Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Clock/Timing > Clock Buffers, Drivers

Texas Instruments CDCVF2310PWG4

Name: CDCVF2310PWG4
Brand: Texas Instruments
SKU: CDCVF2310PWG4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: CDCVF2310PWG4

Manufacturer:: Texas Instruments

Category:: Clock Buffers, Drivers

Package:: 24-TSSOP (0.173", 4.40mm Width)

Datasheet:: CDCVF2310PWG4.pdf

Description:: IC CLK BUF 1:10 200MHZ 24TSSOP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,825

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

CDCVF2310PWG4 from Texas Instruments is a high-performance, low-skew 1:10 LVCMOS clock buffer operating up to 200 MHz at 3.3 V, featuring two independent 5-output banks (1Y[0:4], 2Y[0:4]), pin-to-pin output skew <100 ps, and integrated 25-Ω series damping resistors. It serves as a fanout buffer in FPGA, CPU, and PLL clock distribution systems requiring precise timing integrity.

For engineers reviewing the CDCVF2310PWG4 datasheet, CDCVF2310PWG4 pinout, CDCVF2310PWG4 application, or CDCVF2310PWG4 equivalent, key selection criteria include its dual-bank enable control (1G/2G), guaranteed low-skew performance across 2.3–3.6 V supply, glitch-suppressed output enable sequencing, and TSSOP-24 package compatibility with high-density PCB layouts.

Technical Context

The CDCVF2310PWG4 implements a negative-edge-triggered output enable architecture: each bank (1Y or 2Y) enters buffer mode only after detecting a falling edge on CLK while its respective enable pin (1G or 2G) is held high. Default power-up state forces all outputs low regardless of control pin states.

It integrates on-die 25-Ω series termination per output to minimize signal reflections on 50-Ω transmission lines, supports full-period clock distribution via synchronized enable/disable sequencing, and delivers additive phase jitter as low as 45 fs RMS (12 kHz–20 MHz, 125 MHz output) with a 3.3-V supply.

Key Specifications

Parameter	Value and Actual Design Meaning
Max Clock Frequency	200 MHz at VDD = 3.3 V - enables direct fanout of high-speed system clocks without external frequency division
Output Skew (tsk(o))	<100 ps at VDD = 3.3 V - ensures synchronous arrival of clock edges across all five outputs in one bank
VDD Range	2.3 V to 3.6 V - supports interoperability with both 2.5-V and 3.3-V logic domains in mixed-voltage systems
On-Chip Damping	25 Ω series resistor per output - eliminates need for discrete series termination, reducing BOM count and layout area
Operating Temperature	–40°C to 85°C - qualified for industrial-grade embedded applications including communications infrastructure
Additive Jitter	45 fs RMS (12 kHz–20 MHz, 125 MHz output) - preserves phase noise budget in jitter-sensitive PLL reference paths
Enable Glitch Suppression	Synchronized to CLK falling edge - prevents partial-cycle clock pulses during enable/disable transitions

Pinout & Package

The CDCVF2310PWG4 is housed in a 24-pin TSSOP (PW) package measuring 4.40 mm × 7.80 mm, with exposed pad not present and standard JEDEC-compliant footprint.

Pin/Terminal	Circuit Role	Design Meaning
CLK (24)	Input reference clock	Single-ended LVCMOS input accepting 0–200 MHz signals; triggers output enable/disable on falling edge
1G (11), 2G (13)	Bank-specific output enable	Active-high controls; each enables its associated 5-output bank only after CLK↓ detection
1Y0–1Y4 (3,4,5,8,9), 2Y0–2Y4 (21,20,17,16,12)	Buffered clock outputs	LVCMOS outputs with integrated 25-Ω series termination; drive point-to-point or multidrop loads
VDD (2,10,14,15,22,23)	Power supply	Six dedicated pins reduce IR drop and improve high-frequency decoupling; requires local 0.1 µF + 1 µF bypassing
GND (1,6,7,18,19)	Ground reference	Five ground pins provide low-inductance return path for switching currents and minimize ground bounce

Key Features

Feature	Design Value
Dual independent 5-output banks	Enables selective clock gating: Bank 1 can drive CPU core while Bank 2 drives memory interface, with separate enable control
Negative-edge-triggered enable	Eliminates race conditions between enable assertion and clock edge; guarantees full-cycle clock delivery on activation
Integrated 25-Ω series termination	Reduces signal overshoot/ringing on 50-Ω traces without external resistors-saves 10 components per device
Glitch-suppressed output enable	Prevents spurious half-cycle pulses during power sequencing or dynamic clock management in multi-core SoC systems
Low additive jitter (45 fs RMS)	Maintains tight phase noise margin in RF sampling clocks and high-speed serial link reference paths

