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Texas Instruments CD74HCT368M

Part No.:
CD74HCT368M
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
16-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixCD74HCT368M.pdf
Description:
IC BUFFER INVERT 5.5V 16SOIC
Quantity:
Payment:
Payment
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Product details

Overview

CD74HCT368M from Texas Instruments is a high-speed CMOS hex inverting buffer/line driver with three-state outputs, designed for bus interface applications requiring 5 V LSTTL-compatible logic levels, ±4 mA output drive, and operation across –55°C to 125°C. It features dual independent three-state enables (OE1 controls four channels; OE2 controls two), 11 ns typical propagation delay at VCC = 5 V and CL = 15 pF, and supports high-fanout bus driving up to 15 LSTTL loads.

For engineers reviewing the CD74HCT368M datasheet, CD74HCT368M pinout, CD74HCT368M application, or CD74HCT368M equivalent, this device is selected for robust 5 V digital bus buffering where level-shifting compatibility, wide temperature resilience, and controlled output enable sequencing are critical - especially in industrial control backplanes and legacy TTL-interfaced instrumentation.

Technical Context

The CD74HCT368M implements six independent inverting buffer stages, each with high-current CMOS output drivers capable of sourcing/sinking ±4 mA at VOH/VOL specifications. Its HCT logic family ensures direct compatibility with standard LS-TTL inputs (VIH ≥ 2.0 V, VIL ≤ 0.8 V) while maintaining CMOS power efficiency (ICC ≤ 160 μA over full temperature range).

Two separate three-state enable inputs (1OE on Pin 1, 2OE on Pin 15) provide granular bus control: OE1 governs Y1–Y4 outputs (Pins 3, 5, 7, 10), and OE2 governs Y5–Y6 (Pins 11, 13). This architecture enables partial bus isolation without disabling all channels simultaneously - essential for multi-master arbitration and hot-swap signaling paths.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 4.5 V to 5.5 V - Ensures stable operation within regulated 5 V supply rails; rejects ±5% tolerance without logic degradation.
tpd (Typ) 11 ns at VCC = 5 V, CL = 15 pF - Enables >30 MHz bus toggle rates in point-to-point configurations with low capacitive loading.
IOL / IOH ±4 mA - Drives 15 LSTTL inputs directly; eliminates need for external bus transceivers in medium-density systems.
VIH / VIL 2.0 V (min) / 0.8 V (max) - Guarantees unambiguous recognition of standard TTL logic levels without level-shifting circuitry.
Operating Temp –55°C to +125°C - Qualified for extended-temperature industrial, automotive under-hood, and military-grade embedded control.
IOZ (Max) ±10 μA - Maintains high-impedance integrity during three-state mode, preventing bus contention leakage in multi-driver topologies.
Power Dissipation CPD = 42 pF - Predictable dynamic power consumption; enables accurate thermal modeling for dense PCB layouts.

Pinout & Package

CD74HCT368M is supplied in a 16-pin SOIC (D) package with nominal body size 9.90 mm × 3.90 mm and standard JEDEC MS-012AC footprint.

Pin/Terminal Circuit Role Design Meaning
1 (1OE) Output Enable 1 Active-low enable for Y1–Y4 (Pins 3,5,7,10); asserts high-impedance when high - used for group bus isolation.
2 (1A1) Input A1 Inverting input for first buffer channel; drives Y1 (Pin 3) with true inversion logic relationship.
3 (1Y1) Output Y1 Inverted output of A1; three-state when 1OE = high; sinks/sources ±4 mA per spec.
4 (1A2) Input A2 Inverting input for second buffer channel; drives Y2 (Pin 5).
5 (1Y2) Output Y2 Inverted output of A2; shares 1OE control with Y1, Y3, Y4.
6 (1A3) Input A3 Inverting input for third buffer channel; drives Y3 (Pin 7).
7 (1Y3) Output Y3 Inverted output of A3; part of first four-channel group enabled by 1OE.
8 (GND) Ground Reference return path for all logic and output currents; requires local 0.1 μF bypass capacitor.
9 (1A4) Input A4 Inverting input for fourth buffer channel; drives Y4 (Pin 10).
10 (1Y4) Output Y4 Inverted output of A4; completes first four-channel group under 1OE control.
11 (2Y1) Output Y5 Inverted output of A5 (Pin 12); three-state controlled exclusively by 2OE (Pin 15).
12 (2A1) Input A5 Inverting input for fifth buffer channel; drives Y5 (Pin 11).
13 (2Y2) Output Y6 Inverted output of A6 (Pin 14); second channel in dual-channel group enabled by 2OE.
14 (2A2) Input A6 Inverting input for sixth buffer channel; drives Y6 (Pin 13).
15 (2OE) Output Enable 2 Active-low enable for Y5–Y6 only; allows independent gating of final two bus lines.
16 (VCC) Supply Voltage +5 V power rail; must be decoupled locally with 0.1 μF ceramic capacitor to suppress switching noise.

