Infineon Technologies CG7599AA
- Part No.:
- CG7599AA
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CG7599AA.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,597
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Product details
Overview
CG7599AA from Cypress Semiconductor is a 18-Mbit DDR II SRAM with two-word burst architecture, configured as 1M × 18 (CY7C1318KV18), operating at 333 MHz clock frequency and delivering 666 MT/s data rate via double-data-rate interface. It uses 1.8 V core supply with HSTL I/O, supports programmable output impedance via ZQ pin, and is implemented in a 165-ball FBGA (13 × 15 × 1.4 mm) package for high-density memory subsystems in networking line cards and packet buffering applications.
For engineers reviewing the CG7599AA datasheet, CG7599AA pinout, CG7599AA application, or CG7599AA equivalent, this device requires attention to dual-clock timing (K/K and C/C), echo clock synchronization (CQ/CQ), DOFF-controlled read latency (1 vs. 1.5 cycles), byte-write select mapping (BWS0/BWS1), and HSTL voltage compliance (1.4 V–VDDQ) in high-speed synchronous memory designs.
Technical Context
The CG7599AA implements a synchronous pipelined SRAM core with integrated DDR II peripheral logic, including a 1-bit burst counter that increments A0 to generate sequential 18-bit word addresses on each K-edge. All address, control, and data inputs are registered on rising edges of K and K clocks, enabling precise setup/hold timing at 333 MHz.
Read data is driven synchronously on rising edges of C and C (or K and K in single-clock mode), with echo clocks CQ/CQ phase-aligned to C/C to eliminate board-level skew. The device integrates a PLL for accurate data placement and JTAG 1149.1 test access port for boundary scan validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 18 Mbit (1M × 18 configuration) |
| Clock frequency | 333 MHz - determines maximum sustained bandwidth of 1.2 GB/s (666 MT/s × 18-bit bus) |
| Data rate | 666 MT/s - achieved via double-data-rate transfers on both rising edges of C/C clocks |
| Read latency | 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - directly impacts pipeline depth in controller design |
| Supply voltage | 1.8 V core (VDD), 1.4–1.8 V I/O (VDDQ) - mandates separate power domains and HSTL-compliant termination |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - requires 0.8 mm pitch layout and controlled-impedance routing for signal integrity |
| Output drive | Variable-drive HSTL - impedance tuned via external ZQ resistor (0.2 × RQ) for optimal bus matching |
Pinout & Package
CG7599AA is housed in a 165-ball fine-pitch ball grid array (FBGA) package measuring 13 mm × 15 mm × 1.4 mm, with 0.8 mm ball pitch and RoHS-compliant Pb-free option. Pin assignments follow JEDEC MO-245AC standard for CY7C1318KV18.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[17:0] | Synchronous bidirectional data bus | 18-bit DDR data path; sampled on K/K rising edges during write, driven on C/C rising edges during read |
| K / K | Positive/negative input clocks | Edge-aligned differential pair controlling all synchronous inputs; defines burst initiation and address latching timing |
| C / C | Positive/negative output data clocks | Deskew-capable clocks for read data; used with CQ/CQ to align flight time across multi-device memory channels |
| CQ / CQ | Echo clocks referenced to C/C | Free-running, phase-synchronized outputs enabling source-synchronous capture without per-pin delay calibration |
| DOFF | Read latency mode control | Active-HIGH selects 1.5-cycle latency (DDR II); LOW enables 1-cycle latency (DDR I compatibility) |
| ZQ | Output impedance calibration input | Connects to external resistor to ground to set DQ/CQ driver impedance to 0.2 × RQ; cannot float or tie to GND |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst addressing | Reduces external address bus toggling by 50% - lowers EMI and simplifies controller address generation logic |
| Programmable output impedance (ZQ) | Enables dynamic impedance matching to PCB trace impedance - improves signal integrity without fixed series resistors |
| Integrated echo clocks (CQ/CQ) | Eliminates need for per-SRAM delay calibration in multi-chip modules - reduces FPGA logic overhead for data capture |
| Configurable read latency (DOFF) | Allows runtime selection between DDR-I (1-cycle) and DDR-II (1.5-cycle) modes - supports legacy controller compatibility |
| JTAG 1149.1 boundary scan | Enables in-system verification of interconnect integrity and pin-level fault detection - critical for high-reliability telecom hardware |
Applications
| Packet Buffering in Switch ASICs | Line Card Memory Subsystem |
|---|---|
|
Use Scenario: High-throughput Ethernet switch fabric requiring low-latency, burst-mode memory access for frame queuing and scheduling. IC Role / Device Role / Timing Role: Primary packet buffer SRAM interfacing directly with switch fabric controller using DDR-II timing and echo clocks. Use Value: Two-word burst reduces address bus activity by half, lowering controller complexity and power; 666 MT/s bandwidth sustains 10G+ line rates. |
Use Scenario: Modular telecom line card needing reliable, high-speed local memory for protocol processing and header manipulation. IC Role / Device Role / Timing Role: Synchronous burst SRAM providing deterministic 1-cycle or 1.5-cycle read latency to DSP/FPGA-based packet processors. Use Value: DOFF-selectable latency allows seamless integration with both legacy and next-gen controllers; ZQ calibration ensures stable operation across temperature. |
