Infineon Technologies CG7774AA

Overview

CY62167DV30 from Cypress Semiconductor is a 16-Mbit (1 M × 16) MoBL® CMOS static RAM with ultra-low active current (2 mA typical at 1 MHz), wide V_CC range (2.2–3.6 V), and automatic power-down reducing standby current to 2.5 µA. It supports byte-wide access via BHE/ BLE controls and operates in industrial temperature range (–40°C to +85°C), deployed in battery-powered portable electronics including cellular handsets and handheld medical devices.

For engineers reviewing the CY62167DV30 datasheet, CY62167DV30 pinout, CY62167DV30 application, or CY62167DV30 equivalent, key selection criteria include its dual-configurable memory organization (1M×16 or 2M×8), TSOP-I/VFBGA package options, low-voltage operation, fast 55-ns access, and deterministic power-down behavior under CE/BHE/ BLE control.

Technical Context

The CY62167DV30 implements a fully static 1M × 16 SRAM array with independent byte enable logic for I/O_0–7 (BLE) and I/O_8–15 (BHE), enabling flexible 8-bit or 16-bit data bus interfacing. Its power-down circuit activates when CE1 is HIGH or CE2 is LOW - reducing ICC to ≤2.5 µA - and remains stable across full V_CC (2.2–3.6 V) and temperature (–40°C to +85°C).

Read and write operations are controlled by synchronous assertion of CE1/CE2, OE/WE, and byte enables, with timing governed by tRC = 55 ns (min), tAA = 55 ns (min), and tDOE = 25 ns (min). All I/O pins enter high-Z state during deselect, output disable, or write cycles, ensuring clean bus sharing in multi-peripheral systems.

Key Specifications

Pinout & Package

Available in two RoHS-compliant packages: 48-ball VFBGA (7 mm × 9 mm, 0.8 mm pitch) and 48-pin TSOP-I (12 mm × 20 mm, 0.5 mm pitch). Both support identical pin functions and memory configuration modes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Compared with IS61LV102416AL and AS6C1008-55TIN, the CY62167DV30 uniquely combines ultra-low standby current, dual-voltage operation, and hardware-managed power-down - eliminating firmware overhead while supporting flexible bus widths in space-constrained portable designs.

Availability

CY62167DV30 is available at Aetrix Electronics and suitable for cellular handset baseband, portable medical monitors, and industrial HMI panels requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for CY62167DV30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, low-power memory and programmable solutions for embedded systems, with headquarters in San Jose, CA.

The MoBL® (More Battery Life) SRAM product line targets portable and energy-sensitive applications, emphasizing ultra-low ICC and ISB across extended voltage ranges without sacrificing speed or reliability.

FAQ

What is the minimum V_CC required for data retention on CY62167DV30?

The CY62167DV30 guarantees data retention down to V_CC = 1.5 V, with maximum data retention current of 10 µA at that voltage. This allows safe suspend-to-RAM operation during brown-out conditions or deep-sleep states in battery-powered systems without external backup capacitors.

Can CY62167DV30 operate in 2M×8 mode using the VFBGA package?

Yes - the VFBGA package supports 2M×8 configuration by asserting BLE = LOW and BHE = HIGH (or vice versa) and using A0–A19 plus A20 (mapped internally) for full 21-bit addressing. Unlike TSOP-I, no external BYTE pin tie is required; configuration is controlled entirely by BHE/ BLE logic levels and address decoding.

How does automatic power-down activate when both CE1 and CE2 are driven?

Automatic power-down triggers if CE1 ≥ V_CC – 0.2 V (i.e., logic HIGH) OR CE2 ≤ 0.2 V (i.e., logic LOW). The condition is OR-based - only one signal needs to violate its active window. During this state, ICC drops to ≤2.5 µA and all I/Os enter high-Z, independent of OE, WE, or BHE/ BLE states.

Is the CY62167DV30 pin-compatible with earlier CY62167EV30 variants?

No - CY62167DV30 uses updated pinouts in both TSOP-I and VFBGA packages versus the EV30 generation, particularly in CE2, BHE, and BLE placement. Signal mapping differs, and AC timing parameters (e.g., tDOE, tHZOE) are tightened. Migration requires PCB layout revision and timing validation per Rev. *M datasheet.