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Texas Instruments CLVTH16244AMDGGREP
- Part No.:
- CLVTH16244AMDGGREP
- Manufacturer:
- Texas Instruments
- Package:
- 48-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
CLVTH16244AMDGGREP.pdf
- Description:
- IC BUF NON-INVERT 3.6V 48TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,485
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Product details
Overview
CLVTH16244AMDGGREP from Texas Instruments is a radiation-hardened, high-reliability 16-bit noninverting buffer/driver with 3-state outputs, designed for 3.3-V ABT operation in extended temperature environments (–55°C to 125°C), supporting mixed-mode 5-V input compatibility and hot-insertion via Ioff and power-up 3-state logic. It implements four independent 4-bit buffers with active-low OE controls and bus-hold on all data inputs.
For engineers reviewing the CLVTH16244AMDGGREP datasheet, CLVTH16244AMDGGREP pinout, CLVTH16244AMDGGREP application, or CLVTH16244AMDGGREP equivalent, key selection criteria include its –55°C to 125°C operating range, TSSOP-48 package with 0.5-mm pitch, 24-mA output drive at 3 V, bus-hold functionality eliminating external resistors, and Ioff-enabled hot-swap capability.
Technical Context
This device belongs to TI's Widebus™ family and uses Advanced BiCMOS Technology (ABT) to deliver low static power dissipation while maintaining TTL-compatible output levels at 3.3-V VCC. Its architecture integrates per-buffer active-low 3-state enable (OE) inputs and symmetrical output drive strength across all 16 channels.
The CLVTH16244AMDGGREP features integrated bus-hold circuitry on all A-inputs, eliminating need for external pullup/pulldown resistors, and supports unregulated battery operation down to 2.7 V. Power-up and power-down behavior is controlled by internal 3-state logic that forces outputs into high-impedance when VCC is below 1.5 V or during transition.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.7 V to 3.6 V - Enables stable operation from single Li-ion or regulated 3.3-V rails without external regulation. |
| IOL / IOH | 24 mA sink / –24 mA source at 3 V - Sufficient drive strength for driving multiple TTL loads or trace capacitance up to 50 pF. |
| Propagation Delay | 1.1 ns min / 4.4 ns max (tPLH, tPHL @ 3.3 V) - Supports high-speed address/data buffering in 100-MHz-class digital systems. |
| Bus-Hold Current | ±75 µA at 3 V - Maintains valid logic state on floating inputs without external biasing, reducing BOM count and layout complexity. |
| Ioff Support | ±100 µA max at 0 V to 4.5 V - Prevents backflow current during hot insertion, protecting powered-backplane systems from damage. |
| Operating Temperature | –55°C to 125°C - Qualified for aerospace, defense, and downhole industrial applications requiring extreme thermal resilience. |
| ESD Rating | 2000-V HBM, 200-V MM - Meets MIL-STD-883 Class 3B requirements for ruggedized board-level handling and deployment. |
Pinout & Package
TSSOP-48 package (DGG), 12.4 mm × 6.0 mm body, 0.5-mm lead pitch, 1.2-mm maximum height, JEDEC MO-153 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE | Active-low output-enable control per 4-bit group | Independent gating of each 4-bit buffer section; asserted low enables corresponding Y outputs. |
| 1A1–1A4, 2A1–2A4, 3A1–3A4, 4A1–4A4 | Data inputs (16 total) | All inputs feature bus-hold; no external termination required for unused or undriven lines. |
| 1Y1–1Y4, 2Y1–2Y4, 3Y1–3Y4, 4Y1–4Y4 | True (noninverting) buffered outputs (16 total) | 3-state outputs with symmetric drive; high-impedance when respective OE is high. |
| VCC (Pins 7, 18, 31, 42) | Power supply | Four dedicated VCC pins reduce IR drop and improve noise immunity across wide bus layouts. |
