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Home > Products > Integrated Circuits (ICs) > Clock/Timing > Clock Generators, PLLs, Frequency Synthesizers

Texas Instruments CDC516DGGG4

Name: CDC516DGGG4
Brand: Texas Instruments
SKU: CDC516DGGG4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: CDC516DGGG4

Manufacturer:: Texas Instruments

Category:: Clock Generators, PLLs, Frequency Synthesizers

Package:: 48-TFSOP (0.240", 6.10mm Width)

Datasheet:: CDC516DGGG4.pdf

Description:: IC PLL CLOCK DRIVER 48TSSOP

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Product details

Overview

CDC516DGGG4 from Texas Instruments is a 3.3-V, 16-output PLL-based clock distribution IC designed for synchronous DRAM systems. It delivers low-skew (≤200 ps), low-jitter (±100 ps pk-pk) clock copies across four independently enabled banks, supports 25–125 MHz input frequency, and features on-chip loop filter eliminating external RC components.

For engineers reviewing the CDC516DGGG4 datasheet, CDC516DGGG4 pinout, CDC516DGGG4 application, or CDC516DGGG4 equivalent, key selection criteria include bank-level output enable control (1G–4G), FBIN/FBOUT feedback synchronization, TSSOP-48 package compatibility, and guaranteed phase-lock stabilization within 1 ms after power-up or clock change.

Technical Context

The CDC516DGGG4 integrates a fully self-contained PLL with internal loop filter to align FBOUT phase and frequency precisely to CLK. Its architecture enables zero external passive components while maintaining ≤400 ps total phase error over 66–100 MHz operation.

Each of the four output banks (1Y0–1Y3, 2Y0–2Y3, etc.) is controlled by dedicated active-high enable pins (1G–4G), allowing dynamic per-bank gating without affecting other banks. Duty cycle correction ensures 43–57% output duty cycle regardless of input duty cycle variation.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage	3.0 V to 3.6 V - Operates within standard 3.3-V logic rail with ±0.3-V tolerance.
Input Frequency Range	25 MHz to 125 MHz - Supports SDR/DDR SDRAM clocking across industry-standard memory speeds.
Output Skew (tsk(o))	≤200 ps - Ensures timing alignment across all 16 outputs under matched loading conditions.
Phase Error (tphase error)	−80 ps to +400 ps - Measured between CLK↑ and FBIN↑ at 66–100 MHz; defines static alignment accuracy.
Jitter (pk-pk)	±100 ps - Peak-to-peak jitter on any Y or FBOUT output above 66 MHz; critical for setup/hold margin.
Stabilization Time	1 ms - Required PLL lock time after power-up or reference signal change before valid timing specs apply.
Duty Cycle Range	43% to 57% - Output duty cycle corrected internally; independent of input duty cycle.

Pinout & Package

Packaged in a 48-pin Thin Shrink Small-Outline Package (TSSOP-DGG), 12.4 mm × 6.0 mm × 1.2 mm max height, JEDEC MO-153 compliant, MSL Level-2-260°C-1 year.

Pin/Terminal	Circuit Role	Design Meaning
CLK (12)	Clock Input	Reference signal source for PLL; must be fixed-frequency/fixed-phase to achieve lock.
FBIN (37)	Feedback Input	Connects externally to FBOUT to close PLL loop; determines final phase alignment point.
FBOUT (35)	Feedback Output	Dedicated buffered copy of CLK used to complete PLL feedback path.
1G–4G (9,16,33,40)	Bank Enable Inputs	Active-high controls: each enables/disables its associated 4-output bank (e.g., 1G → 1Y0–1Y3).
1Y0–1Y3 (2,3,6,7) 2Y0–2Y3 (18,19,22,26) 3Y0–3Y3 (31,30,27,26) 4Y0–4Y3 (47,46,43,42)	Clock Outputs	16 low-skew CMOS outputs; each bank driven synchronously with CLK when respective G is high.
VCC (1,8,17,24,25,32,41,48)	Digital Power	Eight dedicated 3.3-V supply pins reduce IR drop and improve noise immunity across large die.
AVCC (11,38)	Analog Power	Separate analog supply for PLL core; strapping AVCC to GND bypasses PLL for test/debug.
GND / AGND (4,5,10,15,20,21,28,29,34,39,44,45 / 13,14,36)	Ground Returns	Dedicated digital (GND) and analog (AGND) ground pins minimize coupling between logic and PLL domains.

