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Texas Instruments CD74HC125QPWRQ1
- Part No.:
- CD74HC125QPWRQ1
- Manufacturer:
- Texas Instruments
- Package:
- 14-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
CD74HC125QPWRQ1.pdf
- Description:
- IC BUFFER NON-INVERT 6V 14TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,747
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Product details
Overview
CD74HC125QPWRQ1 from Texas Instruments is an AEC-Q100 Grade 1 automotive-qualified quadruple non-inverting buffer with 3-state outputs, operating from 2 V to 6 V supply, delivering 6 mA output drive at 4.5 V, and supporting –40°C to +125°C ambient temperature - used for bus isolation and signal enable control in engine control units and ADAS domain controllers.
For engineers reviewing the CD74HC125QPWRQ1 datasheet, CD74HC125QPWRQ1 pinout, CD74HC125QPWRQ1 application, or CD74HC125QPWRQ1 equivalent, key selection considerations include 3-state timing (enable/disable propagation delays), rail-to-rail CMOS input compatibility, thermal resistance (151.7°C/W for TSSOP), leakage current limits (±1 µA max), and automotive-grade ESD robustness (HBM ±2000 V).
Technical Context
This device implements four independent positive-logic buffers (Y = A) with active-low 3-state enable inputs per channel. Each output supports bidirectional current sourcing/sinking up to ±6 mA at 4.5 V while maintaining VOH ≥ 3.98 V and VOL ≤ 0.26 V under load.
It features standard CMOS inputs with 10 pF input capacitance, balanced 3-state outputs with 20 pF off-state capacitance, and integrated clamp diodes on all I/O pins for transient protection - all compliant with AEC-Q100 Grade 1 requirements for automotive under-hood environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 2 V to 6 V - enables direct interface with 3.3 V and 5 V logic domains without level shifters |
| Output Drive (IOH/IOL) | ±6 mA at 4.5 V - sufficient to drive 10 LSTTL loads or moderate capacitive buses (≤70 pF) |
| Propagation Delay (tpd) | 17 ns max at 6 V, CL = 50 pF - ensures timing predictability in high-speed digital control paths |
| Enable/Disable Time | 21 ns max at 6 V, CL = 50 pF - critical for glitch-free bus arbitration and hot-swap signal gating |
| Input Leakage Current | ±1 µA max at 6 V - minimizes power loss in always-on automotive subsystems |
| ESD Rating (HBM) | ±2000 V - meets AEC-Q100-002 for robustness against handling and system-level transients |
| Operating Temperature | –40°C to +125°C TA - qualified for engine bay, transmission, and ADAS sensor module placement |
Pinout & Package
TSSOP-14 package (5.00 mm × 4.40 mm body size, 1.27 mm pitch), 1.75 mm max height, moisture sensitivity level 1 (260°C peak reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE | Active-low output enable (per channel) | Drives corresponding Y output to high-impedance state when HIGH; enables buffer pass-through when LOW |
| 1A, 2A, 3A, 4A | Buffer input (per channel) | CMOS-compatible input accepting 0–VCC logic levels; 10 pF capacitance affects trace routing length |
| 1Y, 2Y, 3Y, 4Y | Buffered 3-state output (per channel) | Sources/sinks up to ±6 mA; presents 20 pF off-state capacitance during disable; requires no pull resistors unless bus termination needed |
| VCC | Positive supply | Must be decoupled with 0.1 µF ceramic capacitor placed adjacent to pin; supports 2–6 V operation |
| GND | Ground reference | Return path for all I/O and supply currents; shared with PCB ground plane for thermal and noise control |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Grade 1 qualification | Validated for continuous operation from –40°C to +125°C ambient - suitable for powertrain and chassis ECUs |
| Balanced 3-state CMOS outputs | Sinks and sources matched current (±6 mA at 4.5 V), minimizing bus skew and enabling bidirectional data flow control |
| Clamp diode protection | Integrated positive/negative clamping diodes on all I/O pins - suppresses transients up to ±20 mA without external TVS |
