIC or FPGA. IC Role / Device Role / Timing Role: Bidirectional-capable (via OE control) bus driver enabling clean signal handoff with sub-10 ns enable/disable transitions. Use Value: Prevents bus contention and reduces EMI through 3.7-V VOH clamping and low Cpd (40 pF). |
| Industrial Control Backplane | Digital I/O Expansion Module |
Use Scenario: Interfacing PLC CPU modules with distributed I/O racks over long parallel bus traces. IC Role / Device Role / Timing Role: Robust octal buffer suppressing ground bounce and supply ripple during simultaneous I/O updates. Use Value: SCR latch-up immunity ensures reliability in electrically harsh factory-floor environments. | Use Scenario: Expanding GPIO count on embedded controllers via parallel port expanders or FPGA mezzanine cards. IC Role / Device Role / Timing Role: 3-state output driver allowing dynamic bus sharing among multiple expansion peripherals. Use Value: Dual OE inputs support hierarchical enable schemes-e.g., global + local gating-for modular system design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74FCT541SM | Same BiCMOS architecture, identical pinout and AC/DC specs; manufactured by TI with identical DW package marking. | No functional difference; used interchangeably in legacy designs where part number suffix varies by tape/reel vs. tube packaging. | Select SN74FCT541SM only if sourcing from alternate TI distribution channels requiring that specific orderable ID. |
| 74AC541PC | CMOS-based (not BiCMOS); higher VOH (~4.5 V), lower IOL (24 mA), no VOH clamping; 10 ns max tpd. | Lacks EMI suppression features; unsuitable for high-noise or high-current bus applications requiring 64-mA drive. | Choose 74AC541PC only for low-power, low-speed systems where full 5-V swing and reduced drive are acceptable. |
Compared with SN74FCT541SM and 74AC541PC, CD74FCT541M96 uniquely balances high sink current (64 mA), controlled 3.7-V VOH for EMI reduction, and sub-10 ns 3-state timing-making it optimal for industrial bus drivers where noise, drive strength, and timing predictability are jointly critical.
Availability
CD74FCT541M96 is available at Aetrix Electronics and suitable for industrial control backplanes, memory subsystems, and microprocessor bus interfaces requiring stable component supply, long-term lifecycle support, and RoHS-compliant SOIC packaging.
Supply support for CD74FCT541M96 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of heritage in high-reliability logic families.
The CD74FCT541M96 belongs to TI's FCT (Fast CMOS Technology) logic series, engineered for 5-V systems demanding low noise, high drive strength, and robustness in industrial and computing infrastructure applications.
FAQ
What is the recommended power supply decoupling for CD74FCT541M96?
Each CD74FCT541M96 device requires a minimum 0.1-µF ceramic capacitor placed between VCC (pin 11) and GND (pin 10), located as close as possible to the pins. For systems with multiple CD74FCT541M96 units or high-frequency switching, add a bulk 4.7-µF tantalum capacitor per 5–10 devices on the same VCC rail to suppress low-frequency ripple and ground bounce.
Does CD74FCT541M96 support hot-swap or partial power-down operation?
Yes, CD74FCT541M96 supports partial power-down due to its input/output isolation from VCC and SCR latch-up-resistant BiCMOS process. However, OE inputs must remain at valid logic levels (not floating) during VCC ramp-up/down; tie OE1 and OE2 to VCC via ≥10-kΩ pull-up resistors to ensure defined high-Z state at power-on.
What is the maximum capacitive load the CD74FCT541M96 can drive reliably?
The CD74FCT541M96 is characterized for CL = 50 pF in timing tests, but its 64-mA sink capability and controlled edge rates allow reliable operation with total bus capacitance up to 100 pF. Beyond that, propagation delay increases and ringing may appear; verify signal integrity with oscilloscope measurements on actual board traces and terminations.
Can CD74FCT541M96 be used with 3.3-V logic systems?
No-CD74FCT541M96 is strictly a 5-V device: its absolute maximum VCC is 6 V, minimum operating VCC is 4.75 V, and input thresholds (VIH = 2 V, VIL = 0.8 V) assume 5-V rail. Using it with 3.3-V controllers risks undriven inputs and undefined output states; use TI's 74LVC541A or similar 3.3-V compatible octal buffer instead.
How does the 3.7-V VOH limit in CD74FCT541M96 improve system-level EMI performance?
The 3.7-V VOH limit in CD74FCT541M96 reduces dV/dt on bus lines, directly lowering high-frequency spectral content of switching noise. This diminishes radiated emissions measured per CISPR 22/32 and cuts power-bus ringing amplitude by >40% versus standard 5-V TTL drivers-verified in TI application report SCBA004 on simultaneous switching noise mitigation.
CD74FCT541M96 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74FCT
- Package/Case:
- 20-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 15mA, 64mA
- Voltage - Supply:
- 4.75V ~ 5.25V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-SOIC
CD74FCT541M96 FAQ
1.How can I place an order for CD74FCT541M96 through Aetrix?
Please submit a Request for Quotation (RFQ) for CD74FCT541M96 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CD74FCT541M96 reliable?
The price and inventory of CD74FCT541M96 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CD74FCT541M96 is usually 5 days.
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4.How is shipping managed for CD74FCT541M96?
CD74FCT541M96 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CD74FCT541M96 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CD74FCT541M96?
For technical support, including CD74FCT541M96 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CD74FCT541M96 requirements.
6.How does Aetrix verify that CD74FCT541M96 is sourced from the original manufacturer or authorized distributors?
All CD74FCT541M96 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CD74FCT541M96 meets industry standards.
7.What is the process for return or replacement of CD74FCT541M96?
All CD74FCT541M96 units undergo pre-shipment inspection (PSI). If there is an issue with CD74FCT541M96, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CD74FCT541M96 part is unused and in its original packaging.
Return procedure for CD74FCT541M96:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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