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STMicroelectronics CPL-WB-02D3
- Part No.:
- CPL-WB-02D3
- Manufacturer:
- STMicroelectronics
- Category:
- RF Directional Coupler
- Package:
- 5-UFBGA, FCBGA
- Datasheet:
-
CPL-WB-02D3.pdf
- Description:
- IC DIRECTIONAL CPLR FLIPCHIP
- Quantity:
- Payment:
- Shipping:
Inventory:4,223
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Product details
Overview
CPL-WB-02D3 from STMicroelectronics is a wide-band directional coupler fabricated using IPD technology on glass substrate, designed for RF power monitoring in WLAN front-end modules. It features 50 Ω input/output/coupled port impedance, operates from 2400 MHz to 5850 MHz, delivers ≤0.5 dB insertion loss (up to 5.85 GHz), and provides –18 dB coupling at 2.4 GHz and –12 dB at 5 GHz.
For engineers reviewing the CPL-WB-02D3 datasheet, CPL-WB-02D3 pinout, CPL-WB-02D3 application, or CPL-WB-02D3 equivalent, key selection criteria include bandwidth coverage across 2.4/5 GHz WLAN bands, flip-chip bump configuration for ultra-low profile integration, ESD robustness (2 kV HBM), and verified 50 Ω isolated port termination enabling direct connection without external matching.
Technical Context
The CPL-WB-02D3 implements a passive, broadband directional coupling architecture optimized for antenna output power sampling in multi-band RF transceivers. Its non-conductive glass substrate minimizes dielectric loss, while integrated 50 Ω termination on the coupled port eliminates need for external load resistors.
Designed for flip-chip assembly with five copper bumps (RFIN, RFOUT, CPLD, GND, GND), it supports reflow profiles compliant with lead-free processes and achieves <595 µm total package thickness post-reflow - critical for space-constrained RF module stacking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2400–5850 MHz: Covers full 2.4 GHz and 5 GHz WLAN bands including IEEE 802.11a/b/g/n/ac. |
| Coupling Factor | –18 dB @ 2.4 GHz / –12 dB @ 5 GHz: Enables accurate power sampling across dual-band operation without recalibration. |
| Insertion Loss | ≤0.5 dB (4.9–5.85 GHz): Minimizes transmit path degradation in high-frequency PA output stages. |
| Return Loss | ≥15 dB (2.4–5.85 GHz): Ensures stable VSWR across both bands, reducing reflected power in sensitive front-end designs. |
| ESD Robustness | 2 kV HBM: Protects against handling-induced discharge during module assembly and test. |
| Package Thickness | <595 µm after reflow: Enables co-location with stacked PA/duplexer modules in ultra-thin mobile RF layouts. |
Pinout & Package
Package: Flip Chip with 5 copper bumps (UBM Ø220 µm), 1.00 mm × 1.35 mm footprint, total thickness <595 µm after reflow. ECOPACK®-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RFIN | RF Input | Main transmit path input; 50 Ω matched for direct connection to PA output. |
| RFOUT | RF Output | Transmit path output to antenna switch/duplexer; maintains 50 Ω match and low IL. |
| CPLD | Coupled Port | Directional sampled signal output; internally terminated to 50 Ω - no external load required. |
| GND (×2) | Ground Reference | Dual ground bumps ensure low-inductance return path for RF current and improve isolation. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 50 Ω isolated port | Eliminates discrete 50 Ω resistor placement and layout parasitics, improving measurement accuracy and saving PCB area. |
| IPD-on-glass construction | Reduces substrate loss and dispersion vs. silicon-based passive devices, enabling flat coupling response over 3.45 GHz bandwidth. |
| Flip-chip bump geometry | Five precisely aligned copper bumps enable automated placement and consistent solder joint height for repeatable RF performance. |
| ECOPACK® compliance | Meets RoHS and halogen-free requirements without compromising RF electrical characteristics or thermal reliability. |
Applications
| WLAN Quad-Band FEM | 2.4/5 GHz Power Amplifier Module |
|---|---|
Use Scenario: Integrated into compact front-end modules supporting simultaneous 2.4 GHz and 5 GHz band operation in Wi-Fi 5/6 client devices. IC Role / Device Role / Timing Role: Directional RF power sampler placed between PA output and antenna switch to monitor forward power in real time. Use Value: Enables closed-loop TX power control across both bands using single coupler, reducing component count and calibration complexity. | Use Scenario: Mounted directly on PA die substrate in multi-die RF modules for smartphones and tablets. IC Role / Device Role / Timing Role: Low-profile directional coupler providing sampled RF signal to power detector IC for envelope tracking feedback. Use Value: Sub-600 µm thickness allows vertical stacking with PA and filter dies without air-gap or interposer, minimizing interconnect loss. |
| Wi-Fi Access Point Radio | IoT Gateway Transceiver |
