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Microchip Technology CD825A
- Part No.:
- CD825A
- Manufacturer:
- Microchip Technology
- Category:
- Single Zener Diodes
- Package:
- Die
- Datasheet:
-
CD825A.pdf
- Description:
- DIODE ZENER 6.2V DIE
- Quantity:
- Payment:
- Shipping:
Inventory:5,430
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Product details
Overview
CD825A from Microsemi is a monolithic, temperature-compensated zener reference die with nominal zener voltage 5.9–6.5 V, test current 7.5 mA, zener impedance 13 Ω, and temperature coefficient 0.002 %/°C - used as precision voltage reference in high-reliability analog power supply monitoring circuits.
For engineers reviewing the CD825A datasheet, CD825A pinout, CD825A application, or CD825A equivalent, key selection criteria include low-temperature-coefficient stability over –55°C to +100°C, silicon-dioxide-junction protection, compatibility with wire bonding and die-attach (excluding solder reflow), and MIL-PRF-19500/159 qualification for aerospace-grade operation.
Technical Context
The CD825A implements a monolithic, two-junction temperature-compensated zener structure where forward and reverse diode junctions are integrated on a single silicon die to cancel thermal drift. Its effective temperature coefficient of 0.002 %/°C is achieved via matched junction area ratios and metallization design.
It operates exclusively in reverse-bias zener mode with cathode positive relative to anode; the third terminal (test pad) is non-functional and reserved for wire bond evaluation only. Backside gold metallization ensures electrical isolation and thermal stability across –65°C to +175°C operating and storage ranges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage | 5.9–6.5 V at 7.5 mA - defines stable reference output range under nominal bias |
| Zener Test Current | 7.5 mA - required bias current to achieve specified voltage and impedance |
| Zener Impedance | 13 Ω - low dynamic resistance ensures minimal output voltage shift under load variation |
| Temp. Coefficient | 0.002 %/°C - enables ±0.2 mV/°C max drift over –55°C to +100°C for precision references |
| Max. Voltage Drift | 19 mV over full temp range - guaranteed maximum deviation per JEDEC Std. No. 5 |
| Reverse Leakage | 2 μA @ 3 V - confirms low off-state conduction for standby-sensitive systems |
| Operating Temp. | –65°C to +175°C - supports extended-range military and downhole applications |
Pinout & Package
CD825A is supplied as an unmounted bare die with three metallized terminals on top surface and gold back metallization. Package dimensions: 0.030" × 0.030" (0.76 mm × 0.76 mm) square die, 0.010" ±0.002" (0.25 mm ±0.05 mm) thickness, electrically isolated backside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Cathode) | Zener output terminal | Must be biased positive relative to anode to enable zener breakdown; primary current path |
| 2 (Anode) | Zener return terminal | Reference ground node; reverse-bias voltage applied between Cathode and Anode |
| 3 (Test Pad) | Non-functional metallization | Reserved for wire bond process evaluation only; no electrical connection or circuit function |
Key Features
| Feature | Design Value |
|---|---|
| Monolithic temp-compensation | Integrated dual-junction architecture eliminates external compensation components and reduces layout sensitivity |
| Silicon dioxide junction protection | Hermetic passivation prevents contamination-induced leakage and long-term parameter drift |
| MIL-PRF-19500/159 qualification | Meets JANHC/JANKC screening for radiation-hardened, high-reliability defense and space programs |
| Wire bond & die attach compatible | Al top metallization and Au backside support wedge/wire bonding and epoxy/silver-glass die attach |
| Low-temp-coefficient stability | 0.002 %/°C enables <±20 ppm/°C reference accuracy without trimming in critical analog subsystems |
Applications
| Aerospace Power Monitoring | Downhole Instrumentation |
|---|---|
Use Scenario: Real-time regulation and fault detection in satellite DC-DC converter feedback loops. IC Role / Device Role / Timing Role: Precision voltage reference for error amplifier input in isolated flyback controllers. Use Value: 0.002 %/°C TC and –65°C to +175°C rating ensure stable setpoint accuracy across orbital thermal cycles. | Use Scenario: Biasing and calibration of pressure/temperature sensor front-ends in oil-well logging tools. IC Role / Device Role / Timing Role: Stable reference source for 24-bit sigma-delta ADCs operating at elevated ambient temperatures. Use Value: 13 Ω zener impedance minimizes code-dependent reference droop during high-resolution conversion sequences. |
| Avionics Analog Subsystems | Nuclear Reactor Control Sensors |
Use Scenario: Reference generation for analog-to-digital converters in flight control signal conditioning modules. IC Role / Device Role / Timing Role: Zener-based voltage standard replacing TL431 in radiation-tolerant designs. Use Value: MIL-qualified construction and 19 mV max voltage drift over –55°C to +100°C meet DO-160E environmental compliance. | Use Scenario: Long-term stable biasing of neutron flux detector amplifiers in reactor safety instrumentation. IC Role / Device Role / Timing Role: Primary reference element in redundant, fail-safe analog monitoring chains. Use Value: Silicon-dioxide junction protection prevents parametric degradation under neutron irradiation and thermal aging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar zener reference applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CD827A | Lower temp coefficient (0.001 %/°C) and lower zener impedance (13 Ω → 9 Ω) | Better suited for ultra-stable references where <10 ppm/°C drift is mandatory | Select CD827A when tighter TC and lower impedance justify cost premium over CD825A |
| CD829A | Lowest temp coefficient (0.0005 %/°C) and lowest impedance (13 Ω → 5 Ω) | Targeted for metrology-grade references requiring sub-ppm/°C stability | Choose CD829A only if system-level calibration budget permits highest-tier reference performance |
Compared with CD825A, CD827A offers improved thermal stability and lower dynamic impedance at identical voltage range and package, while CD829A delivers metrology-class drift performance - both require identical die mounting but differ in cost and availability for high-reliability procurement.