| Low static power consumption | ICC ≤ 160 µA max at 6 V - reduces quiescent current in always-on vehicle networks (e.g., CAN wake-up circuits) |
| Rail-to-rail input voltage range | VI = 0 to VCC - accepts direct connection to microcontroller GPIOs and analog comparators without level translation |
Applications
| Engine Control Unit (ECU) Signal Isolation | ADAS Camera Interface Buffering |
|---|---|
Use Scenario: Isolating diagnostic communication lines between MCU and OBD-II transceiver during firmware updates. IC Role / Device Role / Timing Role: Quad buffer gates selectively enable/disable UART/ISO 9141 signals using independent OE controls to prevent bus contention. Use Value: Prevents signal corruption during concurrent flash programming and real-time sensor polling by ensuring only one driver is active per bus segment. |
Use Scenario: Conditioning parallel LVDS or CMOS image sensor data lanes before FPGA capture. IC Role / Device Role / Timing Role: Buffers sensor pixel clock and data strobes with matched propagation delay (<26 ns) to maintain inter-lane skew <1 ns. Use Value: Eliminates timing jitter-induced pixel misalignment in 12 MP+ automotive camera modules operating at 60 fps. |
| Body Control Module (BCM) I/O Expansion | Infotainment System Bus Arbitration |
Use Scenario: Extending GPIO count of a low-pin-count MCU to drive multiple LED drivers and relay coils. IC Role / Device Role / Timing Role: Acts as level-shifting, current-boosting interface between 3.3 V MCU outputs and 5 V/12 V peripheral control lines. Use Value: Enables single-chip MCU to manage 16+ discrete loads without external MOSFETs or optocouplers - reducing BOM cost and board area. |
Use Scenario: Managing shared SPI bus access among infotainment head unit, telematics modem, and audio DSP. IC Role / Device Role / Timing Role: Four 3-state buffers isolate each master's MISO/MOSI lines, with OE controlled by arbitration logic. Use Value: Guarantees zero bus contention during simultaneous SPI transfers, eliminating data corruption and retry overhead in multi-master systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buffer-with-3-state-output applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC125APWR | Lower VCC range (1.65–5.5 V); higher speed (tpd = 3.7 ns @ 3.3 V); non-automotive grade | Not AEC-Q100 qualified; unsuitable for under-hood use; better for infotainment baseband logic | Select when operating at 3.3 V only and automotive qualification is unnecessary |
| MC74HC125ADTR2G | Same HC logic family; SOIC-14 package; identical electrical specs; AEC-Q100 Grade 1 certified | SOIC footprint requires larger PCB area; higher thermal resistance (133.6°C/W vs. 151.7°C/W) | Choose for legacy SOIC assembly lines or where TSSOP reflow capability is unavailable |
Compared with SN74LVC125APWR and MC74HC125ADTR2G, the CD74HC125QPWRQ1 uniquely combines AEC-Q100 Grade 1 compliance, TSSOP-14 compactness, and full 2–6 V operation - making it optimal for space-constrained, high-temperature automotive control nodes requiring mixed-voltage interoperability.
Availability
CD74HC125QPWRQ1 is available at Aetrix Electronics and suitable for engine control units, ADAS camera interfaces, body control modules, and infotainment bus arbitration systems requiring stable component supply across extended automotive product lifecycles.
Supply support for CD74HC125QPWRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and automotive ICs, with over 50 years of leadership in high-reliability logic and interface solutions.
The CD74HC125QPWRQ1 belongs to TI's automotive HC logic family, designed specifically for robust signal buffering and bus isolation in harsh-temperature vehicle subsystems where long-term reliability and AEC-Q100 compliance are mandatory.
FAQ
What is the maximum capacitive load the CD74HC125QPWRQ1 can drive while meeting datasheet timing specifications?