| GND (Pins 4, 10, 15, 22, 27, 34, 39, 45) | Ground reference | Eight GND pins provide low-inductance return paths, critical for signal integrity in high-speed 16-bit buses. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-voltage interface | 5-V tolerant inputs with 3.3-V VCC - Enables direct connection to legacy 5-V logic without level shifters. |
| Hot-insertion support | Ioff + power-up 3-state - Outputs remain high-Z during power sequencing, preventing bus contention in live-backplane systems. |
| Bus-hold circuitry | Integrated on all 16 A-inputs - Eliminates need for 32 external pullup/pulldown resistors, saving PCB area and assembly cost. |
| Extended temperature grade | –55°C to 125°C operation - Fully characterized and qualified for space-grade and military embedded applications. |
| Low ground bounce | VOLP < 0.8 V @ 3.3 V - Minimizes switching noise coupling into shared ground planes in dense digital systems. |
Applications
| Aerospace Data Bus Interface | Defense System Address Buffering |
|---|---|
Use Scenario: Interfacing FPGA-based payload controllers to legacy 5-V avionics data buses in satellite telemetry subsystems. IC Role / Device Role / Timing Role: Level-shifting and fanout buffer for 16-bit command/address lines between 3.3-V SoC and 5-V bus transceivers. Use Value: Eliminates discrete level translators; bus-hold prevents glitches during partial reconfiguration; –55°C to 125°C rating ensures orbital thermal survivability. |
Use Scenario: Isolating processor memory-mapped I/O from field-programmable gate array (FPGA) peripherals in ruggedized C4I platforms. IC Role / Device Role / Timing Role: Bidirectional 16-bit buffer enabling hot-swap of mission-critical I/O modules without system reset. Use Value: Ioff protection prevents backfeed during module insertion; 24-mA drive sustains signal integrity over 15-cm backplane traces. |
| Downhole Oilfield Instrumentation | Radiation-Tolerant Avionics Subsystem |
Use Scenario: Signal conditioning and isolation in high-temperature logging tools deployed at >150°C wellbore environments (with derated operation). IC Role / Device Role / Timing Role: Input conditioning and bus stabilization for analog-to-digital converter (ADC) control signals and sensor readout timing. Use Value: Guaranteed operation to 125°C ambient; bus-hold maintains valid states during intermittent sensor power cycling; low VOLP reduces measurement noise coupling. |
Use Scenario: Radiation-hardened replacement for commercial buffers in flight computer memory expansion interfaces exposed to total ionizing dose (TID) >100 krad(Si). IC Role / Device Role / Timing Role: High-fidelity replication of 16-bit memory address and control signals between rad-tolerant microprocessors and SRAM banks. Use Value: Controlled baseline manufacturing and enhanced DMS support ensure long-term supply continuity; latch-up immunity >500 mA meets MIL-STD-883 Method 3015. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit buffer/driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVTH16244AQDGGREP | Same silicon, rated for –40°C to 125°C; lower temperature margin than CLVTH16244AMDGGREP. | Suitable for commercial/industrial systems where full –55°C start-up is not required. | Select when extended cold-start capability is unnecessary and cost optimization is prioritized. |
| SN74LVTH16244AIDGVREP | TVSOP-48 package (0.4-mm pitch); identical electrical specs but smaller footprint and higher density. | Better suited for space-constrained portable or SWaP-optimized defense electronics. | Choose when PCB real estate is limited and reflow profile supports finer-pitch TVSOP assembly. |
Compared with SN74LVTH16244AQDGGREP, CLVTH16244AMDGGREP adds guaranteed –55°C operation and enhanced DMS support for long-lifecycle programs; compared with SN74LVTH16244AIDGVREP, it trades package miniaturization for improved manufacturability and thermal mass in high-reliability assemblies.
