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Texas Instruments CD74HCT574QM96EP

Part No.:
CD74HCT574QM96EP
Manufacturer:
Texas Instruments
Category:
Flip Flops
Package:
20-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixCD74HCT574QM96EP.pdf
Description:
IC FF D-TYPE SNGL 8BIT 20SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,820

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Product details

Overview

CD74HCT574QM96EP from Texas Instruments is an octal D-type edge-triggered flip-flop with 3-state outputs, designed for bus-hold and data latching in industrial control and instrumentation systems. It operates from 4.5 V to 5.5 V, delivers 15 ns typical propagation delay (VCC = 5 V, CL = 15 pF), supports −40°C to 125°C extended temperature range, and drives up to 15 LSTTL loads.

For engineers reviewing the CD74HCT574QM96EP datasheet, CD74HCT574QM96EP pinout, CD74HCT574QM96EP application, or CD74HCT574QM96EP equivalent, this page provides verified functional role, timing behavior, thermal performance, bus-driving capability, and drop-in alternatives for high-reliability embedded timing and data-path designs.

Technical Context

The CD74HCT574QM96EP implements eight independent D-type latches triggered on the low-to-high clock transition, with asynchronous 3-state output enable controlling all Q outputs simultaneously. Its CMOS input structure ensures compatibility with both LSTTL (VIH ≥ 2 V, VIL ≤ 0.8 V) and standard CMOS logic families.

It features buffered inputs, balanced propagation delay/transition times, and a dedicated ground (Pin 10) and VCC (Pin 11) pair for noise immunity. The device meets JEDEC JESD22-A108 qualification for extended temperature operation, including HAST, temperature cycling, and electromigration testing.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range4.5 V to 5.5 V - Ensures stable operation across industrial power rail tolerances without level-shifting.
Propagation Delay (tpd)15 ns at VCC = 5 V, CL = 15 pF - Enables reliable 60 MHz clock operation in synchronous data capture paths.
Max Clock Frequency30 MHz at TA = 25°C - Supports high-speed parallel bus interfacing in real-time control subsystems.
Output Drive15 LSTTL loads - Sustains signal integrity across long PCB traces or multi-drop bus configurations.
Operating Temperature−40°C to 125°C - Qualified for under-hood automotive, motor drive, and aerospace-adjacent environments.
Input CompatibilityLSTTL and CMOS - Eliminates need for external translators when interfacing legacy TTL peripherals or modern microcontrollers.
Power Dissipation Cap.47 pF - Enables accurate dynamic power estimation (PD = CPD × VCC² × fI) for thermal budgeting.

Pinout & Package

CD74HCT574QM96EP uses a 20-pin SOIC (DW) package with 7.6 mm × 12.8 mm body size, 1.27 mm lead pitch, and 2.65 mm max height. Pin 1 index area located at top-left corner per JEDEC MS-013.

Pin/TerminalCircuit RoleDesign Meaning
1 (OE)Output EnableActive-low control for simultaneous 3-state disable of all Q outputs; independent of clock or register state.
2–9 (D0–D7)Data InputsCMOS/LSTTL-compatible parallel data inputs synchronized to rising clock edge.
10 (GND)Ground ReferenceDedicated power return path minimizing ground bounce during simultaneous output switching.
11 (VCC)Supply VoltagePrimary 4.5–5.5 V supply rail; decoupling capacitor placement critical near this pin.
12–19 (Q0–Q7)3-State OutputsOctal latched outputs capable of high-impedance state when OE is high; drive bus lines bidirectionally.
20 (CP)Clock InputRising-edge-triggered master clock; accepts fast transitions (≤500 ns rise/fall time at VCC = 4.5 V).

