Infineon Technologies CG7703AA

Overview

CG7703AA from Infineon Technologies (formerly Cypress) is a 36-Mbit DDR II+ SRAM with 2M × 18 organization, 550 MHz clock frequency, 2.5-cycle read latency (DOFF = HIGH), on-die termination (ODT), and HSTL I/O interface. It serves as a high-bandwidth synchronous pipelined memory buffer in network packet buffers and baseband processing subsystems.

For engineers reviewing the CG7703AA datasheet, CG7703AA pinout, CG7703AA application, or CG7703AA equivalent, key selection criteria include DDR II+ burst timing compliance, ODT configuration for D/BWS/K inputs, echo clock (CQ/CQ) synchronization, QVLD validity signaling, and 165-ball FBGA (13 × 15 × 1.4 mm) mechanical integration.

Technical Context

The device implements a dual-clock DDR architecture where K and K control all synchronous inputs and outputs; address and R/W are latched on K rising edges, while write data is registered on both K and K edges. Read data is driven on both clock edges with precise alignment to echo clocks CQ/CQ.

It integrates a PLL for accurate data placement, supports programmable ODT ranges via ZQ resistor and ODT pin state, and uses synchronous self-timed writes. The DOFF pin selects between DDR II+ (2.5-cycle latency) and DDR I (1-cycle latency) operation modes - a hardware-configurable timing behavior critical for system-level latency budgeting.

Key Specifications

Pinout & Package

CG7703AA is housed in a 165-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 13 mm × 15 mm × 1.4 mm, with 0.8 mm ball pitch and Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Compared with CY7C2268KV18, CG7703AA offers identical functionality with Infineon's long-term supply assurance; versus AS7C362000B-15JIN, it delivers 57% higher bandwidth, integrated signal integrity features, and deterministic 2.5-cycle latency - essential for next-generation packet and signal processing systems.

Availability

CG7703AA is available at Aetrix Electronics and suitable for network packet buffers, baseband signal processor caches, and high-speed test equipment requiring stable component supply and long-term manufacturability.

Supply support for CG7703AA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for automotive, industrial, and communications markets.

CG7703AA belongs to Infineon's high-performance SRAM product line, designed specifically for deterministic, low-latency memory interfacing in networking infrastructure and wireless baseband subsystems.

FAQ

What is the function of the DOFF pin on CG7703AA?

The DOFF (Double-Off) pin configures the device's read latency mode: when asserted HIGH, it enables DDR II+ operation with 2.5-cycle read latency; when LOW or tied to VSS, it reverts to DDR I mode with 1-cycle latency. This hardware-selectable feature allows system designers to optimize timing margins without firmware changes or layout modifications.

How does on-die termination (ODT) work on CG7703AA?

ODT on CG7703AA applies programmable termination resistance to DQ[17:0], BWS[1:0], K, and K inputs using an internal switched resistor network. The ODT pin selects between two ranges (RQ/3.33 or RQ/1.66), calibrated against the external ZQ resistor. This eliminates discrete termination components, reduces PCB layer count, and improves signal fidelity at 550 MHz.

Can CG7703AA operate with 1.5 V VDDQ?

Yes - CG7703AA supports VDDQ from 1.4 V to 1.8 V, including 1.5 V operation. Its HSTL-compatible I/O buffers maintain specified AC timing and drive strength across this range, enabling interoperability with 1.5 V FPGA I/O banks and simplifying mixed-voltage system design without level shifters.

What is the role of CQ and CQ echo clocks?

CQ and CQ are free-running, edge-aligned output clocks synchronized to K and K respectively. They provide source-synchronous timing references for capturing DQ[17:0] read data, eliminating board-level clock-to-data skew and relaxing PCB routing constraints. Their phase relationship is guaranteed by internal PLL alignment, not external layout.