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Infineon Technologies CY14B116L-ZS25XI
- Part No.:
- CY14B116L-ZS25XI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY14B116L-ZS25XI.pdf
- Description:
- IC NVSRAM 16MBIT PAR 44TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:270
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Product details
Overview
CY14B116L-ZS25XI from Infineon Technologies (formerly Cypress) is a 16-Mbit nonvolatile SRAM with QuantumTrap technology, organized as 2048K × 8, operating at 2.7–3.6 V and supporting 25-ns access time. It performs automatic STORE on power-down using an external capacitor (VCAP), software- or pin-triggered STORE/RECALL, and delivers infinite SRAM read/write cycles with 20-year data retention. Used in industrial control systems requiring persistent memory without battery backup.
For engineers reviewing the CY14B116L-ZS25XI datasheet, CY14B116L-ZS25XI pinout, CY14B116L-ZS25XI application, or CY14B116L-ZS25XI equivalent, key selection criteria include nvSRAM configuration (×8), TSOP II package compatibility, AutoStore timing under voltage droop, HSB signaling for STORE status, and sleep mode absence in this variant.
Technical Context
This nvSRAM integrates volatile SRAM and nonvolatile QuantumTrap storage in each cell, enabling seamless data persistence without external EEPROM or flash. STORE transfers data from SRAM to nonvolatile elements via hardware (HSB pin), software command, or automatic power-loss detection; RECALL restores data on power-up or via software.
It supports three interface configurations (×8/×16/×32), but CY14B116L-ZS25XI is specifically ×8-configured with A0–A20 addressing and DQ0–DQ7 I/O. The device uses single CE in TSOP II packaging and lacks ZZ (Sleep Mode) support - confirmed by pinout diagrams and feature tables limiting Sleep Mode to 165-ball FBGA only.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 16 Mbit (2048K × 8), providing 2 MB of byte-addressable nonvolatile RAM |
| Access Time | 25 ns max, enabling direct replacement for fast SRAMs in real-time control loops |
| Supply Voltage | 2.7 V to 3.6 V, compatible with 3.3-V system rails and LDO-regulated embedded power domains |
| Data Retention | 20 years at +85 °C, ensuring long-term firmware/state persistence in unattended industrial deployments |
| STORE Endurance | 1 million STORE cycles to QuantumTrap, supporting frequent power-cycle logging in energy-metering or PLC applications |
| Operating Temp | –40 °C to +85 °C industrial grade, validated for use in motor drives and factory automation enclosures |
| Active Current | 75 mA at 25 ns, defining peak power budget for thermal design in dense PCB layouts |
Pinout & Package
44-pin Thin Small-Outline Package (TSOP II), 400-mil body width, surface-mount, lead-free and RoHS-compliant. Pin 1 index marked, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Input | 21-bit address bus selecting one of 2,097,152 bytes in ×8 mode; no multiplexing required |
| DQ0–DQ7 | Bidirectional Data I/O | 8-bit parallel data path; tristated when OE HIGH or CE HIGH during read/write idle |
| CE | Chip Enable | Single active-low chip select; enables internal logic and memory array when LOW |
| WE | Write Enable | Active-low write strobe; latches DQ data into SRAM on falling edge while CE and OE are asserted |
| OE | Output Enable | Active-low output gate; controls DQ driver enable during read; must be LOW to drive data |
| HSB | Hardware STORE Busy | Open-drain status signal: LOW during STORE execution; externally pulled HIGH to initiate STORE |
| VCAP | AutoStore Capacitor Terminal | Connects to 4.7–10 µF tantalum or ceramic capacitor; supplies hold-up energy for STORE during VCC collapse |
| VCC / VSS | Power / Ground | Separate dedicated power and ground pins per JEDEC TSOP II layout; decoupling required within 10 mm |
Key Features
| Feature | Design Value |
|---|---|
| QuantumTrap Nonvolatile Storage | Embedded per-cell nonvolatile element eliminates need for external backup power or EEPROM interfacing logic |
| Hands-off AutoStore | Automatic STORE triggered solely by VCC drop below threshold - no host CPU intervention or firmware overhead |
| Software-Controlled STORE/RECALL | Issued via specific address/data sequences, enabling deterministic state capture before controlled shutdown |
| Hardware STORE Initiation | Pulling HSB LOW externally starts STORE immediately, supporting fail-safe response to brownout detectors or PMIC alerts |
| Infinite SRAM Read/Write Cycles | Enables continuous runtime logging, buffer rotation, and dynamic configuration updates without wear-out concerns |
Applications
| Industrial PLC Data Logging | Medical Device Configuration Storage |
|---|---|
Use Scenario: Storing operational parameters, calibration offsets, and event logs across repeated power cycles in programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile memory holding critical runtime state; replaces battery-backed SRAM with zero maintenance. Use Value: Eliminates battery replacement logistics and leakage risks while guaranteeing 20-year data retention at 85 °C ambient. | Use Scenario: Preserving user-defined therapy settings, sensor calibration data, and audit trails in portable infusion pumps and diagnostic monitors. IC Role / Device Role / Timing Role: Persistent configuration store accessed at boot and updated during clinical setup; requires deterministic STORE on power loss. Use Value: Meets IEC 62304 Class C software requirements for data integrity during unexpected AC dropout or battery swap. |
| Smart Energy Meter Firmware State | Avionics Black Box Recorder Buffer |
