Infineon Technologies CY14B116N-BZ25XIT
- Part No.:
- CY14B116N-BZ25XIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY14B116N-BZ25XIT.pdf
- Description:
- IC NVSRAM 16MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,190
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY14B116N-BZ25XIT from Infineon Technologies (formerly Cypress) is a 16-Mbit nonvolatile SRAM organized as 1024K × 16, featuring QuantumTrap nonvolatile storage, 25-ns access time, and AutoStore on power-down. It operates from 2.7 V to 3.6 V across –40 °C to +85 °C and is used in industrial control systems requiring instant data retention without external backup power.
For engineers reviewing the CY14B116N-BZ25XIT datasheet, CY14B116N-BZ25XIT pinout, CY14B116N-BZ25XIT application, or CY14B116N-BZ25XIT equivalent, key selection criteria include ×16 bus width support, HSB-driven hardware STORE capability, VCAP-based hands-off power-loss protection, and TSOP II package compatibility with legacy SRAM footprints.
Technical Context
The device integrates a standard SRAM array (1024K × 16) with parallel QuantumTrap nonvolatile elements per cell, enabling infinite SRAM read/write cycles and 1 million STORE endurance. STORE/RECALL operations are decoupled: RECALL occurs automatically at power-up or via software, while STORE triggers on power-down (capacitor-assisted), HSB assertion, or software command.
It supports dual CE (CE1/CE2) logic in TSOP I and FBGA packages but uses single CE in TSOP II - this part (BZ25XIT) is a 54-pin TSOP II variant with single CE, ×16 configuration, and no Sleep mode (ZZ not functional). Address range A0–A19 and data lines DQ0–DQ15 are fully validated for industrial timing-critical applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1024K × 16 organization), enabling direct replacement of standard 16-bit SRAMs without address/data bus redesign. |
| Access Time | 25 ns max - guarantees sub-40-ns timing compliance for high-speed microcontroller and FPGA interface designs. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with modern 3.3 V embedded systems and tolerant of brown-out conditions down to 2.7 V. |
| Data Retention | 20 years at +85 °C - ensures long-term nonvolatile data integrity in unattended industrial logging applications. |
| STORE Endurance | 1 million cycles to QuantumTrap - supports frequent power-cycle environments like smart meters and PLCs with daily STORE events. |
| Power Consumption | 650 µA standby current - enables low-power operation during system idle without compromising STORE readiness. |
| Operating Temperature | –40 °C to +85 °C - qualified for extended industrial temperature range without derating or thermal management overhead. |
Pinout & Package
Package: 54-pin Thin Small-Outline Package (TSOP II), 0.8 mm pitch, 20.0 mm × 10.0 mm body size, single CE architecture, no Sleep mode (ZZ pin not functional).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 1024K-word addressing space; A0 least significant, A19 most significant - matches standard ×16 SRAM footprint. |
| DQ0–DQ15 | Bidirectional Data I/O | Full 16-bit parallel data path; tristated when OE HIGH or CE HIGH - interoperable with 16-bit microprocessor buses. |
| CE | Chip Enable (Active LOW) | Single enable signal; device selected only when CE LOW - simplifies decode logic vs. dual-CE FBGA variants. |
| WE | Write Enable (Active LOW) | Controls write initiation; data latched on WE falling edge - synchronous with standard SRAM timing protocols. |
| OE | Output Enable (Active LOW) | Enables DQ drivers during read; HIGH forces high-impedance - prevents bus contention in multi-device systems. |
| HSB | Hardware STORE Busy (I/O) | Open-drain output indicating STORE progress; pulled LOW externally to initiate STORE - provides deterministic, hardware-triggered nonvolatile save. |
| VCAP | AutoStore Capacitor Terminal | Connects external 4.7 µF tantalum capacitor; supplies energy for STORE during VCC collapse - eliminates need for battery or supercapacitor subsystem. |
| VCC / VSS | Power / Ground | Single 3.3 V supply domain; VSS pins distributed across package for low-noise grounding - meets industrial EMI requirements. |
