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Infineon Technologies CG7618AA

Part No.:
CG7618AA
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCG7618AA.pdf
Description:
IC SRAM 36MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:160

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Product details

Overview

CG7618AA from Cypress Semiconductor is a 36-Mbit DDR II synchronous SRAM configured as 2M × 18, operating at 333 MHz with double-data-rate interface (666 MT/s), 1.8 V core supply, and HSTL I/O compatible with 1.5 V or 1.8 V VDDQ. It implements two-word burst addressing, echo clocks (CQ/CQ), and PLL-based data placement for high-speed networking buffers and packet memory in telecom line cards.

For engineers reviewing the CG7618AA datasheet, CG7618AA pinout, CG7618AA application, or CG7618AA equivalent, this device supports precise DDR timing via dual K/K and C/C clocks, offers programmable output impedance via ZQ, enables byte-selectable writes with BWS[1:0], and delivers 1.5-cycle read latency when DOFF = HIGH - critical for deterministic latency in real-time switching fabric designs.

Technical Context

The CG7618AA integrates a pipelined SRAM core with synchronous peripheral logic, using rising edges of complementary K/K clocks to latch addresses and write data, and C/C clocks to drive read data with matched flight time. Its burst counter increments A0 internally to deliver two consecutive 18-bit words per access.

It supports both dual-clock (K/K + C/C) and single-clock (K/K only) modes, with echo clocks CQ/CQ phase-aligned to C/C for simplified data capture. The ZQ pin calibrates output driver impedance to 0.2 × RQ (RQ tied to ground), ensuring signal integrity on high-speed parallel buses.

Key Specifications

Parameter Value and Actual Design Meaning
Density & Organization 36 Mbit / 2M × 18 - provides 2 million 18-bit words for deep packet buffering in Layer 2/3 switches.
Max Clock Frequency 333 MHz - enables 666 MT/s effective throughput, matching OC-192/STM-64 interface bandwidth requirements.
Read Latency 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable for trade-off between timing margin and pipeline depth in ASIC/FPGA co-designs.
Supply Voltages 1.8 V core (VDD), 1.4–1.8 V I/O (VDDQ) - supports mixed-voltage system integration with FPGA I/O banks and legacy 1.5 V memory interfaces.
Interface Standard HSTL Class I inputs / outputs - ensures compatibility with Xilinx Virtex-5/7 and Intel Stratix IV/V memory controllers without level-shifting.
Package 165-ball FBGA (13 × 15 × 1.4 mm) - surface-mount footprint optimized for high-density routing and thermal dissipation in multi-layer telecom PCBs.
Timing Reference Dual-edge clocking (K/K, C/C) with echo clocks CQ/CQ - eliminates board-level skew compensation and simplifies timing closure in multi-device memory subsystems.

Pinout & Package

CG7618AA is housed in a 165-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 13 mm × 15 mm × 1.4 mm, with 0.8 mm ball pitch and Pb-free option available. Pin assignments follow JEDEC MO-245AC standard.

Pin/Terminal Circuit Role Design Meaning
DQ[17:0] Synchronous bidirectional data bus 18-bit DDR data path; sampled on K/K rising edges during writes, driven on C/C rising edges during reads - supports burst-2 transfers without address re-latching.
K / K Complementary input clocks Primary timing reference for all synchronous inputs (address, R/W, LD, BWS); rising edges capture control and data - enables precise setup/hold timing in high-frequency systems.
C / C Complementary output clocks Source-synchronous clocks for read data; used with CQ/CQ to deskew flight time across multiple SRAMs - critical for deterministic read capture in multi-chip memory modules.
CQ / CQ Echo clocks Free-running, phase-aligned copies of C/C; referenced to same source as output data - allow controller to sample Q[17:0] using local CQ/CQ instead of global C/C, reducing jitter sensitivity.
DOFF Read latency mode select Active-HIGH selects 1.5-cycle latency (DDR-II mode); LOW enables 1-cycle latency (DDR-I compatibility) - configurable per system timing budget without hardware change.
ZQ Output impedance calibration input Connects to external resistor (RQ) to ground; sets DQ/CQ driver impedance to 0.2 × RQ - ensures consistent signal integrity across voltage/temperature corners without manual tuning.

Key Features

Feature Design Value
Two-word burst architecture Reduces address bus toggling by 50% versus single-word SRAMs - lowers EMI and simplifies address routing in high-pin-count FPGA interfaces.
Programmable output drive strength HSTL output buffers adjustable via ZQ calibration - maintains signal fidelity across trace lengths up to 8 inches on FR-4, eliminating need for external termination resistors.
Phase-locked loop (PLL) Aligns internal data launch timing to C/C edges with sub-100 ps jitter - enables reliable operation at 333 MHz with <0.3 UI timing margin in worst-case PVT conditions.
JTAG 1149.1 test access port Supports boundary scan testing of interconnects to FPGA/memory controller - reduces debug time for solder joint failures and routing errors in production test.
Byte write select (BWS[1:0]) Independent control of DQ[8:0] and DQ[17:9] - allows partial-word updates without read-modify-write cycles, essential for header editing in packet processing pipelines.

Applications

Telecom Line Card Buffer High-Speed Packet Switching

Use Scenario: Storing ingress/egress packet headers and metadata in OC-192 SONET/SDH line cards requiring low-latency, deterministic access.

