Texas Instruments CLVC16T245MDGGREP
- Part No.:
- CLVC16T245MDGGREP
- Manufacturer:
- Texas Instruments
- Package:
- 48-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
CLVC16T245MDGGREP.pdf
- Description:
- IC TRANSLATOR BIDIR 48TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CLVC16T245MDGGREP from Texas Instruments is a 16-bit dual-supply bus transceiver with configurable voltage translation and 3-state outputs, designed for bidirectional level-shifting between 1.65-V to 5.5-V domains. It features two independent 8-bit sections (A/B), VCC isolation, Ioff partial-power-down support, and operates across –55°C to 125°C - enabling robust mixed-voltage interconnect in aerospace data buses.
For engineers reviewing the CLVC16T245MDGGREP datasheet, CLVC16T245MDGGREP pinout, CLVC16T245MDGGREP application, or CLVC16T245MDGGREP equivalent, key selection criteria include dual-rail voltage flexibility (VCCA/VCCB = 1.65–5.5 V), guaranteed high-impedance on power loss, overvoltage-tolerant I/Os up to 6.5 V, and military-grade temperature performance.
Technical Context
The CLVC16T245MDGGREP implements asynchronous bidirectional data flow via per-section DIR and OE controls referenced to VCCA. Each 8-bit port (A and B) tracks its respective supply rail, enabling simultaneous operation at different voltages - e.g., A port at 1.8 V and B port at 3.3 V - without external logic or level-shifters.
Its VCC isolation feature forces both ports into high-impedance when either VCCA or VCCB is at GND, preventing backdrive during power sequencing. The Ioff circuitry limits off-state current to ±10 µA, supporting safe partial-power-down in systems with staggered supply activation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCCA / VCCB Range | 1.65 V to 5.5 V - enables universal translation among 1.8-V, 2.5-V, 3.3-V, and 5-V logic domains |
| Operating Temperature | –55°C to 125°C - qualified for defense, aerospace, and extended-life industrial applications |
| Ioff Current | ±10 µA max - prevents damaging back-current during partial power-down |
| VOH / VOL (3.3 V) | VOH ≥ 2.35 V @ –24 mA, VOL ≤ 0.65 V @ 24 mA - ensures clean TTL/CMOS-compatible output swing |
| tPLH / tPHL (A→B, 3.3 V) | 0.8 ns min / 6.1 ns max - supports >100-MHz data rates in high-speed bus bridging |
| ESD Rating | 2000-V HBM, 200-V MM, 1000-V CDM - meets MIL-STD-883 Class II latch-up and ESD requirements |
| Package | TSSOP-48 (DGG) - 12.6 mm × 6.1 mm footprint with 0.5-mm pitch, optimized for high-density PCB layouts |
Pinout & Package
TSSOP-48 (DGG) package: 12.6 mm × 6.1 mm body, 0.5-mm lead pitch, 1.2-mm max height, JEDEC MO-153 compliant. RoHS-compliant NiPdAu lead finish, MSL Level-1 (260°C peak reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1DIR, 2DIR | Direction control input (per 8-bit section) | Referenced to VCCA; determines data flow direction (A→B or B→A) for each half |
| 1OE, 2OE | Output-enable input (per 8-bit section) | Active-low; places corresponding port outputs in high-impedance when high |
| 1A1–1A8, 2A1–2A8 | A-port data I/Os | Track VCCA; accept and drive signals within VCCA range; overvoltage tolerant to 6.5 V |
| 1B1–1B8, 2B1–2B8 | B-port data I/Os | Track VCCB; bidirectionally translate against A port; overvoltage tolerant to 6.5 V |
| VCCA, VCCB | Independent power supplies | Enable true dual-rail operation; VCC isolation ensures Hi-Z if either supply is at GND |
| GND (×6) | Ground terminals | Distributed grounding improves noise immunity and thermal dissipation in high-speed switching |
Key Features
| Feature | Design Value |
|---|---|
| Fully configurable dual-rail architecture | Each port independently powered (VCCA/VCCB = 1.65–5.5 V), eliminating need for external level translators |
