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STMicroelectronics CPL-WB-01D3
- Part No.:
- CPL-WB-01D3
- Manufacturer:
- STMicroelectronics
- Category:
- RF Directional Coupler
- Package:
- 6-WFBGA, FCBGA
- Datasheet:
-
CPL-WB-01D3.pdf
- Description:
- RF DIR COUPL 824MHZ-2.17GHZ FLIP
- Quantity:
- Payment:
- Shipping:
Inventory:3,558
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Product details
Overview
CPL-WB-01D3 from STMicroelectronics is a wide-band directional coupler designed for RF power monitoring in GSM/WCDMA/TD-SCDMA front-end modules, featuring 50 Ω nominal impedance, 824–2170 MHz operating bandwidth, <0.2 dB insertion loss, 26 dB coupling factor (typ.), and flip-chip packaging for compact integration in quad-band mobile phone PA modules.
For engineers reviewing the CPL-WB-01D3 datasheet, CPL-WB-01D3 pinout, CPL-WB-01D3 application, or CPL-WB-01D3 equivalent, this device supports precise antenna output power sampling in multi-band cellular transceivers with high directivity (>20 dB typ.) and IEC 61000-4-2 Level 4 ESD robustness-critical for production-grade RF module design and validation.
Technical Context
The CPL-WB-01D3 implements a passive 4-port directional coupler topology using ST's IPD technology on non-conductive glass substrate, enabling broadband performance across EGSM, PCS, DCS, TD-SCDMA, and WCDMA Band I without external matching components. Its flip-chip construction integrates six solder bumps for low-inductance RF signal routing.
It delivers consistent 50 Ω impedance at all ports (RFIN, RFOUT, CPLD, ISO), maintains ≥15 dB return loss over full bandwidth, and achieves ≥20 dB directivity (typ.) from 824 MHz to 2025 MHz-enabling accurate forward/reflected power separation in transmit path monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 824–2170 MHz: Covers all major cellular bands (EGSM, DCS, PCS, WCDMA I, TD-SCDMA) without band switching. |
| Insertion Loss | <0.2 dB (typ. 0.1 dB): Minimizes transmit path attenuation, preserving PA efficiency and system gain budget. |
| Coupling Factor | 26 dB (typ.): Enables accurate low-level sampling of high-power RF signals while maintaining isolation between coupled and main paths. |
| Directivity | ≥20 dB (typ.): Ensures reliable separation of forward and reflected power for VSWR monitoring and antenna tuning. |
| ESD Robustness | ±15 kV air / ±8 kV contact (IEC 61000-4-2 Level 4): Supports handling and assembly in standard manufacturing environments without additional protection circuitry. |
| Operating Temp | −30 °C to +85 °C: Validated for use in consumer mobile handset thermal profiles including battery proximity zones. |
Pinout & Package
Flip-chip package with 6 solder bumps; dimensions 1.3 mm × 1.0 mm × 0.45 mm (L×W×H), 220 µm copper pad diameter, ECOPACK®-compliant lead-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 (RFIN) | Main RF input | Primary transmit path entry; matched to 50 Ω for minimal reflection into PA output stage. |
| A2 (GND) | Ground reference | RF ground return for RFIN; must connect directly to solid PCB ground plane per layout guidelines. |
| A3 (GND) | Ground reference | Secondary RF ground; ensures symmetric current return and minimizes parasitic inductance in flip-chip interface. |
| B1 (CPLD) | Coupled port | Provides sampled RF signal at −26 dB relative to RFIN; used for power detector or ADC input. |
| B2 (ISO) | Isolated port | Terminated internally; absorbs reverse-traveling waves to maximize directivity and measurement accuracy. |
| B3 (RFOUT) | Main RF output | Feeds antenna switch or filter; maintains 50 Ω match to preserve signal integrity downstream. |
Key Features
| Feature | Design Value |
|---|---|
| Wideband 4-port architecture | Single-device coverage of 824–2170 MHz eliminates need for multiple narrowband couplers in multi-mode handsets. |
| IPD-on-glass substrate | Reduces dielectric loss and parasitic coupling vs. silicon-based passives, improving directivity and temperature stability. |
| Flip-chip bump interconnect | Enables sub-millimeter footprint and low-inductance RF path-critical for >2 GHz operation in ultra-thin mobile modules. |
| 100% tested tape-and-reel delivery | Ensures zero incoming defects for SMT line integration; base quantity 5000 units per reel per ordering code CPL-WB-01D3. |
Applications
| Quad-band Power Amplifier Module | Quad-band Front End Module |
|---|---|
Use Scenario: Real-time output power control and closed-loop PA bias adjustment in LTE/GSM/WCDMA multi-mode handsets. IC Role / Device Role / Timing Role: Directional coupler providing sampled forward RF power to baseband controller for dynamic envelope tracking. Use Value: Enables <0.2 dB insertion loss in main path while delivering stable 26 dB coupling across four bands-reducing calibration overhead and improving PA efficiency. | Use Scenario: Integrated RF front-end for smartphone applications requiring simultaneous support of GSM850/900, DCS1800, PCS1900, and WCDMA Band I. IC Role / Device Role / Timing Role: Coupler placed between PA output and antenna switch to monitor transmit power before filtering and switching. Use Value: High directivity (>20 dB) ensures accurate power reading despite variable antenna impedance, supporting reliable SAR compliance and adaptive tuning. |
| GSM/WCDMA Mobile Phone | TD-SCDMA Baseband Reference Design |
