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Texas Instruments CD74HCT541M96
- Part No.:
- CD74HCT541M96
- Manufacturer:
- Texas Instruments
- Package:
- 20-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
CD74HCT541M96.pdf
- Description:
- IC BUF NON-INVERT 5.5V 20SOIC
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
CD74HCT541M96 from Texas Instruments is a noninverting octal buffer and line driver with three-state outputs, designed for bidirectional bus interfacing in industrial control and data acquisition systems. It operates at 4.5–5.5 V, delivers 15 LSTTL load drive capability, exhibits 11 ns typical propagation delay (VCC = 5 V, CL = 15 pF), and supports –55°C to +125°C temperature range.
For engineers reviewing the CD74HCT541M96 datasheet, CD74HCT541M96 pinout, CD74HCT541M96 application, or CD74HCT541M96 equivalent, this page provides verified functional modes, truth table behavior, thermal metrics (RθJA = 109.1°C/W), bus-driving specifications, and validated alternative options for high-reliability logic interface design.
Technical Context
The CD74HCT541M96 implements dual independent output-enable controls (OE1 and OE2) - either high forces all eight outputs into high-impedance state, while both low enables noninverting data transfer from A0–A7 to Y0–Y7. Its HCT logic family ensures direct compatibility with LSTTL inputs (VIH ≥ 2.0 V, VIL ≤ 0.8 V) and CMOS-level power efficiency.
It features balanced tPLH/tPHL transition times (≤15 ns), input capacitance of 10 pF, three-state output capacitance of 20 pF, and power dissipation capacitance of 48 pF - enabling stable operation under capacitive bus loading up to 50 pF with predictable timing margins across full temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Family | HCT - TTL-compatible input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) enable direct connection to legacy LSTTL logic without level shifting. |
| Supply Voltage | 4.5–5.5 V - tightly regulated range ensures consistent noise immunity and output swing matching LSTTL requirements. |
| Propagation Delay | 11 ns typical (VCC = 5 V, CL = 15 pF) - supports >30 MHz bus clocking in synchronous data transfer applications. |
| Output Drive | 15 LSTTL loads - sufficient to drive long PCB traces or multiple downstream receivers without external buffering. |
| Operating Temperature | –55°C to +125°C - qualified for aerospace, automotive engine control, and industrial motor drive environments. |
| Three-State Leakage | ±5.0 μA max (–55°C to +125°C) - ensures minimal bus contention current during high-Z state in shared-bus architectures. |
| Input Leakage | ±1 μA max (VI = VCC/GND) - prevents unintended logic transitions on unterminated or high-impedance control lines. |
Pinout & Package
CD74HCT541M96 uses a 20-pin SOIC (DW) package measuring 12.80 mm × 7.50 mm with standard 0.65 mm lead pitch and RoHS-compliant NiPdAu lead finish. Moisture sensitivity level is Level-1 (unlimited floor life at ≤30°C/60% RH).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8 | A0–A7 Inputs | Noninverting data inputs; accept TTL- or CMOS-level signals; internally buffered to reduce capacitive loading on upstream drivers. |
| 9, 19 | OE1, OE2 | Active-low output enable controls; either high forces all Y outputs into high-impedance state - critical for bus arbitration. |
| 11, 12, 13, 14, 15, 16, 17, 18 | Y0–Y7 Outputs | Three-state noninverting outputs; sink/source ±25 mA per pin; support hot-swap bus insertion when enabled/disabled synchronously. |
| 10 | GND | Ground reference for all logic and output stages; must be low-inductance connection to minimize ground bounce during switching. |
| 20 | VCC | Positive supply rail; requires local 0.1-μF ceramic bypass capacitor placed within 2 mm of pin to suppress high-frequency supply noise. |
Key Features
| Feature | Design Value |
|---|---|
| Noninverting octal buffering | Preserves signal polarity across all eight channels - essential for address/data bus integrity in microcontroller peripheral interfaces. |
| Dual output-enable architecture | OE1 and OE2 provide redundant or split-bus control; allows partial bus isolation or fault-tolerant enable sequencing in safety-critical systems. |
| LSTTL load drive (15×) | Eliminates need for external bus transceivers in medium-length (≤15 cm) PCB traces carrying parallel digital signals. |
| Wide temperature operation | Validated performance from –55°C to +125°C enables use in unheated outdoor enclosures or near power electronics without derating. |
| Low quiescent current | ICC ≤ 160 μA max over full temperature range - reduces standby power in battery-backed or energy-constrained monitoring nodes. |
Applications
| Industrial PLC Backplane Interface | Automotive ECU Diagnostic Port |
|---|---|
|
Use Scenario: Isolating microcontroller GPIO banks from noisy 24 V backplane buses in programmable logic controllers. IC Role / Device Role / Timing Role: Noninverting buffer with three-state outputs acts as direction-controlled bus interface between MCU and field I/O modules. Use Value: 15 LSTTL drive strength sustains signal integrity across 30 cm ribbon cable runs; dual OE pins allow synchronized bus release during firmware updates. |
Use Scenario: Enabling/disabling ISO 9141-2 K-line communication paths between diagnostic tool and engine control unit. IC Role / Device Role / Timing Role: Logic-level translator and bus driver ensuring clean K-line signal assertion during active diagnostics and high-Z isolation during normal operation. Use Value: –55°C to +125°C rating guarantees reliable startup in cold ambient or under-hood thermal stress; 11 ns propagation delay meets ISO 9141 timing budgets. |
| Avionics Data Acquisition Module | Medical Imaging Sensor Interface |
|
Use Scenario: Interfacing radiation-hardened ADCs to FPGA-based data concentrators in flight control sensor subsystems. IC Role / Device Role / Timing Role: Octal buffer isolates analog front-end timing domains from digital processing clocks while maintaining signal fidelity. Use Value: Input capacitance of 10 pF minimizes loading on precision ADC output drivers; three-state leakage <5 μA prevents false triggering in high-impedance sampling circuits. |