Availability
CD825A is available at Aetrix Electronics and suitable for aerospace power monitoring, downhole instrumentation, avionics analog subsystems, and nuclear reactor control sensors requiring stable component supply across extended temperature and radiation environments.
Supply support for CD825A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability, radiation-hardened, and precision analog components for defense, aerospace, and industrial markets.
The CD825A belongs to Microsemi's MIL-qualified monolithic zener reference die family, designed specifically to replace legacy 1N821–1N829 through-hole devices in hybrid and multichip module applications demanding hermetic stability and extended temperature operation.
FAQ
What is the exact zener voltage range of the CD825A?
The CD825A has a specified zener voltage range of 5.9 V to 6.5 V when measured at the standard test current of 7.5 mA and ambient temperature of 25°C. This range reflects manufacturing tolerance and is guaranteed per MIL-PRF-19500/159 screening. The CD825A maintains this voltage band with minimal drift across its full operating temperature range due to its monolithic temperature-compensated structure.
Is the CD825A pin-compatible with the 1N825 or other through-hole zeners?
No - the CD825A is a bare die, not a packaged device, and therefore has no pinout compatibility with through-hole parts like the 1N825. It features three top-side metallized terminals (cathode, anode, test pad) and requires custom die mounting. While electrically equivalent to 1N821–1N829 per datasheet, the CD825A must be integrated into hybrid circuits or MCMs using wire bonding or flip-chip assembly.
Does the CD825A support solder reflow assembly?
No - the CD825A is explicitly incompatible with solder reflow processes. Its datasheet states "compatible with all wire bonding and die attach techniques with the exception of solder reflow." Recommended attachment methods include epoxy die attach, silver-glass pastes, or thermosonic wire bonding to Al or Au substrates. Solder reflow risks delamination and metallization damage due to thermal mismatch.
What does the "A" suffix in CD825A signify?
Per Microsemi's LDS-0052 datasheet, the "A" suffix denotes JANKC qualification level - a military-grade screening tier that includes additional environmental stress testing beyond standard JANHC. CD825A meets stricter limits for parameter drift, leakage, and burn-in, making it suitable for higher-reliability applications than the base CD825 variant.
Can the test pad (Terminal 3) be used for electrical connection in the CD825A?
No - Terminal 3 is a dedicated test pad for wire bond process evaluation only and has no electrical connection to the internal zener junction. It is not bonded during normal operation and must remain unconnected in final assembly. Using it as a functional terminal violates the CD825A's validated design and may compromise voltage stability or reliability.
CD825A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Voltage - Zener (Nom) (Vz):
- 6.2 V
- Tolerance:
- ±4.83%
- Power - Max:
- -
- Impedance (Max) (Zzt):
- 13 Ohms
- Current - Reverse Leakage @ Vr:
- 2 µA @ 3 V
- Voltage - Forward (Vf) (Max) @ If:
- -
- Operating Temperature:
- -65°C ~ 175°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
CD825A FAQ
1.How can I place an order for CD825A through Aetrix?
Please submit a Request for Quotation (RFQ) for CD825A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CD825A reliable?
The price and inventory of CD825A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CD825A is usually 5 days.
3.What payment methods are accepted for CD825A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CD825A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CD825A?
CD825A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CD825A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CD825A?
For technical support, including CD825A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CD825A requirements.
6.How does Aetrix verify that CD825A is sourced from the original manufacturer or authorized distributors?
All CD825A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CD825A meets industry standards.
7.What is the process for return or replacement of CD825A?
All CD825A units undergo pre-shipment inspection (PSI). If there is an issue with CD825A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CD825A part is unused and in its original packaging.
Return procedure for CD825A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CD825A Tags
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MMBZ5240B-7-F
Diodes Incorporated
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MM5Z5V1ST1G
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SMAJ4744A-TP
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