Key Features

FeatureDesign Value
Extended Temperature QualificationJEDEC JESD22-A108 qualified for −40°C to 125°C with HAST, temperature cycling, and electromigration validation.
Bus-Line Driving Capability15 LSTTL load drive strength enables direct connection to legacy backplane or multi-sink control buses without buffers.
Controlled Baseline ManufacturingSingle assembly/test site and single fabrication site ensure consistent parametric yield and long-term supply continuity.
Low Power vs LSTTLSignificant static and dynamic power reduction versus equivalent 74LS574, reducing thermal load in dense PCB layouts.
Input Transition Time ToleranceSupports ≤500 ns input rise/fall times at VCC = 4.5 V - accommodates slower clocks or RC-filtered control signals.

Applications

Industrial PLC I/O ModuleAutomotive Engine Control Unit (ECU)

Use Scenario: Capturing sensor status bits from analog-to-digital converters and discrete input cards in programmable logic controllers.

IC Role / Device Role / Timing Role: Octal latch synchronizing asynchronous field inputs to the PLC's deterministic scan cycle clock.

Use Value: Prevents metastability-induced glitches by enforcing clean setup/hold timing (tsu = 12 ns, th = 5 ns) before CPU read cycles.

Use Scenario: Isolating and buffering diagnostic data from engine sensors (e.g., knock, cam position) before transmission to the main ECU microcontroller.

IC Role / Device Role / Timing Role: Data register holding sensor snapshots during high-noise combustion events, with 3-state outputs enabling shared CAN or LIN bus access.

Use Value: Extended −40°C to 125°C rating ensures reliable operation adjacent to hot engine blocks without derating.

Military Avionics Data AcquisitionTest Equipment Digital Pattern Generator

Use Scenario: Capturing high-speed digital test vectors from FPGA-based stimulus engines in ruggedized flight-test recorders.

IC Role / Device Role / Timing Role: Edge-triggered D-flip-flop capturing parallel pattern words synchronized to system reference clock.

Use Value: 15 ns propagation delay and 30 MHz max clock frequency support sub-33 ns sampling intervals required for MIL-STD-1553B timing compliance.

Use Scenario: Holding output patterns for automated test equipment (ATE) channel drivers during waveform generation sequences.

IC Role / Device Role / Timing Role: Output register staging precomputed bit patterns before release onto DUT interface pins via 3-state control.

Use Value: Simultaneous 3-state enable/disable allows glitch-free pattern updates without bus contention during vector transitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal D-type latch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74HCT574NSame logic function and pinout; commercial-grade (0°C to 70°C), non-extended temp, no enhanced DMS support.Suitable only for benign-temperature lab or consumer-grade equipment; lacks qualification for automotive/military use.Select SN74HCT574N only if operating environment stays within 0°C–70°C and long-term supply continuity is not critical.
CD74HCT574QPWREPIdentical electrical specs and timing; TSSOP-20 (PW) package instead of SOIC-20 (DW); same −40°C to 125°C rating and DMS pedigree.Enables higher board density but requires tighter stencil design and reflow profile due to finer 0.65 mm pitch.Choose CD74HCT574QPWREP when PCB space is constrained and assembly process supports fine-pitch TSSOP handling.

Compared with SN74HCT574N, CD74HCT574QM96EP delivers guaranteed operation at −40°C and 125°C with documented reliability testing, while CD74HCT574QPWREP offers identical performance in a smaller footprint-both require no logic redesign but differ in thermal management and layout implementation.

Availability

CD74HCT574QM96EP is available at Aetrix Electronics and suitable for industrial automation, avionics data acquisition, and automotive engine control applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CD74HCT574QM96EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions with over 50 years of industrial-grade product development.

The CD74HCT574QM96EP belongs to TI's HCT logic family-designed specifically for high-reliability, extended-temperature applications where LSTTL compatibility, bus driving, and latch stability are essential in harsh environments.

FAQ

What is the maximum clock frequency supported by CD74HCT574QM96EP at full temperature range?

