Infineon Technologies CG7611AA
- Part No.:
- CG7611AA
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CG7611AA.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:175
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Product details
Overview
CG7611AA from Cypress Semiconductor is a 36-Mbit DDR II synchronous SRAM with two-word burst architecture, configured as 2M × 18, operating at 333 MHz clock frequency with 666 MHz effective data rate, 1.8 V core supply, and HSTL I/O compatible with 1.5 V/1.8 V IO supply - deployed in high-bandwidth networking packet buffers and telecom line-card memory subsystems.
For engineers reviewing the CG7611AA datasheet, CG7611AA pinout, CG7611AA application, or CG7611AA equivalent, this device requires attention to DOFF-configurable read latency (1 vs. 1.5 cycles), echo clock (CQ/CQ) timing alignment, dual-K/K input clock domain management, and byte-write select (BWS0/BWS1) mapping for 18-bit data width.
Technical Context
The CG7611AA implements a synchronous pipelined SRAM core with DDR II interface logic, using separate K/K input clocks for address/control latching and C/C output clocks for data capture - enabling precise skew control across multi-device memory channels. Its internal burst counter increments on A0 to deliver two consecutive 18-bit words per access.
It supports both single-clock mode (K/K only) and dual-clock mode (C/C + CQ/CQ), with echo clocks tightly aligned to output data edges to eliminate board-level flight-time compensation. The DOFF pin selects between DDR-I (1-cycle latency, DOFF = LOW) and DDR-II (1.5-cycle latency, DOFF = HIGH) operation modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 36 Mbit (2M × 18 configuration) |
| Max Clock Frequency | 333 MHz - defines maximum sustained bandwidth of 1.2 GB/s (666 MT/s × 18-bit) |
| Read Latency | 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - directly impacts pipeline depth in controller design |
| Core Supply | 1.8 V ± 0.1 V - mandates dedicated low-noise 1.8 V rail with tight regulation |
| I/O Interface | HSTL Class I - requires 1.4–1.8 V VDDQ, matched termination, and ZQ calibration via external resistor |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count DDR SRAMs in dense PCB layouts |
| Burst Mode | Two-word linear burst - reduces address bus toggling by 50% versus single-word addressing |
Pinout & Package
CG7611AA is housed in a 165-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 13 mm × 15 mm × 1.4 mm, with 0.8 mm ball pitch and Pb-free option available. Pin assignments follow CY7C1418KV18 layout per datasheet 001-57827 Rev. *L.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[17:0] | Synchronous bidirectional data bus | 18-bit DDR data path; inputs sampled on K/K rising edges, outputs driven on C/C rising edges with echo-clock alignment |
| K / K | Positive/negative input clocks | Used for all synchronous input sampling (address, R/W, LD, BWS); K rising edge initiates all transactions |
| C / C | Positive/negative output data clocks | Drive read data; paired with CQ/CQ to deskew flight time across multiple SRAMs in parallel topology |
| CQ / CQ | Echo clocks | Free-running, phase-aligned copies of C/C; enable source-synchronous capture without controller-side delay tuning |
| DOFF | DDR mode select | LOW enables DDR-I (1-cycle latency); HIGH enables DDR-II (1.5-cycle latency) - sets internal pipeline staging |
| ZQ | Output impedance calibration input | Connects to external resistor to ground (RQ) to calibrate DQ/CQ driver strength to 0.2 × RQ; critical for signal integrity |
| LD | Load strobe | Active-low synchronous enable; latches address and R/W on next K rising edge - defines start of burst transaction |
| BWS0 / BWS1 | Byte write selects | Active-low controls DQ[8:0] (BWS0) and DQ[17:9] (BWS1); allows partial-word writes without read-modify-write overhead |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Halves address bus transitions per data word, reducing routing congestion and EMI in high-speed backplanes |
| Programmable read latency (1 or 1.5 cycles) | Enables optimization for either minimal latency (DOFF = LOW) or tighter timing margin (DOFF = HIGH) in controller firmware |
| Integrated echo clocks (CQ/CQ) | Eliminates need for per-SRAM trace-length matching; simplifies PCB layout and timing closure in multi-chip memory modules |
| HSTL I/O with ZQ calibration | Ensures consistent 25–35 Ω output impedance across voltage/temperature, maintaining signal fidelity up to 666 MT/s |
| JTAG 1149.1 test access port | Supports boundary scan testing and in-system diagnostics without requiring additional test fixtures or probes |
Applications
| Telecom Line Cards | High-Speed Packet Buffers |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in 10G/25G Ethernet switch fabric ASIC interfaces. IC Role / Device Role / Timing Role: Low-latency, burst-mode SRAM acting as first-level packet buffer with deterministic 1-cycle read response when DOFF = LOW. Use Value: Enables line-rate forwarding without pipeline stalls; 18-bit width matches common header field widths (e.g., VLAN+MAC+IP+TCP fields). |
Use Scenario: Buffering variable-length packets in network intrusion detection systems (IDS) with real-time deep packet inspection. IC Role / Device Role / Timing Role: Synchronous DDR II SRAM providing burst-aligned data streaming to FPGA-based pattern match engines. Use Value: Two-word burst reduces controller address generation overhead by 50%, increasing effective throughput under bursty traffic loads. |