Use Scenario: Compact RF power feedback loop in volume-production feature phones with dual-SIM/dual-standby capability. IC Role / Device Role / Timing Role: Passive sampling element in transmit chain; no active bias or timing control required. Use Value: Flip-chip package (1.3 × 1.0 mm) reduces PCB area by >40% vs. wire-bond couplers-enabling smaller module footprints without sacrificing RF accuracy. | Use Scenario: Reference design validation for TD-SCDMA handsets operating in 1880–2025 MHz and 2010–2025 MHz bands. IC Role / Device Role / Timing Role: Coupler integrated into evaluation board to characterize PA linearity and ACLR under modulated TD-SCDMA signals. Use Value: ≤0.5 dB coupling ripple across TD-SCDMA bands ensures consistent power detection accuracy during burst-mode transmission and TDD switching transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar directional coupler applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QM11020 | Higher coupling (30 dB), narrower bandwidth (1710–2170 MHz only), larger 1.6 × 1.2 mm package. | Optimized for LTE-only FEMs; lacks EGSM/DCS coverage. | Select when higher coupling sensitivity is needed and bandwidth can be restricted to LTE bands. |
| Skyworks SKY13370-374LF | 0.3 dB insertion loss (max), 23 dB coupling, 1.5 × 1.1 mm package, requires external 50 Ω termination on ISO port. | Lower directivity (15 dB min); suited for cost-sensitive designs where moderate accuracy suffices. | Choose for legacy GSM/WCDMA designs where footprint tolerance allows 15% larger size and ESD rating (±8 kV contact) matches process capability. |
Compared with QM11020 and SKY13370-374LF, CPL-WB-01D3 uniquely balances ultra-wideband coverage (824–2170 MHz), sub-0.2 dB loss, and integrated ISO termination-making it optimal for next-generation quad-band smartphones requiring single-part RF power monitoring across all legacy and early 4G bands.
Availability
CPL-WB-01D3 is available at Aetrix Electronics and suitable for quad-band power amplifier modules, front-end modules, and GSM/WCDMA mobile phone designs requiring stable component supply, high-volume tape-and-reel delivery, and proven RF performance in production environments.
Supply support for CPL-WB-01D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, MEMS, and RF components for automotive, industrial, and consumer markets.
CPL-WB-01D3 belongs to ST's IPD-based RF passive portfolio, engineered specifically for miniaturized, high-performance cellular front-end integration-emphasizing broadband accuracy, ESD resilience, and manufacturability in space-constrained mobile platforms.
FAQ
What is the recommended PCB layout for CPL-WB-01D3?
Use a 4-layer FR4 board with 0.8 mm substrate thickness, solid ground plane on Layer 1, and 50 Ω controlled-impedance traces. Solder mask must cover top/bottom layers; copper pad diameter is 220 µm, with minimum solder mask opening of 300 µm. Ground vias must be placed within 1 mm of each GND bump per ST AN2348 guidelines.
Does CPL-WB-01D3 require external bias or control signals?
No. CPL-WB-01D3 is a fully passive device with no DC bias, enable pins, or control interfaces. It operates solely via RF signal coupling and requires only proper 50 Ω terminations at all ports-including internal 50 Ω termination at the ISO port as specified in the datasheet.
Can CPL-WB-01D3 be used in 5G NR sub-6 GHz bands?
No. Its validated frequency range ends at 2170 MHz, covering GSM, WCDMA, and TD-SCDMA-but not n77 (3300–4200 MHz) or n78 (3300–3800 MHz) 5G bands. For sub-6 GHz 5G, ST offers newer IPD couplers such as CPL-WB-02D3 with extended 2.3–4.2 GHz range.
What is the maximum RF input power rating for continuous operation?
The absolute maximum RF input power is +35 dBm (3.16 W) at RFIN, verified per Table 1 of Doc ID 019036 Rev 3. This rating applies across the full 824–2170 MHz band at Tamb = 25 °C; derating is required above +60 °C ambient per thermal resistance data in ST's IPD reliability reports.
CPL-WB-01D3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Coupler Type:
- Standard
- Frequency:
- 824MHz ~ 2.17GHz
- Coupling Factor:
- 26dB
- Applications:
- W-CDMA
- Insertion Loss:
- 0.1dB
- Power - Max:
- -
- Isolation:
- -
- Return Loss:
- 15dB
- Supplier Device Package:
- 6-FlipChip (1x1.3)
CPL-WB-01D3 FAQ
1.How can I place an order for CPL-WB-01D3 through Aetrix?
Please submit a Request for Quotation (RFQ) for CPL-WB-01D3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CPL-WB-01D3 reliable?
The price and inventory of CPL-WB-01D3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CPL-WB-01D3 is usually 5 days.
3.What payment methods are accepted for CPL-WB-01D3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CPL-WB-01D3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CPL-WB-01D3?
CPL-WB-01D3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CPL-WB-01D3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CPL-WB-01D3?
For technical support, including CPL-WB-01D3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CPL-WB-01D3 requirements.
6.How does Aetrix verify that CPL-WB-01D3 is sourced from the original manufacturer or authorized distributors?
All CPL-WB-01D3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CPL-WB-01D3 meets industry standards.
7.What is the process for return or replacement of CPL-WB-01D3?
All CPL-WB-01D3 units undergo pre-shipment inspection (PSI). If there is an issue with CPL-WB-01D3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CPL-WB-01D3 part is unused and in its original packaging.
Return procedure for CPL-WB-01D3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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