Texas Instruments CD74HCT367MG4

Overview

CD74HCT367MG4 from Texas Instruments is a high-speed CMOS hex non-inverting three-state buffer with two independent output-enable controls (OE1 for Y1–Y4, OE2 for Y5–Y6), 4.5V–5.5V supply operation, 8ns typical propagation delay at 5V/15pF, and ±35mA bus-driver output current. It serves as a bidirectional data bus interface in industrial control backplanes requiring robust temperature range and LSTTL-compatible inputs.

For engineers reviewing the CD74HCT367MG4 datasheet, CD74HCT367MG4 pinout, CD74HCT367MG4 application, or CD74HCT367MG4 equivalent, key selection factors include its dual enable architecture, -55°C to +125°C operating range, HCT-level input thresholds (VIL ≤ 0.8V, VIH ≥ 2.0V), and SOIC-16 package compatibility with legacy LS logic layouts.

Technical Context

The CD74HCT367MG4 implements six independent non-inverting buffer channels, each with high-current CMOS outputs capable of driving up to 15 LSTTL loads. Its dual three-state enable structure (OE1 controlling four outputs, OE2 controlling two) enables selective bus segmentation without external gating logic.

It operates strictly within the 4.5V–5.5V VCC range and features LSTTL-compatible input voltage thresholds-ensuring direct interfacing with 74LS-series devices-while maintaining CMOS-level quiescent current (≤160µA over full temperature range) and low input leakage (±1µA).

Key Specifications

Pinout & Package

CD74HCT367MG4 is housed in a 16-pin SOIC (Small Outline Integrated Circuit) package with 1.27mm pitch, JEDEC MS-012AC compliant, moisture sensitivity level 1 (unlimited floor life at <30°C/60% RH), and RoHS-compliant NiPdAu lead finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex non-inverting three-state buffer applications.

Compared with SN74HCT367N, CD74HCT367MG4 offers superior thermal performance in surface-mount assemblies and smaller PCB footprint; versus 74ACT367PC, it provides guaranteed LSTTL input compatibility and lower dynamic power at the expense of peak speed-making it optimal for robustness-critical industrial deployments.

Availability

CD74HCT367MG4 is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive ECU I/O expansion, aerospace data concentrators, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CD74HCT367MG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of heritage in high-reliability logic families including the 74HCT series.

The CD74HCT367MG4 belongs to TI's industry-standard 74HCT logic family, designed specifically to provide pin- and function-compatible CMOS alternatives to legacy 74LS devices-enabling power-efficient upgrades without redesigning PCB layouts or firmware.

FAQ

What is the maximum clock frequency supported by CD74HCT367MG4 in a bus-driving application?

The CD74HCT367MG4 does not operate as a clocked device but as a combinatorial buffer. Its usable data rate depends on propagation delay and load. With 9ns typical tPLH/tPHL at 15pF, it supports clean signal edges up to ~50MHz in well-terminated 50Ω systems. For 100pF bus loads, delay increases to ~26ns, limiting practical throughput to ~20MHz without waveform degradation. Always verify timing against actual CL and routing in CD74HCT367MG4 designs.

Does CD74HCT367MG4 require external pull-up or pull-down resistors on its enable pins?

No, CD74HCT367MG4 OE1 and OE2 inputs have CMOS-compatible input structure with ≤1µA leakage, so they do not require external biasing. However, to prevent undefined states during power-up or reset, TI recommends tying OE1 and OE2 to VCC via 10kΩ resistors if driven by open-drain or high-impedance sources. This ensures outputs remain in high-Z until firmware asserts valid enable logic-critical for avoiding bus conflicts in CD74HCT367MG4-based systems.

Can CD74HCT367MG4 be used with a 3.3V microcontroller interface?

No-CD74HCT367MG4 requires 4.5V–5.5V VCC and has LSTTL-compatible input thresholds (VIH ≥ 2.0V, VIL ≤ 0.8V), but its inputs are not 3.3V-tolerant. Driving OE or A inputs directly from a 3.3V MCU violates the minimum VIH spec (2.0V) margin and risks unreliable logic detection. Use a level translator such as TXB0108 or discrete resistor divider before connecting 3.3V signals to CD74HCT367MG4 inputs.

What is the thermal resistance (θJA) of the CD74HCT367MG4 SOIC package, and how does it affect power dissipation?

The CD74HCT367MG4 in SOIC-16 package has θJA = 73°C/W (typical). At 5V and 10MHz toggle rate with 50pF load per output, total dynamic power is ~25mW. With θJA = 73°C/W, junction temperature rise is ~1.8°C above ambient-well within safe limits. However, under worst-case static conditions (all outputs sourcing 35mA), power can reach 175mW, causing ~12.8°C rise. Adequate copper pour and airflow are recommended for sustained high-drive CD74HCT367MG4 operation.

Is CD74HCT367MG4 pin-compatible with the older 74LS367 device?

Yes-CD74HCT367MG4 is functionally and pin-compatible with 74LS367, sharing identical pinout (SOIC-16), input thresholds, and three-state behavior. However, CD74HCT367MG4 draws significantly less quiescent current (<160µA vs. ~25mA for 74LS367) and offers improved noise immunity (30% noise margin). No PCB changes are needed when replacing 74LS367 with CD74HCT367MG4, making it a direct drop-in upgrade for power-sensitive CD74HCT367MG4 retrofits.