Applications

CPU Clock Distribution	FPGA Configuration Clock
Use Scenario: Distributing a 100-MHz system clock to multiple CPU cores and cache controllers in an industrial processor module. IC Role / Device Role / Timing Role: Fanout buffer providing low-skew, glitch-free copies to synchronous logic blocks with independent enable control per bank. Use Value: Eliminates inter-core timing skew that would otherwise limit maximum operating frequency or cause metastability in cross-domain handshakes.	Use Scenario: Driving configuration and user clocks for Xilinx Artix-7 FPGA banks requiring matched trace lengths and simultaneous enable. IC Role / Device Role / Timing Role: Dual-bank clock distributor synchronizing configuration clock (Bank 1) and user logic clock (Bank 2) with sub-100-ps inter-output alignment. Use Value: Ensures deterministic bitstream loading and eliminates setup/hold violations during partial reconfiguration sequences.
PLL Reference Clock Fanout	Backplane Synchronization
Use Scenario: Splitting a low-jitter 125-MHz oscillator output to feed multiple PLLs in a telecom line card with strict phase noise requirements. IC Role / Device Role / Timing Role: Low-additive-jitter buffer preserving reference clock spectral purity while enabling independent enable/disable per PLL channel. Use Value: Achieves 45-fs RMS additive jitter-critical for maintaining EVM in 256-QAM RF modems and minimizing BER in high-speed SerDes links.	Use Scenario: Providing synchronized clock signals across multiple daughter cards in a modular test equipment chassis using point-to-point routing. IC Role / Device Role / Timing Role: High-drive-strength clock repeater delivering matched-delay clocks to distributed ADC/DAC modules over 10-cm backplane traces. Use Value: On-die 25-Ω termination minimizes reflections on long traces, and dual-bank control allows hot-swap clock disable without affecting active modules.

CPU Clock Distribution

FPGA Configuration Clock

Use Scenario: Distributing a 100-MHz system clock to multiple CPU cores and cache controllers in an industrial processor module.

IC Role / Device Role / Timing Role: Fanout buffer providing low-skew, glitch-free copies to synchronous logic blocks with independent enable control per bank.

Use Value: Eliminates inter-core timing skew that would otherwise limit maximum operating frequency or cause metastability in cross-domain handshakes.

Use Scenario: Driving configuration and user clocks for Xilinx Artix-7 FPGA banks requiring matched trace lengths and simultaneous enable.

IC Role / Device Role / Timing Role: Dual-bank clock distributor synchronizing configuration clock (Bank 1) and user logic clock (Bank 2) with sub-100-ps inter-output alignment.

Use Value: Ensures deterministic bitstream loading and eliminates setup/hold violations during partial reconfiguration sequences.

PLL Reference Clock Fanout

Backplane Synchronization

Use Scenario: Splitting a low-jitter 125-MHz oscillator output to feed multiple PLLs in a telecom line card with strict phase noise requirements.

IC Role / Device Role / Timing Role: Low-additive-jitter buffer preserving reference clock spectral purity while enabling independent enable/disable per PLL channel.

Use Value: Achieves 45-fs RMS additive jitter-critical for maintaining EVM in 256-QAM RF modems and minimizing BER in high-speed SerDes links.

Use Scenario: Providing synchronized clock signals across multiple daughter cards in a modular test equipment chassis using point-to-point routing.

IC Role / Device Role / Timing Role: High-drive-strength clock repeater delivering matched-delay clocks to distributed ADC/DAC modules over 10-cm backplane traces.

Use Value: On-die 25-Ω termination minimizes reflections on long traces, and dual-bank control allows hot-swap clock disable without affecting active modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar clock buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CDCLVC1107PWR	1:10 LVCMOS buffer with 3.3-V-only operation (no 2.5-V support); lower max frequency (160 MHz); no on-chip 25-Ω resistors	Requires external series termination; limited to single-supply 3.3-V systems; unsuitable for mixed-voltage designs	Select when cost sensitivity outweighs voltage flexibility and board space constraints allow discrete termination
LMK00306RGTT	1:6 LVDS/LVPECL/LVCMOS programmable buffer; supports 3.3-V/2.5-V; includes internal VCCO regulation; higher jitter (75 fs RMS)	Supports differential signaling and level translation; more complex configuration via I²C; larger 48-pin QFN package	Select when system requires LVDS outputs or multi-protocol clock distribution, accepting higher jitter and layout complexity

Compared with CDCLVC1107PWR and LMK00306RGTT, the CDCVF2310PWG4 uniquely balances dual-voltage operation, integrated termination, and ultra-low skew in a compact TSSOP-24 package-making it optimal for space-constrained, mixed-voltage clock trees where deterministic enable behavior and minimal BOM are critical.