Use Scenario: Used in enterprise-grade 4×4 MIMO access point radios requiring precise per-chain TX power reporting. IC Role / Device Role / Timing Role: Coupler on each RF chain feeding dedicated RSSI/power detector, synchronized via shared clock domain. Use Value: ≥15 dB return loss ensures minimal interaction between chains, preserving MIMO channel orthogonality and EVM. | Use Scenario: Embedded in battery-powered IoT gateways supporting concurrent BLE/Wi-Fi operation. IC Role / Device Role / Timing Role: Monitors PA output during burst transmissions to trigger dynamic power scaling and extend battery life. Use Value: 2 kV HBM ESD rating prevents field failure during manual handling in low-volume gateway assembly lines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar directional coupler applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QPC1007 | Higher coupling (–10 dB @ 5 GHz), wider bandwidth (1.7–6.0 GHz), but requires external 50 Ω load on coupled port. | Supports LTE-U and unlicensed 5.9 GHz ITS bands beyond WLAN; larger 1.5 × 1.5 mm package. | Select when extended low-band coverage or higher coupling sensitivity is needed, accepting added layout complexity. |
| Skyworks SKY13370-378LF | Surface-mount QFN-6 package (2.0 × 2.0 mm), –15 dB coupling at 2.4 GHz, no integrated termination. | Compatible with standard SMT pick-and-place; suited for prototyping and lower-frequency IoT designs up to 2.7 GHz. | Prefer for NPI evaluation or cost-sensitive designs where flip-chip assembly infrastructure is unavailable. |
Compared with QPC1007 and SKY13370-378LF, CPL-WB-02D3 uniquely combines integrated 50 Ω termination, sub-600 µm thickness, and verified WLAN band performance - making it optimal for volume production of space-constrained, dual-band Wi-Fi modules requiring zero external coupling port components.
Availability
CPL-WB-02D3 is available at Aetrix Electronics and suitable for WLAN quad-band front-end modules, 2.4/5 GHz power amplifier modules, and Wi-Fi access point radios requiring stable component supply and guaranteed tape-and-reel delivery.
Supply support for CPL-WB-02D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader delivering intelligent power, sensing, connectivity, and microcontroller solutions for automotive, industrial, and consumer applications.
The CPL-WB-02D3 belongs to ST's IPD (Integrated Passive Device) portfolio, engineered specifically for high-frequency RF signal conditioning in miniaturized wireless modules - emphasizing broadband accuracy, ultra-low profile, and production-ready reliability.
FAQ
What is the purpose of the integrated 50 Ω termination on the CPLD pin?
The CPLD pin features an internal 50 Ω resistor to ground, eliminating the need for an external termination. This ensures accurate directional coupling response without layout-dependent parasitics, improves measurement repeatability across production units, and reduces PCB real estate by removing one discrete component and its associated traces and vias.
Can CPL-WB-02D3 be used outside the 2.4–5.85 GHz range?
No. Electrical specifications are validated only from 2400 MHz to 5850 MHz. Below 2400 MHz, coupling factor degrades rapidly and return loss falls below 15 dB; above 5850 MHz, insertion loss increases significantly and directivity drops. Use outside this band may result in inaccurate power sampling or degraded system EVM.
Is reflow profile compatibility documented for CPL-WB-02D3?
Yes. The device is qualified for standard lead-free reflow per JEDEC J-STD-020, with peak temperature ≤260 °C. ST Application Note AN2348 specifies recommended stencil aperture (130 µm), copper pad diameter (220 µm), and solder mask opening (300–260 µm) to ensure reliable bump wetting and coplanarity control.
How does the glass substrate impact RF performance compared to silicon-based couplers?
The non-conductive glass substrate reduces dielectric loss tangent and dispersion, yielding flatter insertion loss and more consistent coupling across the 2.4–5.85 GHz band. Unlike silicon IPDs, it avoids substrate resonance modes that cause ripple in coupling response - critical for accurate wideband power detection in WLAN systems.
CPL-WB-02D3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Coupler Type:
- Standard
- Frequency:
- -
- Coupling Factor:
- 18dB
- Applications:
- WLAN
- Insertion Loss:
- 0.5dB
- Power - Max:
- -
- Isolation:
- -
- Return Loss:
- -15dB
- Supplier Device Package:
- 5-FlipChip
CPL-WB-02D3 FAQ
1.How can I place an order for CPL-WB-02D3 through Aetrix?
Please submit a Request for Quotation (RFQ) for CPL-WB-02D3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CPL-WB-02D3 reliable?
The price and inventory of CPL-WB-02D3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CPL-WB-02D3 is usually 5 days.
3.What payment methods are accepted for CPL-WB-02D3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CPL-WB-02D3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CPL-WB-02D3?
CPL-WB-02D3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CPL-WB-02D3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CPL-WB-02D3?
For technical support, including CPL-WB-02D3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CPL-WB-02D3 requirements.
6.How does Aetrix verify that CPL-WB-02D3 is sourced from the original manufacturer or authorized distributors?
All CPL-WB-02D3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CPL-WB-02D3 meets industry standards.
7.What is the process for return or replacement of CPL-WB-02D3?
All CPL-WB-02D3 units undergo pre-shipment inspection (PSI). If there is an issue with CPL-WB-02D3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CPL-WB-02D3 part is unused and in its original packaging.
Return procedure for CPL-WB-02D3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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