| VCC isolation | Guaranteed high-impedance state on both ports if either VCCA or VCCB = GND - simplifies power sequencing |
| Ioff partial-power-down support | Blocks current backflow during power-off states, protecting upstream drivers and meeting MIL-STD-704 compliance |
| Overvoltage-tolerant I/Os | Withstands up to 6.5 V on any I/O regardless of VCCA/VCCB - enables hot-swap and mixed-voltage system resilience |
| Military-grade qualification | Controlled baseline, extended lifecycle, traceable sourcing, and –55°C to 125°C operation per V62/12667-01XE |
Applications
| Avionics Data Bus Interface | Satellite Onboard Computer Interconnect |
|---|---|
Use Scenario: Bridging legacy 5-V ARINC 429 receivers with modern 1.8-V FPGA-based processing units in flight control systems. IC Role / Device Role / Timing Role: Bidirectional voltage translator and bus isolator, ensuring signal integrity across supply domains while maintaining deterministic timing. Use Value: Eliminates discrete resistor-divider networks and reduces board area by 65% versus discrete solutions, with guaranteed 27.4-ns max propagation delay at 125°C. | Use Scenario: Interfacing radiation-hardened 3.3-V microcontrollers with 2.5-V memory subsystems in LEO satellite payloads. IC Role / Device Role / Timing Role: Dual-rail transceiver providing fault-tolerant data path with VCC isolation during solar-induced supply glitches. Use Value: Prevents latch-up and data corruption during transient brownouts; Ioff < ±10 µA ensures no leakage-induced bit flips in memory buffers. |
| Defense Radar Signal Processing Backplane | Medical Imaging Sensor Hub |
Use Scenario: Connecting high-speed 5-V ADC front-ends to low-power 1.65-V DSP cores in phased-array radar modules. IC Role / Device Role / Timing Role: Low-jitter, high-drive-strength bus transceiver with sub-7-ns propagation delay at 3.3 V, synchronized to system clock domain. Use Value: Maintains SNR > 72 dB across full bandwidth by minimizing ground bounce and crosstalk via distributed GND pins and controlled slew rate. | Use Scenario: Aggregating multi-modal sensor data (ultrasound, ECG, SpO₂) from mixed-voltage analog front-ends into a unified 3.3-V digital hub. IC Role / Device Role / Timing Role: Isolated, ESD-hardened interface IC that guarantees data coherency during hot-plug insertion of diagnostic probes. Use Value: 2000-V HBM ESD rating and 100 mA latch-up immunity meet IEC 60601-1 safety requirements without additional protection circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-supply bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC16T245QPWREP | Same electrical specs; uses 48-pin QFN (PW) package with exposed thermal pad | Better thermal performance (θJCbot = 3.5°C/W vs. TSSOP's 27.1°C/W) but requires solder paste stencil optimization | Select for high-power-density designs needing lower junction temperature rise under continuous 32-mA drive |
| SN74AVC16T245ZQLR | Lower VCC range (1.2–3.6 V), faster tPLH (0.3 ns typ), higher ICCZ (20 µA vs. 10 µA) | Optimized for ultra-low-voltage mobile SoC interconnect; not rated for –55°C to 125°C or aerospace use | Select only for commercial-grade, battery-powered applications where extended temperature and military qualification are unnecessary |
Compared with SN74LVC16T245QPWREP and SN74AVC16T245ZQLR, CLVC16T245MDGGREP uniquely combines military temperature range, VCC isolation, and TSSOP manufacturability - making it the sole choice for defense/aerospace programs requiring traceable, extended-lifecycle components in standard surface-mount packages.
Availability
CLVC16T245MDGGREP is available at Aetrix Electronics and suitable for avionics data buses, satellite onboard computers, defense radar backplanes, and medical imaging sensor hubs requiring stable component supply across extended temperature and long product lifecycles.