Use Scenario: Capturing metering registers, tamper events, and tariff schedules during grid instability or local power failure. IC Role / Device Role / Timing Role: High-reliability nvSRAM serving as last-known-good state buffer; STORE initiated by VCAP discharge monitoring. Use Value: Achieves ANSI C12.1 compliance for 100% data retention during 20-ms brownouts without auxiliary power. | Use Scenario: Buffering flight telemetry and sensor streams in UAVs and regional aircraft where power interruption may occur mid-flight. IC Role / Device Role / Timing Role: Crash-proof memory staging raw sensor data prior to compression and archival to flash; RECALL restores context post-reboot. Use Value: Supports DO-178C Level A data integrity assurance by isolating volatile capture from nonvolatile commit timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar nonvolatile SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STK14C88-3A55I | 55 ns access time, 3.3 V only, 16-Mbit ×8, no HSB pin, relies on external STORE controller | Lacks hardware STORE trigger and AutoStore autonomy; requires additional logic for power-fail detection | Select when cost sensitivity outweighs STORE timing determinism and board space permits discrete control circuitry |
| FM16W08-250-BG | 25 ns access, 3.3 V, 8-Mbit (1024K × 8), integrated power-fail comparator, no VCAP pin | Half capacity; built-in voltage monitor replaces external brownout IC but limits scalability to larger memory maps | Choose for compact designs needing simpler power management, accepting reduced density and fixed 8-Mbit ceiling |
Compared with STK14C88-3A55I and FM16W08-250-BG, CY14B116L-ZS25XI uniquely combines 25-ns speed, full 16-Mbit ×8 density, autonomous VCAP-based AutoStore, and HSB signaling - making it optimal for high-integrity, high-throughput industrial memory buffering where timing predictability and density are co-constrained.
Availability
CY14B116L-ZS25XI is available at Aetrix Electronics and suitable for industrial PLCs, medical instrumentation, smart energy meters, and avionics subsystems requiring stable component supply, long-lifecycle support, and guaranteed RoHS-compliant sourcing.
Supply support for CY14B116L-ZS25XI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, delivering power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT applications.
CY14B116L-ZS25XI belongs to Infineon's nvSRAM product line, engineered to replace battery-backed SRAM in mission-critical systems where maintenance-free, high-speed, nonvolatile data retention is mandatory.
FAQ
What is the function of the VCAP pin, and what capacitor value is required?
The VCAP pin connects to an external capacitor that supplies hold-up energy during VCC collapse to complete the STORE operation. A 4.7 µF to 10 µF low-ESR tantalum or ceramic capacitor is required, placed within 5 mm of the pin. Insufficient capacitance causes STORE abort and data loss; values outside this range risk timing violation or excessive inrush current.
Does CY14B116L-ZS25XI support Sleep Mode?
No. Sleep Mode (activated via ZZ pin) is only supported in the 165-ball FBGA package variants (e.g., CY14B116L-FZ25XI). The CY14B116L-ZS25XI uses a 44-pin TSOP II package, which does not include the ZZ pin or associated sleep control logic per the official datasheet pin definitions and functional description.
How is Hardware STORE initiated, and what is the HSB pin behavior?
Hardware STORE is initiated by pulling the HSB pin LOW externally using a push-button, microcontroller GPIO, or brownout detector output. During STORE execution, HSB remains LOW; upon completion, it pulses HIGH for tHHHD (≤100 ns) then floats weakly HIGH. An external 10-kΩ pull-up is recommended for noise immunity but not strictly required.
Can CY14B116L-ZS25XI be used in ×16 or ×32 configurations?
No. CY14B116L-ZS25XI is factory-configured for ×8 organization (2048K × 8), with A0–A20 and DQ0–DQ7 as defined in its 44-pin TSOP II pinout. ×16 and ×32 variants use different part numbers (e.g., CY14B116N, CY14B116S) and distinct packages (54-pin TSOP II or 165-ball FBGA), with incompatible pin assignments and address/data widths.
CY14B116L-ZS25XI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- NVSRAM
- Technology:
- NVSRAM (Non-Volatile SRAM)
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns
- Access Time:
- 25 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY14B116L-ZS25XI FAQ
1.How can I place an order for CY14B116L-ZS25XI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY14B116L-ZS25XI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY14B116L-ZS25XI reliable?
The price and inventory of CY14B116L-ZS25XI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY14B116L-ZS25XI is usually 5 days.
3.What payment methods are accepted for CY14B116L-ZS25XI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY14B116L-ZS25XI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY14B116L-ZS25XI?
CY14B116L-ZS25XI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY14B116L-ZS25XI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY14B116L-ZS25XI?
For technical support, including CY14B116L-ZS25XI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY14B116L-ZS25XI requirements.
6.How does Aetrix verify that CY14B116L-ZS25XI is sourced from the original manufacturer or authorized distributors?
All CY14B116L-ZS25XI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY14B116L-ZS25XI meets industry standards.
7.What is the process for return or replacement of CY14B116L-ZS25XI?
All CY14B116L-ZS25XI units undergo pre-shipment inspection (PSI). If there is an issue with CY14B116L-ZS25XI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY14B116L-ZS25XI part is unused and in its original packaging.
Return procedure for CY14B116L-ZS25XI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY14B116L-ZS25XI Tags
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