Key Features

Feature	Design Value
On-chip PLL loop filter	Eliminates need for external RC network - reduces BOM count, PCB area, and layout sensitivity.
Independent bank enable (1G–4G)	Enables dynamic power management per memory bank - reduces system-level clock tree power by disabling unused banks.
Duty cycle correction	Maintains 43–57% output duty cycle regardless of input duty cycle - ensures balanced high/low times for memory interface timing margins.
Low output skew (≤200 ps)	Guarantees tight timing alignment across all 16 outputs - essential for multi-bank SDRAM address/control signal synchronization.
PLL bypass mode (AVCC = GND)	Allows direct CLK-to-output buffering for functional validation or failure analysis without PLL dependency.

Applications

SDRAM Memory Subsystem	DDR SDRAM Clock Tree
Use Scenario: Distributing a single system clock to four independent SDRAM banks on a memory module or motherboard. IC Role / Device Role / Timing Role: PLL-based clock driver providing phase-aligned, low-skew copies to each bank's address/command lines. Use Value: Enables simultaneous access to multiple SDRAM banks with guaranteed setup/hold timing compliance via ≤200 ps inter-bank skew.	Use Scenario: Generating synchronized clocks for DDR SDRAM data strobes (DQS) and command/address signals in embedded controllers. IC Role / Device Role / Timing Role: High-fidelity clock repeater with duty cycle correction ensuring 50% nominal output for bidirectional DQS timing windows. Use Value: Maintains 43–57% output duty cycle across 25–125 MHz range - directly supports DDR timing requirements without external adjustment.
Industrial PLC Backplane Timing	Test Equipment Clock Distribution
Use Scenario: Providing deterministic clock timing to multiple FPGA-based I/O modules in a modular automation controller. IC Role / Device Role / Timing Role: Low-jitter (±100 ps) clock fanout device with per-bank enable for selective module activation. Use Value: Allows hot-swap sequencing of I/O modules via 1G–4G control - eliminates clock glitches during insertion/removal.	Use Scenario: Replicating a master reference clock across multiple instrument channels in automated test equipment (ATE). IC Role / Device Role / Timing Role: Phase-locked distribution IC with FBIN/FBOUT feedback for traceable clock synchronization across measurement channels. Use Value: Achieves ≤400 ps static phase error relative to reference - enables sub-nanosecond channel-to-channel timing correlation.

SDRAM Memory Subsystem

DDR SDRAM Clock Tree

Use Scenario: Distributing a single system clock to four independent SDRAM banks on a memory module or motherboard.

IC Role / Device Role / Timing Role: PLL-based clock driver providing phase-aligned, low-skew copies to each bank's address/command lines.

Use Value: Enables simultaneous access to multiple SDRAM banks with guaranteed setup/hold timing compliance via ≤200 ps inter-bank skew.

Use Scenario: Generating synchronized clocks for DDR SDRAM data strobes (DQS) and command/address signals in embedded controllers.

IC Role / Device Role / Timing Role: High-fidelity clock repeater with duty cycle correction ensuring 50% nominal output for bidirectional DQS timing windows.

Use Value: Maintains 43–57% output duty cycle across 25–125 MHz range - directly supports DDR timing requirements without external adjustment.

Industrial PLC Backplane Timing

Test Equipment Clock Distribution

Use Scenario: Providing deterministic clock timing to multiple FPGA-based I/O modules in a modular automation controller.

IC Role / Device Role / Timing Role: Low-jitter (±100 ps) clock fanout device with per-bank enable for selective module activation.

Use Value: Allows hot-swap sequencing of I/O modules via 1G–4G control - eliminates clock glitches during insertion/removal.

Use Scenario: Replicating a master reference clock across multiple instrument channels in automated test equipment (ATE).

IC Role / Device Role / Timing Role: Phase-locked distribution IC with FBIN/FBOUT feedback for traceable clock synchronization across measurement channels.

Use Value: Achieves ≤400 ps static phase error relative to reference - enables sub-nanosecond channel-to-channel timing correlation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar clock distribution applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CDCVF2510A	Higher max frequency (200 MHz), same 4-bank/16-output architecture, identical TSSOP-48 footprint.	Targeted for faster DDR2/DDR3 interfaces; requires updated layout for higher-speed signal integrity.	Select CDCVF2510A when >125 MHz operation or improved jitter performance is required.
CDCLVC1107	LVCMOS/LVTTL-compatible, no PLL (zero-delay buffer), 10-output, smaller TSSOP-24 package.	Lacks phase alignment and duty cycle correction; suitable only for non-critical, lower-pin-count clock fanout.	Choose CDCLVC1107 for cost-sensitive, non-PLL applications where skew <300 ps and no feedback is acceptable.