Supply support for CLVC16T245MDGGREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity technologies for industrial, automotive, and aerospace markets.
The CLVC16T245MDGGREP belongs to TI's enhanced-product (EP) logic family, engineered specifically for high-reliability applications demanding extended temperature operation, controlled manufacturing baselines, and full traceability - targeting defense, space, and critical medical systems.
FAQ
What is the maximum allowable voltage on CLVC16T245MDGGREP I/O pins when VCCA = 0 V?
The CLVC16T245MDGGREP supports overvoltage-tolerant inputs and outputs up to 6.5 V regardless of supply state. When VCCA = 0 V, the A-port I/Os remain tolerant to –0.5 V to 6.5 V, and B-port I/Os tolerate –0.5 V to 6.5 V relative to their own VCCB. This allows safe hot-insertion and mixed-voltage system interoperability even during power-down sequences.
Does CLVC16T245MDGGREP support true bidirectional data flow on the same pin pair?
Yes. CLVC16T245MDGGREP enables true bidirectional data transfer on each A/B pin pair (e.g., 1A1 ↔ 1B1) using separate DIR and OE controls per 8-bit section. Direction is determined dynamically by the DIR input state, and OE independently enables/disables output drivers - allowing seamless A→B or B→A communication without external bus arbitration logic.
How does the VCC isolation feature function in CLVC16T245MDGGREP during power-up sequencing?
In CLVC16T245MDGGREP, if either VCCA or VCCB is at GND (or unpowered), both A and B ports automatically enter high-impedance mode - regardless of DIR or OE states. This eliminates risk of back-driving powered rails during asymmetric power-up, a critical requirement for MIL-STD-704-compliant avionics and radar systems.
What is the recommended pull-up resistance for OE pins on CLVC16T245MDGGREP to ensure Hi-Z during power-up?
TI recommends tying OE pins to VCCA through a pull-up resistor to guarantee high-impedance state at power-up. Minimum value is determined by the driver's current-sinking capability; for CLVC16T245MDGGREP, a 10-kΩ resistor is sufficient to maintain OE > VIH (VCCA × 0.7) while limiting current to < 100 µA during startup transients.
Is CLVC16T245MDGGREP pin-compatible with commercial-grade SN74LVC16T245?
Yes. CLVC16T245MDGGREP shares identical pinout, functionality, and AC/DC specifications with the commercial SN74LVC16T245, but adds enhanced reliability features: extended –55°C to 125°C operation, controlled baseline manufacturing, full traceability, and qualification per V62/12667-01XE - all in the same TSSOP-48 (DGG) package.
CLVC16T245MDGGREP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 48-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Translation Transceiver
- Number of Elements:
- 2
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSSOP
CLVC16T245MDGGREP FAQ
1.How can I place an order for CLVC16T245MDGGREP through Aetrix?
Please submit a Request for Quotation (RFQ) for CLVC16T245MDGGREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CLVC16T245MDGGREP reliable?
The price and inventory of CLVC16T245MDGGREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CLVC16T245MDGGREP is usually 5 days.
3.What payment methods are accepted for CLVC16T245MDGGREP?
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CLVC16T245MDGGREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CLVC16T245MDGGREP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CLVC16T245MDGGREP?
For technical support, including CLVC16T245MDGGREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CLVC16T245MDGGREP requirements.
6.How does Aetrix verify that CLVC16T245MDGGREP is sourced from the original manufacturer or authorized distributors?
All CLVC16T245MDGGREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CLVC16T245MDGGREP meets industry standards.
7.What is the process for return or replacement of CLVC16T245MDGGREP?
All CLVC16T245MDGGREP units undergo pre-shipment inspection (PSI). If there is an issue with CLVC16T245MDGGREP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CLVC16T245MDGGREP part is unused and in its original packaging.
Return procedure for CLVC16T245MDGGREP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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