Infineon Technologies CG7774AAT

Overview

CY62167DV30 from Cypress Semiconductor is a 16-Mbit (1 M × 16) MoBL® CMOS static RAM with configurable organization (1 M × 16 or 2 M × 8), 2.2 V–3.6 V supply range, 55 ns/70 ns access time, ultra-low active current (2 mA at 1 MHz), and automatic power-down reducing standby current to 2.5 µA. It serves as main data buffer in battery-powered handheld devices requiring non-volatile retention support.

For engineers reviewing the CY62167DV30 datasheet, CY62167DV30 pinout, CY62167DV30 application, or CY62167DV30 equivalent, key selection criteria include byte-enable-controlled partial-word writes, dual chip enable logic (CE1/CE2), low-voltage operation down to 2.2 V, and VFBGA/TSOP-I package compatibility with space-constrained PCB layouts.

Technical Context

The CY62167DV30 implements a high-density SRAM array with independent Byte High Enable (BHE) and Byte Low Enable (BLE) inputs enabling true 8-bit sub-word access without external logic. Its dual CE architecture (CE1 active-low, CE2 active-high) supports hierarchical memory decoding and seamless expansion across multiple banks.

Automatic power-down activates when CE1 is HIGH or CE2 is LOW, reducing ICC to ≤2.5 µA at 3.6 V - a 99% reduction versus active mode. Data retention remains valid down to VCC = 1.5 V, with tCDR = 0 ns and tR = 55/70 ns for rapid wake-up from retention mode.

Key Specifications

Pinout & Package

Available in 48-ball VFBGA (6 mm × 8 mm) and 48-pin TSOP-I (12 mm × 20 mm) packages. Both support identical pin functions with minor routing differences (e.g., BYTE pin tied to VCC in TSOP-I for 1 M × 16 mode).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Compared with IS61WV102416BLL-10MLI and AS6C4008-55PCN, the CY62167DV30 uniquely combines wide-voltage operation (2.2–3.6 V), sub-µA-class standby, and hardware-configurable organization - making it optimal for battery-powered systems where voltage headroom and autonomous power management are critical.

Availability

CY62167DV30 is available at Aetrix Electronics and suitable for portable medical monitors, industrial data loggers, handheld barcode scanners, and automotive infotainment head units requiring stable component supply across extended product lifecycles.

Supply support for CY62167DV30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, emphasizing low-power innovation and automotive-grade reliability.

The MoBL® (More Battery Life) SRAM product line targets portable electronics requiring extended runtime, featuring adaptive power-down, wide-VCC tolerance, and compact packaging for space-constrained designs.

FAQ

What is the minimum VCC required to retain data in CY62167DV30?

The CY62167DV30 guarantees data retention down to VCC = 1.5 V. At this voltage, ICCDR remains ≤10 µA, and tCDR is 0 ns - meaning retention begins immediately upon entering standby. This enables reliable operation during brown-out conditions or backup battery transitions without external supervision.

Can CY62167DV30 operate in 2 M × 8 mode using the TSOP-I package?

Yes. In the 48-pin TSOP-I package, tying the BYTE pin to VSS configures the device as 2 M × 8. Pin 45 becomes A20, while BHE, BLE, and I/O8–I/O14 become DNU (do not use). The VFBGA package does not support 2 M × 8 mode due to fixed pin mapping and absence of BYTE pin.

How does automatic power-down activate without firmware intervention?

Automatic power-down triggers when CE1 is HIGH or CE2 is LOW - no clock or address activity monitoring is required. The internal circuit detects static address lines and disables core logic, reducing ICC to ≤2.5 µA. This occurs independently of OE, WE, or BHE/BLE states, ensuring zero-software overhead power savings.

What is the role of the DNU pins in the VFBGA package?

In the 48-ball VFBGA, balls labeled DNU (Do Not Use) are unconnected on-die and must remain floating. These include two balls designated "DNU" in the pinout diagram - connecting them risks signal coupling or unintended current paths. No pull-up/down or routing is permitted per Cypress design guidelines.