The CD74HCT574QM96EP supports a maximum clock frequency of 20 MHz across its full −40°C to 125°C operating range, as specified in the timing requirements table. At 25°C, it achieves 30 MHz. This derating ensures robust setup/hold margin and jitter tolerance in thermally variable industrial deployments where the CD74HCT574QM96EP serves as a synchronous data capture element.

Does CD74HCT574QM96EP require external pull-up resistors on its 3-state outputs?

No, CD74HCT574QM96EP does not require external pull-up resistors on its Q0–Q7 outputs. Its 3-state outputs are actively driven high or low when enabled and present true high-impedance (Z) states when OE is high. Pull-ups are only needed if bus arbitration or wired-OR logic is implemented externally - a design choice independent of the CD74HCT574QM96EP's internal architecture.

How does the CD74HCT574QM96EP handle unused input pins like D0–D7 or CP?

All unused inputs of the CD74HCT574QM96EP-including D0–D7 and CP-must be held at a valid logic level (VCC or GND) to prevent floating nodes that cause increased ICC, noise susceptibility, or erratic latching. TI's application report SCBA004 explicitly mandates this practice. Leaving any input unconnected violates recommended operating conditions and may compromise the reliability of the CD74HCT574QM96EP in extended-temperature service.

Is CD74HCT574QM96EP pin-compatible with the standard CD74HCT574 catalog version?

Yes, CD74HCT574QM96EP is pin-compatible with the commercial CD74HCT574 in the same SOIC-20 (DW) package. Both share identical pinout, electrical interface, and logic function. However, CD74HCT574QM96EP adds extended temperature qualification, controlled baseline manufacturing, and enhanced DMS support-making it a direct replacement where environmental robustness and supply chain longevity are required.

What thermal metrics define the safe operating area for CD74HCT574QM96EP in a high-density PCB layout?

The CD74HCT574QM96EP has a junction-to-ambient thermal resistance (θJA) of 58°C/W in its SOIC-20 (DW) package. With a maximum junction temperature (TJ) of 150°C and ambient up to 125°C, allowable power dissipation is limited to ~0.43 W under natural convection. Layout best practices include localized copper pour under Pin 10 (GND) and Pin 11 (VCC), plus ≥2 cm² thermal relief for the CD74HCT574QM96EP footprint to maintain reliability.

CD74HCT574QM96EP Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74HCT
Package/Case:
20-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Function:
Standard
Type:
D-Type
Output Type:
Tri-State, Non-Inverted
Number of Elements:
1
Number of Bits per Element:
8
Clock Frequency:
60 MHz
Max Propagation Delay @ V, Max CL:
33ns @ 4.5V, 50pF
Trigger Type:
Positive Edge
Current - Output High, Low:
6mA, 6mA
Voltage - Supply:
4.5V ~ 5.5V
Current - Quiescent (Iq):
8 µA
Input Capacitance:
10 pF
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC

CD74HCT574QM96EP FAQ

1.How can I place an order for CD74HCT574QM96EP through Aetrix?

Please submit a Request for Quotation (RFQ) for CD74HCT574QM96EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CD74HCT574QM96EP reliable?

The price and inventory of CD74HCT574QM96EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CD74HCT574QM96EP is usually 5 days.

3.What payment methods are accepted for CD74HCT574QM96EP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CD74HCT574QM96EP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CD74HCT574QM96EP?

CD74HCT574QM96EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CD74HCT574QM96EP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CD74HCT574QM96EP?

For technical support, including CD74HCT574QM96EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CD74HCT574QM96EP requirements.

6.How does Aetrix verify that CD74HCT574QM96EP is sourced from the original manufacturer or authorized distributors?

All CD74HCT574QM96EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CD74HCT574QM96EP meets industry standards.

7.What is the process for return or replacement of CD74HCT574QM96EP?

All CD74HCT574QM96EP units undergo pre-shipment inspection (PSI). If there is an issue with CD74HCT574QM96EP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CD74HCT574QM96EP part is unused and in its original packaging.

Return procedure for CD74HCT574QM96EP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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