| Baseband Processing Units | Radar Signal Processing Modules |
|
Use Scenario: Temporary storage of OFDM symbol data during LTE/5G physical layer processing in wireless base stations. IC Role / Device Role / Timing Role: High-bandwidth memory interfacing directly with DSP or ASIC FFT accelerators via HSTL bus. Use Value: 333 MHz clock + DDR yields 1.2 GB/s bandwidth - sufficient for 2×2 MIMO symbol buffering at 100 MHz sampling rates. |
Use Scenario: Capturing and staging chirp samples in phased-array radar front-ends before FFT computation. IC Role / Device Role / Timing Role: Burst-access SRAM synchronized to ADC sampling clock via K/K, with echo clocks (CQ/CQ) easing FPGA capture timing. Use Value: ZQ-calibrated HSTL outputs maintain signal integrity across 15 cm traces at 666 MT/s, avoiding eye closure in wide temperature ranges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1418KV18 | Same die, identical pinout and electrical specs; CG7611AA is Cypress's orderable part number for this configuration | No functional difference - CG7611AA is the commercial-grade marking for CY7C1418KV18 in 165-ball FBGA | Select CG7611AA for standard industrial temperature range (–40°C to +85°C) and full Cypress warranty/support |
| AS7C33618A-333BNI | 36-Mbit DDR II SRAM (2M × 18), 333 MHz, but uses SSTL-18 I/O instead of HSTL; no ZQ calibration or echo clocks | Lacks CQ/CQ and ZQ - requires manual impedance tuning and stricter board-level timing closure | Choose only if existing system uses SSTL-18 infrastructure and controller lacks echo clock support |
Compared with CY7C1418KV18, CG7611AA offers identical functionality with certified industrial qualification; versus AS7C33618A-333BNI, it delivers superior signal integrity via ZQ calibration and eliminates timing uncertainty through echo clocks - critical for multi-drop DDR bus designs.
Availability
CG7611AA is available at Aetrix Electronics and suitable for telecom line cards, high-speed packet buffers, baseband processing units, and radar signal processing modules requiring stable component supply, long-lifecycle support, and guaranteed traceability.
Supply support for CG7611AA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
CG7611AA belongs to Cypress's DDR II SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth memory interfacing in networking and signal processing systems where burst efficiency and timing precision are critical.
FAQ
What is the function of the DOFF pin on CG7611AA?
The DOFF (DDR Off) pin configures the device's read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle read latency; when LOW, it reverts to DDR-I mode with 1-cycle latency. This selection directly affects the internal pipeline staging and must be set before initialization and held stable during operation.
Can CG7611AA operate without C and C output clocks?
Yes - CG7611AA supports single-clock mode where K and K serve as both input and output clocks. In this mode, read data is driven on K/K rising edges, and CQ/CQ are generated relative to K/K. However, echo-clock benefits (flight-time deskewing) are lost, requiring tighter PCB trace length matching.
How is output impedance calibrated using the ZQ pin?
ZQ connects to an external precision resistor (RQ) tied to ground; the device measures RQ and adjusts its DQ and CQ driver strength to 0.2 × RQ, achieving 25–35 Ω output impedance. Connecting ZQ directly to VDDQ enables minimum impedance mode (~17 Ω); floating or grounding ZQ is prohibited and may damage the device.
Is CG7611AA pin-compatible with CY7C1420KV18?
No - CG7611AA (2M × 18) and CY7C1420KV18 (1M × 36) have different data widths, address counts (21 vs. 20), BWS pin count (2 vs. 4), and distinct FBGA pin mappings. Their ballouts are incompatible; migration requires PCB redesign and firmware address logic changes.
CG7611AA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CG7611AA FAQ
1.How can I place an order for CG7611AA through Aetrix?
Please submit a Request for Quotation (RFQ) for CG7611AA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CG7611AA reliable?
The price and inventory of CG7611AA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CG7611AA is usually 5 days.
3.What payment methods are accepted for CG7611AA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CG7611AA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CG7611AA?
CG7611AA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CG7611AA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CG7611AA?
For technical support, including CG7611AA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CG7611AA requirements.
6.How does Aetrix verify that CG7611AA is sourced from the original manufacturer or authorized distributors?
All CG7611AA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CG7611AA meets industry standards.
7.What is the process for return or replacement of CG7611AA?
All CG7611AA units undergo pre-shipment inspection (PSI). If there is an issue with CG7611AA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CG7611AA part is unused and in its original packaging.
Return procedure for CG7611AA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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