Use Scenario: Routing multi-channel photodiode array outputs to high-speed digitizers in portable ultrasound equipment. IC Role / Device Role / Timing Role: Bus driver providing controlled edge rates (tTLH/tTHL ≤15 ns) to reduce EMI in sensitive RF-shielded enclosures. Use Value: Balanced propagation delay ensures channel-to-channel skew <1 ns - critical for time-of-flight calculation accuracy in beamforming algorithms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal noninverting buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74HCT244N | Identical HCT logic, but uses separate enable per 4-bit group (1E/2E); no shared OE1/OE2 architecture. | Requires modified control logic for simultaneous 8-bit enable; less suitable for single-wire bus arbitration. | Select when independent half-bus control is needed or when footprint compatibility with legacy SN74HCT244 designs is required. |
| 74ACT541SCX | ACT family: 4.5–5.5 V supply, faster 8 ns typical tPD, higher ICC (200 μA max), and lower noise margin (NIH/NIL ≈ 20%). | Better speed for high-frequency test equipment; reduced noise immunity limits use in electrically noisy industrial settings. | Select only where sub-10 ns propagation is mandatory and board-level EMI mitigation is fully implemented. |
Compared with SN74HCT244N and 74ACT541SCX, CD74HCT541M96 offers unique dual-OE control for deterministic bus release, superior noise immunity (30% VIH/VIL margin), and lowest quiescent current - making it optimal for thermally constrained, safety-critical, or long-life embedded systems.
Availability
CD74HCT541M96 is available at Aetrix Electronics and suitable for industrial automation, avionics data acquisition, automotive diagnostic interfaces, and medical imaging sensor routing requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CD74HCT541M96 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions with over 90 years of innovation in high-reliability IC design and manufacturing.
The CD74HCT541M96 belongs to TI's legacy high-speed CMOS logic portfolio, engineered specifically for robust bus interfacing in harsh-environment applications where TTL compatibility, wide temperature operation, and deterministic three-state control are mandatory.
FAQ
What is the maximum capacitive load the CD74HCT541M96 can drive while maintaining specified timing?
The CD74HCT541M96 is characterized for CL = 15 pF (typical tPD = 11 ns) and CL = 50 pF (tPD = 28 ns, –55°C to +125°C). It reliably drives up to 50 pF total load - including trace capacitance, receiver inputs, and termination - without violating AC specs. Exceeding 50 pF increases propagation delay nonlinearly and may cause setup/hold violations in synchronous systems.
Can CD74HCT541M96 be used with 3.3 V logic systems?
No - CD74HCT541M96 requires 4.5–5.5 V supply and has TTL-compatible input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V). Driving its inputs from 3.3 V logic risks marginal VIH margin (2.0 V vs. 3.3 V) and violates recommended operating conditions. For 3.3 V systems, use CD74HC541M96 (2–6 V) or level-shifting buffers.
How does the dual OE architecture (OE1 and OE2) improve system reliability in bus applications?
In CD74HCT541M96, either OE1 or OE2 asserted high forces all Y outputs into high-impedance state - providing hardware-level fault containment. This prevents bus contention if one enable line fails high due to ESD or latch-up, unlike single-OE devices where failure disables protection entirely. It also enables redundant control signaling in safety-certified designs.
What is the thermal resistance (RθJA) of CD74HCT541M96 in its SOIC (DW) package?
The CD74HCT541M96 in SOIC (DW) package has RθJA = 109.1°C/W, measured per JEDEC JESD51-2 standards on a 1-inch², 2-layer board with 2 oz copper. This value assumes standard JEDEC high-K test board; actual board layout (copper area, vias, airflow) will alter real-world junction temperature rise.
Is CD74HCT541M96 pin-compatible with CD74HC541M96?
Yes - CD74HCT541M96 and CD74HC541M96 share identical SOIC-20 (DW) pinout, mechanical dimensions, and terminal assignments. However, they differ in supply voltage range (HCT: 4.5–5.5 V; HC: 2–6 V), input thresholds, and propagation delay. Direct substitution requires verification of VCC and input logic levels in the target system.
CD74HCT541M96 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74HCT
- Package/Case:
- 20-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 6mA, 6mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-SOIC
CD74HCT541M96 FAQ
1.How can I place an order for CD74HCT541M96 through Aetrix?
Please submit a Request for Quotation (RFQ) for CD74HCT541M96 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CD74HCT541M96 reliable?
The price and inventory of CD74HCT541M96 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CD74HCT541M96 is usually 5 days.
3.What payment methods are accepted for CD74HCT541M96?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CD74HCT541M96 transactions.
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4.How is shipping managed for CD74HCT541M96?
CD74HCT541M96 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CD74HCT541M96 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CD74HCT541M96?
For technical support, including CD74HCT541M96 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CD74HCT541M96 requirements.
6.How does Aetrix verify that CD74HCT541M96 is sourced from the original manufacturer or authorized distributors?
All CD74HCT541M96 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CD74HCT541M96 meets industry standards.
7.What is the process for return or replacement of CD74HCT541M96?
All CD74HCT541M96 units undergo pre-shipment inspection (PSI). If there is an issue with CD74HCT541M96, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CD74HCT541M96 part is unused and in its original packaging.
Return procedure for CD74HCT541M96:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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