IC Role / Device Role / Timing Role: Dual-port-like burst SRAM acting as first-level packet buffer, synchronized to line-rate clock domain via K/K and C/C.

Use Value: 1.5-cycle latency mode (DOFF = HIGH) guarantees bounded read response within 4.5 ns at 333 MHz - meets SONET frame alignment timing constraints.

Use Scenario: Temporary storage of fragmented IP packets in multi-gigabit Ethernet switches before reassembly or forwarding decision.

IC Role / Device Role / Timing Role: High-bandwidth memory node interfaced to FPGA-based switch fabric, using echo clocks CQ/CQ for glitch-free data capture.

Use Value: Two-word burst transfers reduce memory controller address arbitration overhead by 50%, increasing effective throughput to 10.6 Gbps (666 MT/s × 18 bits).

Network Processor Co-Processor Memory Real-Time Protocol Analyzer Buffer

Use Scenario: Offloading packet classification and lookup table storage from network processor cores in DPI appliances.

IC Role / Device Role / Timing Role: Synchronous SRAM providing zero-wait-state access to TCAM shadow tables and flow state entries.

Use Value: HSTL I/O compatibility with 1.5 V VDDQ allows direct connection to NPU memory ports without level shifters - reducing BOM cost and board area.

Use Scenario: Capturing full-duplex 10G Ethernet traffic streams for real-time protocol conformance analysis and error injection.

IC Role / Device Role / Timing Role: Deep FIFO replacement with burst-access capability, controlled via FPGA logic using LD and R/W signals.

Use Value: Programmable ZQ impedance matching maintains signal integrity across temperature range (–40°C to +85°C), ensuring stable capture at sustained 666 MT/s.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1416KV18 18-Mbit (1M × 18), 250 MHz max frequency, no PLL, 1-cycle fixed latency Limited to lower-bandwidth applications (e.g., Gigabit Ethernet MAC buffers); lacks echo clocks and ZQ calibration Select when cost-sensitive designs tolerate reduced bandwidth and relaxed timing margins.
IS45S16160F-75BLI 256-Mbit SDR SDRAM (16M × 16), 133 MHz, asynchronous refresh, no burst-2 or echo clocks Requires external refresh controller and lacks deterministic latency - unsuitable for real-time packet buffering Consider only for non-real-time bulk storage where latency variability is acceptable.

Compared with CY7C1416KV18 and IS45S16160F-75BLI, CG7618AA uniquely delivers 333 MHz DDR-II performance with echo clocks and ZQ calibration - enabling deterministic, high-fidelity memory access in telecom and networking equipment where timing predictability is non-negotiable.

Availability

CG7618AA is available at Aetrix Electronics and suitable for telecom line card design, high-speed packet switching, network processor co-processing, and real-time protocol analysis requiring stable component supply across extended product lifecycles.

Supply support for CG7618AA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CG7618AA belongs to Cypress's DDR II SRAM product line, engineered specifically for deterministic, low-latency memory subsystems in carrier-grade networking infrastructure where signal integrity and timing precision are mission-critical.

FAQ

What is the function of the DOFF pin on CG7618AA?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle latency for improved timing margin; when LOW, it reverts to DDR-I behavior with 1-cycle latency. This setting directly affects the number of clock cycles between address assertion and valid data output, and must be held stable during operation.

Can CG7618AA operate without external C/C clocks?

Yes - CG7618AA supports single-clock mode where K/K serve as both input and output clocks. In this configuration, read data is driven on K/K rising edges instead of C/C, and echo clocks CQ/CQ are derived from K/K. However, dual-clock mode is required to achieve full timing margin and deskew benefits in multi-device systems.

How does ZQ calibration affect signal integrity?

ZQ calibration adjusts the output driver impedance of DQ and CQ pins to match the system data bus (typically 50 Ω). By connecting an external resistor RQ (e.g., 240 Ω) from ZQ to ground, the device sets its output impedance to 0.2 × RQ = 48 Ω - minimizing reflections and maintaining clean eye diagrams at 666 MT/s, especially over long PCB traces.

Is CG7618AA pin-compatible with CY7C1420KV18?

No - CG7618AA (2M × 18) and CY7C1420KV18 (1M × 36) share the same 165-ball FBGA package but differ in pin mapping: BWS[3:0] and DQ[35:0] occupy different ball locations, and address count differs (21 vs. 20 bits). Interchange requires PCB redesign and firmware adaptation due to distinct data width and burst addressing logic.

CG7618AA Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
300 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CG7618AA FAQ

1.How can I place an order for CG7618AA through Aetrix?

Please submit a Request for Quotation (RFQ) for CG7618AA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CG7618AA reliable?

The price and inventory of CG7618AA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CG7618AA is usually 5 days.

3.What payment methods are accepted for CG7618AA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CG7618AA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CG7618AA?

CG7618AA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CG7618AA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CG7618AA?

For technical support, including CG7618AA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CG7618AA requirements.

6.How does Aetrix verify that CG7618AA is sourced from the original manufacturer or authorized distributors?

All CG7618AA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CG7618AA meets industry standards.

7.What is the process for return or replacement of CG7618AA?

All CG7618AA units undergo pre-shipment inspection (PSI). If there is an issue with CG7618AA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CG7618AA part is unused and in its original packaging.

Return procedure for CG7618AA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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