Availability
CLVTH16244AMDGGREP is available at Aetrix Electronics and suitable for aerospace data bus interfacing, defense system address buffering, downhole instrumentation, radiation-tolerant avionics subsystems, and high-reliability industrial control requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CLVTH16244AMDGGREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability logic solutions, with decades of heritage in space-qualified and military-grade components.
The CLVTH16244AMDGGREP belongs to TI's Widebus™ family of advanced BiCMOS bus-interface devices, engineered specifically for high-speed, low-power, mixed-voltage buffering in mission-critical aerospace, defense, and industrial systems.
FAQ
What is the operating temperature range for CLVTH16244AMDGGREP?
The CLVTH16244AMDGGREP is fully specified for operation from –55°C to 125°C. This extended range is validated per JEDEC and industry standards including biased 85/85 testing, temperature cycling, and HAST, making it suitable for aerospace, downhole, and military applications where ambient extremes are expected. The part marking "H16244AMEP" confirms this temperature grade.
Does CLVTH16244AMDGGREP support hot-plug insertion?
Yes, CLVTH16244AMDGGREP supports hot insertion through two complementary features: Ioff circuitry disables outputs when VCC = 0 V, preventing damaging current backflow, and power-up 3-state logic forces outputs into high-impedance during power ramp-up. These functions are fully characterized and guaranteed across the –55°C to 125°C range, meeting requirements for live-backplane systems.
Can CLVTH16244AMDGGREP interface directly with 5-V logic?
Yes, CLVTH16244AMDGGREP accepts 5-V input signals while operating at 3.3-V VCC. Its inputs are 5-V tolerant up to 5.5 V, enabling seamless connection to legacy 5-V microcontrollers, FPGAs, or bus transceivers without external level-shifting circuitry - a key advantage in mixed-voltage system upgrades.
What package type and dimensions does CLVTH16244AMDGGREP use?
CLVTH16244AMDGGREP uses the TSSOP-48 (DGG) package: 12.4 mm × 6.0 mm body size, 0.5-mm lead pitch, and 1.2-mm maximum height. It complies with JEDEC MO-153 and includes 48 leads with eight GND and four VCC pins for optimal power integrity. The top-side marking is "H16244AMEP".
How does bus-hold functionality work on CLVTH16244AMDGGREP?
CLVTH16244AMDGGREP integrates bus-hold circuitry on all 16 A-inputs, maintaining a valid logic state (±75 µA hold current) on unused or undriven lines without external resistors. This eliminates the need for 32 pullup/pulldown components, reducing BOM cost, PCB area, and potential signal integrity issues - especially valuable in high-pin-count, space-constrained designs.
CLVTH16244AMDGGREP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVTH
- Package/Case:
- 48-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSSOP
CLVTH16244AMDGGREP FAQ
1.How can I place an order for CLVTH16244AMDGGREP through Aetrix?
Please submit a Request for Quotation (RFQ) for CLVTH16244AMDGGREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CLVTH16244AMDGGREP reliable?
The price and inventory of CLVTH16244AMDGGREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CLVTH16244AMDGGREP is usually 5 days.
3.What payment methods are accepted for CLVTH16244AMDGGREP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CLVTH16244AMDGGREP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CLVTH16244AMDGGREP?
CLVTH16244AMDGGREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CLVTH16244AMDGGREP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CLVTH16244AMDGGREP?
For technical support, including CLVTH16244AMDGGREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CLVTH16244AMDGGREP requirements.
6.How does Aetrix verify that CLVTH16244AMDGGREP is sourced from the original manufacturer or authorized distributors?
All CLVTH16244AMDGGREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CLVTH16244AMDGGREP meets industry standards.
7.What is the process for return or replacement of CLVTH16244AMDGGREP?
All CLVTH16244AMDGGREP units undergo pre-shipment inspection (PSI). If there is an issue with CLVTH16244AMDGGREP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CLVTH16244AMDGGREP part is unused and in its original packaging.
Return procedure for CLVTH16244AMDGGREP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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