| Network Processor Data Cache | High-Speed Test Equipment Memory |
|
Use Scenario: On-chip network processor offloading packet classification and flow lookup to external high-bandwidth memory. IC Role / Device Role / Timing Role: Low-latency DDR-II SRAM acting as L2 cache extension with synchronized CQ/CQ capture for error-free data sampling. Use Value: Echo clocks eliminate flight-time mismatch across 18-bit bus, enabling >300 MHz sustained operation without per-bit deskew logic. |
Use Scenario: Automated test equipment requiring deterministic, jitter-tolerant memory access for pattern generation and response capture. IC Role / Device Role / Timing Role: Burst-mode SRAM serving as waveform buffer with precise edge-aligned K/K and C/C timing for sub-nanosecond timing resolution. Use Value: PLL-based data placement ensures consistent setup/hold margins; JTAG support enables production-level interconnect validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1318KV18 | Same die, identical pinout and electrical specs; CG7599AA is Cypress's orderable part number for this device | No functional difference - CG7599AA is the commercial distribution identifier for CY7C1318KV18 | Select CG7599AA when sourcing from authorized distributors; use CY7C1318KV18 for datasheet reference and design-in documentation |
| AS7C3108B-166JIN | Asynchronous 1M × 18 SRAM, 166 MHz max, no DDR, no echo clocks, no ZQ calibration | Limited to lower-bandwidth control-plane buffers where burst and timing precision are not required | Choose only if system lacks DDR clock infrastructure and can tolerate higher latency and reduced bandwidth |
Compared with CY7C1318KV18, CG7599AA offers identical performance and footprint but reflects current Cypress distribution channel branding; versus AS7C3108B-166JIN, it delivers 4× higher bandwidth and deterministic DDR timing essential for data-plane applications.
Availability
CG7599AA is available at Aetrix Electronics and suitable for packet buffering in switch ASICs, line card memory subsystems, network processor data caches, and high-speed test equipment requiring stable component supply and long-term obsolescence management.
Supply support for CG7599AA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CG7599AA belongs to Cypress's DDR II SRAM product line, engineered specifically for high-bandwidth, low-latency data buffering in networking and telecom infrastructure where deterministic timing and signal integrity are critical.
FAQ
What is the function of the DOFF pin on CG7599AA?
The DOFF pin configures read latency mode: when asserted HIGH, it enables DDR II operation with 1.5-cycle read latency; when LOW, it reverts to DDR I behavior with 1-cycle latency. This setting must be stable before initialization and remains effective throughout operation. It does not affect write timing or burst structure.
Can CG7599AA operate with only a single clock domain (K only)?
Yes - CG7599AA supports single-clock mode where K serves as both input and output clock. In this mode, C and C are unused, and read data is driven on rising edges of K and K. However, echo clocks CQ/CQ remain active and referenced to K, preserving source-synchronous capture capability without external deskew circuitry.
How is output impedance calibrated using the ZQ pin?
ZQ connects to an external precision resistor (RQ) tied to ground; the internal circuit sets DQ and CQ driver impedance to 0.2 × RQ. Typical RQ values range from 240 Ω (yielding 48 Ω drive) to 330 Ω (66 Ω). ZQ must never be left floating or tied to GND - connecting to VDDQ enables minimum-impedance mode instead of calibration.
Is CG7599AA pin-compatible with CY7C1320KV18?
No - CG7C1320KV18 is a 512K × 36 device with different pinout: it uses BWS[3:0], has 36-bit DQ[35:0], requires only 19 address bits, and allocates additional balls for BWS2/BWS3 and extra DQ lines. The 165-ball FBGA footprint is shared, but ball functions differ significantly; direct replacement is not possible without PCB redesign.
CG7599AA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CG7599AA FAQ
1.How can I place an order for CG7599AA through Aetrix?
Please submit a Request for Quotation (RFQ) for CG7599AA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CG7599AA reliable?
The price and inventory of CG7599AA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CG7599AA is usually 5 days.
3.What payment methods are accepted for CG7599AA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CG7599AA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CG7599AA?
CG7599AA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CG7599AA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CG7599AA?
For technical support, including CG7599AA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CG7599AA requirements.
6.How does Aetrix verify that CG7599AA is sourced from the original manufacturer or authorized distributors?
All CG7599AA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CG7599AA meets industry standards.
7.What is the process for return or replacement of CG7599AA?
All CG7599AA units undergo pre-shipment inspection (PSI). If there is an issue with CG7599AA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CG7599AA part is unused and in its original packaging.
Return procedure for CG7599AA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CG7599AA Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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Microchip Technology

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Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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