Compared with CDC516DGGG4, CDCVF2510A extends frequency range and improves jitter but retains full pin compatibility, while CDCLVC1107 offers reduced size and cost at the expense of PLL functionality and output count - making it suitable only for simpler, non-synchronous fanout tasks.

Availability

CDC516DGGG4 is available at Aetrix Electronics and suitable for synchronous DRAM subsystems, industrial PLC backplanes, and automated test equipment requiring stable component supply, long-term lifecycle support, and RoHS-compliant TSSOP packaging.

Supply support for CDC516DGGG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic technologies with over 50 years of innovation in precision timing and interface solutions.

The CDC516DGGG4 belongs to TI's clock distribution product line, engineered specifically for high-reliability, low-skew clock fanout in memory-intensive systems such as SDRAM-based computing and industrial control platforms.

FAQ

What is the minimum stabilization time required for CDC516DGGG4 to achieve PLL lock?

The CDC516DGGG4 requires 1 ms of stabilization time after power-up or any change to the CLK or FBIN signal to achieve full PLL phase lock. During this period, timing specifications including skew, jitter, and phase error do not apply. This value is specified in the switching characteristics table and confirmed across the full 0°C to 70°C operating temperature range.

Can CDC516DGGG4 operate without connecting FBIN to FBOUT?

No - FBIN must be hard-wired to FBOUT to close the PLL feedback loop. The CDC516DGGG4 relies on this connection to synchronize FBOUT phase and frequency to CLK. Without it, the PLL cannot achieve lock, and outputs will not meet published timing specifications. The datasheet explicitly states FBIN "must be hard-wired to FBOUT to complete the PLL."

Does CDC516DGGG4 support different output voltage levels such as 2.5 V or 1.8 V?

No - CDC516DGGG4 is specified exclusively for 3.3-V operation (VCC = 3.0 V to 3.6 V). Its output VOH/VOL thresholds, drive strength, and internal circuitry are optimized for 3.3-V CMOS logic levels. It does not support mixed-voltage I/O or level-shifting; interfacing with 2.5-V or 1.8-V loads requires external translation.

How many output banks does CDC516DGGG4 provide, and how are they controlled?

The CDC516DGGG4 provides four independent output banks (1Y0–1Y3, 2Y0–2Y3, 3Y0–3Y3, 4Y0–4Y3), each with four outputs. Each bank is controlled by a dedicated active-high enable pin: 1G (pin 9), 2G (pin 16), 3G (pin 33), and 4G (pin 40). When a G pin is low, its associated outputs are driven to logic-low; when high, outputs switch synchronously with CLK.

Is CDC516DGGG4 pin-compatible with CDC516DGGR?

Yes - CDC516DGGG4 and CDC516DGGR share identical TSSOP-48 (DGG) package dimensions, pinout, and electrical specifications. The only difference is packaging format: CDC516DGGG4 ships in tubes (40 units), while CDC516DGGR uses tape-and-reel (2000 units). Both carry the same part marking "CDC516" and identical MSL rating (Level-2-260°C-1 year).

CDC516DGGG4 Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: -

Package/Case:: 48-TFSOP (0.240", 6.10mm Width)

Packaging:: Tube

Product Status:: Discontinued at Digi-Key

Programmable:: Not Verified

Type:: PLL Clock Driver

PLL:: Yes with Bypass

Input:: LVTTL

Output:: LVTTL

Number of Circuits:: 1

Ratio - Input:Output:: 1:16

Differential - Input:Output:: No/No

Frequency - Max:: 125MHz

Divider/Multiplier:: No/No

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C

Mounting Type:: Surface Mount

Grade:: -

Qualification:: -

Supplier Device Package:: 48-TSSOP

CDC516DGGG4 FAQ

1.How can I place an order for CDC516DGGG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for CDC516DGGG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CDC516DGGG4 reliable?

The price and inventory of CDC516DGGG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CDC516DGGG4 is usually 5 days.

3.What payment methods are accepted for CDC516DGGG4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CDC516DGGG4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CDC516DGGG4?

CDC516DGGG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CDC516DGGG4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CDC516DGGG4?

For technical support, including CDC516DGGG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CDC516DGGG4 requirements.

6.How does Aetrix verify that CDC516DGGG4 is sourced from the original manufacturer or authorized distributors?

All CDC516DGGG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CDC516DGGG4 meets industry standards.

7.What is the process for return or replacement of CDC516DGGG4?

All CDC516DGGG4 units undergo pre-shipment inspection (PSI). If there is an issue with CDC516DGGG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CDC516DGGG4 part is unused and in its original packaging.

Return procedure for CDC516DGGG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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