Key Features

Feature Design Value
Dual independent three-state enables Enables selective bus partitioning: 1OE isolates four lines (Y1–Y4), 2OE isolates two (Y5–Y6), supporting flexible arbitration schemes.
LSTTL-compatible input thresholds VIH ≥ 2.0 V and VIL ≤ 0.8 V at VCC = 5 V ensure reliable interfacing with legacy 74LS-series logic without pull-up/pull-down resistors.
High-output current drive (±4 mA) Directly drives 15 LSTTL loads per output, eliminating need for discrete buffer amplifiers in moderate-capacitance bus designs.
Wide temperature operation (–55°C to 125°C) Validated performance across extended industrial/military temperature ranges - suitable for engine control units and avionics subsystems.
Low dynamic power (CPD = 42 pF) Reduces switching-related heat generation in high-density logic arrays; simplifies thermal management in sealed enclosures.

Applications

Industrial PLC Backplane Interface Automotive ECU Diagnostic Bus

Use Scenario: Isolating and buffering address/data lines between microcontroller and modular I/O cards in programmable logic controllers.

IC Role / Device Role / Timing Role: Inverting three-state buffer providing direction-controlled data flow and bus contention prevention during card hot-swap events.

Use Value: Dual OE pins allow staggered enable timing to avoid simultaneous bus transitions; ±4 mA drive sustains signal integrity across 15 cm backplane traces.

Use Scenario: Interfacing OBD-II diagnostic controller with legacy sensor modules using 5 V TTL-level communication protocols.

IC Role / Device Role / Timing Role: Level-translating inverting buffer ensuring LS-TTL-compatible voltage thresholds while enabling/disabling diagnostic bus segments.

Use Value: –55°C to 125°C rating supports under-hood deployment; 11 ns tpd meets ISO 15765-4 timing constraints for CAN diagnostics.

Military Data Acquisition System Test Equipment Signal Conditioning

Use Scenario: Routing analog-to-digital converter outputs through configurable digital bus switches in ruggedized field-deployable DAQ units.

IC Role / Device Role / Timing Role: Hex inverting buffer with independent OE control enabling time-multiplexed sampling channel selection and isolation.

Use Value: High-impedance leakage < ±10 μA prevents crosstalk between inactive ADC channels; extended temp range ensures reliability in desert/arctic environments.

Use Scenario: Driving multiple DUT (device-under-test) inputs from a single pattern generator output in automated test equipment.

IC Role / Device Role / Timing Role: Fanout buffer replicating and inverting stimulus signals while maintaining precise edge timing across parallel test vectors.

Use Value: 11 ns propagation delay matching ensures sub-ns skew between replicated signals; SOIC package supports high-density ATE board layouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex inverting buffer applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74HCT368N Same logic function, pinout, and electrical specs; PDIP package (16-pin N) instead of SOIC (D); higher thermal resistance (RθJA = 67°C/W vs. 73°C/W). Preferred for prototyping or through-hole assembly; unsuitable for space-constrained surface-mount production. Select SN74HCT368N when manual soldering or breadboard evaluation is required; verify PCB pad layout matches PDIP footprint.
CD74HCT368E Identical functional spec and SOIC pinout; differs only in packaging format - PDIP (N) body (19.31 mm × 6.35 mm) and tube packaging vs. tape-and-reel SOIC. Used in legacy manufacturing lines with through-hole reflow or hand-soldered repair scenarios; lacks SOIC's automated placement compatibility. Choose CD74HCT368E for backward compatibility with existing PDIP-based designs or where RoHS exemption applies.

Compared with SN74HCT368N and CD74HCT368E, CD74HCT368M offers optimized surface-mount manufacturability via SOIC-D tape-and-reel delivery, lower profile (1.75 mm max height), and tighter thermal coupling for thermally sensitive mixed-signal boards - making it the preferred choice for modern high-volume SMT production.