Availability

CDCVF2310PWG4 is available at Aetrix Electronics and suitable for CPU clock distribution, FPGA configuration, PLL reference fanout, and backplane synchronization requiring stable component supply across industrial temperature ranges and long production lifecycles.

Supply support for CDCVF2310PWG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company designing analog ICs, embedded processors, and digital signal processors for industrial, automotive, and communications markets.

The CDCVF2310PWG4 belongs to TI's high-performance clock buffer product line, engineered specifically for low-skew, low-jitter clock distribution in FPGA, CPU, and communications infrastructure applications demanding robust enable control and mixed-voltage compatibility.

FAQ

What is the maximum operating frequency of the CDCVF2310PWG4 at 2.5 V?

The CDCVF2310PWG4 supports a maximum clock frequency of 170 MHz when operated at VDD = 2.5 V ±0.2 V, as specified in the Switching Characteristics table under recommended conditions. This rating ensures reliable timing margins for legacy 2.5-V systems while maintaining sub-170-ps output skew across each 5-output bank.

Does the CDCVF2310PWG4 require external series termination resistors?

No, the CDCVF2310PWG4 does not require external series termination resistors because it integrates 25-Ω series damping resistors on all ten outputs (1Y0–1Y4 and 2Y0–2Y4). These on-die resistors match standard 50-Ω PCB trace impedance, eliminating reflection-induced jitter and reducing component count by ten per device.

How does the output enable glitch suppression work in the CDCVF2310PWG4?

The CDCVF2310PWG4 implements glitch suppression by synchronizing output enable/disable transitions to the falling edge of the CLK input. When 1G or 2G is asserted or deasserted, the corresponding bank's outputs change state only after detecting CLK↓-ensuring full-cycle clock pulses and preventing partial-cycle glitches that could corrupt synchronous logic.

What is the thermal resistance (RθJA) of the CDCVF2310PWG4 in its TSSOP-24 package?

The CDCVF2310PWG4 in the PW (TSSOP-24) package has a junction-to-ambient thermal resistance (RθJA) of 91.7°C/W, as measured under standard JEDEC test conditions. This value assumes a 2-layer board with 1-in² copper pour; actual thermal performance improves with additional copper area and thermal vias beneath the package body.

Can the CDCVF2310PWG4 drive both 2.5-V and 3.3-V logic loads simultaneously?

Yes, the CDCVF2310PWG4 can drive both 2.5-V and 3.3-V logic loads simultaneously because its output voltage levels scale with VDD (VOH ≥ VDD – 0.2 V, VOL ≤ 0.2 V), and its 25-Ω series resistors maintain signal integrity across mixed-voltage interfaces. However, load devices must be compatible with the selected VDD supply voltage applied to the CDCVF2310PWG4.

CDCVF2310PWG4 Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: -

Package/Case:: 24-TSSOP (0.173", 4.40mm Width)

Packaging:: Bulk

Product Status:: Discontinued at Digi-Key

Type:: Fanout Buffer (Distribution)

Number of Circuits:: 1

Ratio - Input:Output:: 1:10

Differential - Input:Output:: No/No

Input:: LVTTL

Output:: LVTTL

Frequency - Max:: 200 MHz

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Mounting Type:: Surface Mount

Grade:: -

Qualification:: -

Supplier Device Package:: 24-TSSOP

CDCVF2310PWG4 FAQ

1.How can I place an order for CDCVF2310PWG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for CDCVF2310PWG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CDCVF2310PWG4 reliable?

The price and inventory of CDCVF2310PWG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CDCVF2310PWG4 is usually 5 days.

3.What payment methods are accepted for CDCVF2310PWG4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CDCVF2310PWG4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CDCVF2310PWG4?

CDCVF2310PWG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CDCVF2310PWG4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CDCVF2310PWG4?

For technical support, including CDCVF2310PWG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CDCVF2310PWG4 requirements.

6.How does Aetrix verify that CDCVF2310PWG4 is sourced from the original manufacturer or authorized distributors?

All CDCVF2310PWG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CDCVF2310PWG4 meets industry standards.

7.What is the process for return or replacement of CDCVF2310PWG4?

All CDCVF2310PWG4 units undergo pre-shipment inspection (PSI). If there is an issue with CDCVF2310PWG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CDCVF2310PWG4 part is unused and in its original packaging.

Return procedure for CDCVF2310PWG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…