The CD74HC125QPWRQ1 is specified for CL = 50 pF in switching characteristics tables; performance remains within spec up to 70 pF. Exceeding 70 pF risks violating tpd, ten, and tdis limits - especially at 2 V supply. For >70 pF loads, add a series resistor to limit output current per Absolute Maximum Ratings. The CD74HC125QPWRQ1 datasheet explicitly recommends this approach in Section 8.3.1.
Does the CD74HC125QPWRQ1 support mixed-voltage operation - for example, 3.3 V inputs driving a 5 V-powered CD74HC125QPWRQ1?
Yes. The CD74HC125QPWRQ1 accepts VI = 0 to VCC, so 3.3 V logic inputs are fully compatible when VCC = 5 V. Input thresholds scale with VCC (VIH = 3.15 V min at 4.5 V), ensuring reliable recognition. Output VOH will be ~4.4 V, compatible with 5 V TTL/CMOS receivers. This makes the CD74HC125QPWRQ1 ideal for bridging 3.3 V microcontrollers to 5 V peripherals in automotive gateways.
How should unused inputs and outputs be handled on the CD74HC125QPWRQ1 in an automotive design?
Unused inputs must be tied to VCC or GND - never left floating - to prevent undefined states and excessive current draw. A 10-kΩ pull-up/down is recommended if dynamic control is needed later. Unused outputs may be left floating, but TI advises against connecting them directly to VCC or GND. These guidelines are specified in Section 9.2.1.2 and 9.2.1.3 of the CD74HC125QPWRQ1 datasheet for AEC-Q100 reliability.
What is the thermal performance difference between the CD74HC125QPWRQ1 (TSSOP) and its SOIC counterpart?
The CD74HC125QPWRQ1 in TSSOP has RθJA = 151.7°C/W, versus 133.6°C/W for the SOIC version. Though the SOIC package dissipates heat slightly better in still air, the TSSOP's smaller footprint (5.0 × 4.4 mm vs. 8.7 × 3.9 mm) improves board density and reduces trace inductance. Both meet AEC-Q100 Grade 1 thermal requirements when mounted on 2 oz copper with thermal vias - confirmed in TI's SCLS579B Thermal Information section.
Is the CD74HC125QPWRQ1 pin-compatible with non-automotive versions like CD74HC125M96?
Yes - the CD74HC125QPWRQ1 shares identical pinout, electrical behavior, and functional truth table with commercial CD74HC125 variants. Differences are limited to qualification (AEC-Q100 Grade 1), screening, and packaging markings. No PCB redesign is needed when upgrading from CD74HC125M96 to CD74HC125QPWRQ1 in automotive applications requiring extended temperature and reliability validation.
CD74HC125QPWRQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74HC
- Package/Case:
- 14-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 7.8mA, 7.8mA
- Voltage - Supply:
- 2V ~ 6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-TSSOP
CD74HC125QPWRQ1 FAQ
1.How can I place an order for CD74HC125QPWRQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CD74HC125QPWRQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CD74HC125QPWRQ1 reliable?
The price and inventory of CD74HC125QPWRQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CD74HC125QPWRQ1 is usually 5 days.
3.What payment methods are accepted for CD74HC125QPWRQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CD74HC125QPWRQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CD74HC125QPWRQ1?
CD74HC125QPWRQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CD74HC125QPWRQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CD74HC125QPWRQ1?
For technical support, including CD74HC125QPWRQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CD74HC125QPWRQ1 requirements.
6.How does Aetrix verify that CD74HC125QPWRQ1 is sourced from the original manufacturer or authorized distributors?
All CD74HC125QPWRQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CD74HC125QPWRQ1 meets industry standards.
7.What is the process for return or replacement of CD74HC125QPWRQ1?
All CD74HC125QPWRQ1 units undergo pre-shipment inspection (PSI). If there is an issue with CD74HC125QPWRQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CD74HC125QPWRQ1 part is unused and in its original packaging.
Return procedure for CD74HC125QPWRQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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