Availability

CD74HCT368M is available at Aetrix Electronics and suitable for industrial control backplanes, automotive diagnostic interfaces, military data acquisition systems, and automated test equipment requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for CD74HCT368M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.

CD74HCT368M belongs to TI's legacy high-speed CMOS logic portfolio, engineered specifically for robust 5 V bus interfacing in harsh-environment systems where LSTTL compatibility, wide temperature operation, and three-state controllability are mandatory.

FAQ

What logic family does CD74HCT368M belong to, and why does that matter for system design?

CD74HCT368M belongs to the HCT (High-Speed CMOS TTL-compatible) logic family. This means it accepts standard LS-TTL input voltage thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) while delivering CMOS-level power efficiency and noise immunity. For system designers, this eliminates level-shifting circuitry when interfacing with legacy 74LS devices - reducing BOM cost, board area, and signal-integrity risk in mixed-logic upgrades.

How does the dual-enable architecture of CD74HCT368M improve bus management compared to single-enable buffers?

The CD74HCT368M uses two independent active-low enables: 1OE controls Y1–Y4, and 2OE controls Y5–Y6. This allows partial bus isolation - for example, holding Y5–Y6 in high-Z while actively driving Y1–Y4 during arbitration or fault recovery. In contrast, single-enable buffers force all six outputs into three-state simultaneously, limiting flexibility in multi-segment bus architectures and increasing contention risk during state transitions.

Can CD74HCT368M operate reliably at 125°C, and what design considerations support that rating?

Yes, CD74HCT368M is fully specified from –55°C to +125°C per its Recommended Operating Conditions. To sustain operation at 125°C, designers must limit junction temperature using the SOIC package's RθJA = 73°C/W: keep power dissipation below ~17 mW (e.g., <1 MHz toggle rate with 50 pF load), ensure adequate copper pour on VCC/GND planes, and place the device away from other heat sources. TI's datasheet confirms all electrical parameters remain valid across this full range.

What is the maximum capacitive load CD74HCT368M can drive while maintaining its 11 ns typical propagation delay?

The 11 ns typical propagation delay for CD74HCT368M is measured at CL = 15 pF and VCC = 5 V. As load capacitance increases, tpd degrades linearly: at CL = 50 pF, tpd rises to 30 ns (max) per datasheet Table 5.5. For designs requiring ≤15 ns delay, total net capacitance - including trace, stub, and receiver input - must be held ≤20 pF. Use series termination or reduce fanout to maintain timing margins in high-speed bus implementations.

Is CD74HCT368M pin-compatible with non-inverting variants like CD74HCT367M, and what changes are needed in layout or firmware?

Yes, CD74HCT368M is pin-compatible with CD74HCT367M - both use identical SOIC-16 pinouts and share the same dual-OE architecture. The sole functional difference is inversion: CD74HCT368M outputs are inverted relative to inputs, while CD74HCT367M outputs are non-inverted. Firmware must invert expected logic states on receiving ends; no PCB layout change is required, but signal integrity validation should confirm setup/hold timing remains intact after polarity reversal.

CD74HCT368M Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74HCT
Package/Case:
16-SOIC (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Obsolete
Logic Type:
Buffer, Inverting
Number of Elements:
2
Number of Bits per Element:
2, 4 (Hex)
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
4mA, 4mA
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-55°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

CD74HCT368M FAQ

1.How can I place an order for CD74HCT368M through Aetrix?

Please submit a Request for Quotation (RFQ) for CD74HCT368M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CD74HCT368M reliable?

The price and inventory of CD74HCT368M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CD74HCT368M is usually 5 days.

3.What payment methods are accepted for CD74HCT368M?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CD74HCT368M transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CD74HCT368M?

CD74HCT368M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CD74HCT368M order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CD74HCT368M?

For technical support, including CD74HCT368M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CD74HCT368M requirements.

6.How does Aetrix verify that CD74HCT368M is sourced from the original manufacturer or authorized distributors?

All CD74HCT368M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CD74HCT368M meets industry standards.

7.What is the process for return or replacement of CD74HCT368M?

All CD74HCT368M units undergo pre-shipment inspection (PSI). If there is an issue with CD74HCT368M, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CD74HCT368M part is unused and in its original packaging.

Return procedure for CD74HCT368M:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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