Texas Instruments CSD86330EVM-717

Overview

CSD86330EVM-717 from Texas Instruments is an evaluation module designed to demonstrate the CSD86330 synchronous buck NexFET™ power block in low-voltage, high-current point-of-load applications, delivering a regulated 1.2-V output at up to 10 A from a 9–13.2-V input bus, with peak efficiency of 92% and switching frequency of 500 kHz.

For engineers reviewing the CSD86330EVM-717 datasheet, CSD86330EVM-717 test points, CSD86330EVM-717 application, or CSD86330EVM-717 equivalent, this EVM supports rapid validation of thermal performance, load/line regulation (±0.5%), output ripple (40 mV_PP), and transient response in server, storage, and embedded computing power delivery designs.

Technical Context

The CSD86330EVM-717 implements a complete 1.2-V/10-A synchronous buck converter using TI's CSD86330 3.3-mm × 3.3-mm power block and TPS53219 adaptive on-time D-CAP™ controller. It operates across 9–13.2 V input with fixed output voltage and integrates critical test points (TP1–TP6) for VIN, VOUT, PGOOD, and SW node probing.

Designed for engineering development only, the board uses six-layer 2-oz copper PCB layout, natural convection cooling (fan-recommended), and supports constant-resistance load testing up to 10 A. Performance validation includes efficiency curves, load regulation (±0.5%), and thermal imaging under full-load conditions.

Key Specifications

Availability

CSD86330EVM-717 is available at Aetrix Electronics and suitable for server computer, storage computer, and embedded computing applications requiring stable component supply, rapid power architecture validation, and reference design reuse.

Supply support for CSD86330EVM-717 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-efficiency power conversion and system-level reference designs.

The CSD86330EVM-717 belongs to TI's NexFET™ Power Block evaluation platform family, engineered to accelerate adoption of integrated MOSFET-based buck solutions in high-performance computing and enterprise infrastructure power delivery.

FAQ

What is the primary function of the CSD86330EVM-717?

The CSD86330EVM-717 is a Texas Instruments evaluation module that demonstrates the CSD86330 synchronous buck NexFET™ power block in a complete 1.2-V/10-A point-of-load converter. It enables engineers to validate efficiency, thermal behavior, regulation accuracy, and transient response before integrating the CSD86330 into final designs. The CSD86330EVM-717 includes test points, schematic documentation, and performance curves per SLUU480 User's Guide.

Which controller IC is used on the CSD86330EVM-717?

The CSD86330EVM-717 uses the TPS53219RGT single synchronous step-down controller in QFN-16 package, implementing adaptive on-time D-CAP™ control mode. This controller drives the CSD86330 power block to achieve fast transient response and stable 1.2-V output regulation. The CSD86330EVM-717 schematic and bill of materials confirm U1 as TPS53219RGT, tightly coupled with the CSD86330Q3D power block.

What are the key test points on the CSD86330EVM-717 and their roles?

The CSD86330EVM-717 provides six labeled test points: TP1 (VIN), TP2 (GND for input), TP3 (PGOOD), TP4 (SW node), TP5 (VOUT), and TP6 (GND for output). These enable direct probing of input/output voltages, power-good status, switch-node waveforms, and output ripple without soldering. The CSD86330EVM-717 User's Guide specifies tip-and-barrel measurement methods for accurate ripple capture using TP5 and TP6.

Does the CSD86330EVM-717 support variable output voltage configurations?

No, the CSD86330EVM-717 is configured for fixed 1.2-V output only, as implemented by its resistor feedback network and TPS53219 controller settings. It does not include onboard voltage adjustment components or jumpers. For variable-output evaluation, engineers must modify the feedback divider or use alternative TI EVMs such as those based on adjustable controllers like TPS543x series. The CSD86330EVM-717 is purpose-built to showcase the CSD86330 in standard 1.2-V CPU core rail applications.

What thermal management guidance is provided for the CSD86330EVM-717?

Texas Instruments recommends using a fan providing 200–400 LFM airflow during CSD86330EVM-717 operation, as some components reach ~60°C at 10-A load under natural convection. Thermal images in the SLUU480 User's Guide document top/bottom board temperatures at 12 V_IN/1.2 V/10 A. The CSD86330EVM-717 PCB uses six-layer construction with 2-oz copper to enhance heat spreading, but active cooling remains advised for sustained full-load testing.