Key Features
| Feature | Design Value |
|---|---|
| QuantumTrap Nonvolatile Storage | Embedded per-cell nonvolatile element enabling infinite SRAM cycling while retaining 20-year data integrity without external power. |
| Hands-off AutoStore | Automatic STORE triggered solely by VCC drop below threshold - requires only VCAP capacitor, no firmware or external controller intervention. |
| Hardware STORE Initiation | HSB pin accepts external LOW pulse to force immediate STORE - critical for controlled shutdown sequences in safety-critical systems. |
| Software-Controlled STORE/RECALL | Register-accessible commands allow precise timing of nonvolatile operations - enables selective save/restore in multi-context applications. |
| Industrial Temperature Range | Guaranteed functionality from –40 °C to +85 °C - validated for deployment in motor drives, factory automation, and outdoor infrastructure. |
Applications
| Industrial PLC Data Logging | Medical Device Parameter Backup |
|---|---|
Use Scenario: Programmable logic controllers record sensor readings and operational states every 100 ms during runtime, requiring persistent storage across unexpected mains loss. IC Role / Device Role / Timing Role: Nonvolatile SRAM acts as primary working memory with instantaneous STORE on brown-out - replaces battery-backed RAM and eliminates maintenance. Use Value: Eliminates battery replacement cycles and avoids data corruption during rapid power transitions, meeting IEC 61131-2 reliability requirements. |
Use Scenario: Patient monitors store calibration coefficients, alarm thresholds, and last-configuration state across power cycles and transport-induced outages. IC Role / Device Role / Timing Role: Acts as fail-safe configuration memory; RECALL restores full operational state within 100 µs of power-up - faster than EEPROM bootloaders. Use Value: Ensures zero-configuration restart and regulatory-compliant data persistence without adding flash wear-leveling or backup power circuitry. |
| Telecom Base Station Control | Automotive ADAS Sensor Fusion Buffer |
Use Scenario: Remote radio units retain firmware patch status, RF tuning parameters, and fault logs during grid fluctuations or scheduled maintenance power-downs. IC Role / Device Role / Timing Role: Serves as secure, tamper-resistant configuration vault; STORE completes before VCC drops below 2.5 V - verified per GR-63-CORE. Use Value: Prevents service interruption and reconfiguration delays, reducing mean time to repair (MTTR) in distributed telecom infrastructure. |
Use Scenario: Radar and camera fusion ECUs buffer real-time object tracking metadata that must survive ignition cycle gaps and transient voltage dips. IC Role / Device Role / Timing Role: Provides deterministic, sub-millisecond STORE latency (< 250 µs) synchronized to vehicle power rail monitoring - meets ISO 16750-2 Class IV. Use Value: Enables seamless session continuity between engine starts, avoiding recalibration delays and improving driver assistance responsiveness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar nonvolatile SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY14B116N-BZ35XI | Slower 35-ns access time; identical 54-pin TSOP II package, same ×16 organization and QuantumTrap technology. | Suitable where timing margin allows relaxed access, e.g., legacy 80 MHz bus interfaces. | Select when system timing budget permits longer access, enabling lower cost without changing PCB layout or firmware. |
| FM16W08-SG | 4-Mbit (512K × 8) F-RAM; 55-ns access, SOIC-28 package, no VCAP requirement, unlimited endurance. | Limited density and 8-bit bus width restrict use to low-bandwidth control registers, not full data buffers. | Choose for ultra-high endurance (>10¹⁴ cycles) in low-density register backup - not a drop-in replacement for 16-Mbit ×16 data arrays. |
Compared with CY14B116N-BZ35XI, the -BZ25XIT delivers 10-ns tighter timing for high-throughput data acquisition; versus FM16W08-SG, it offers 4× density and native ×16 interface but requires VCAP and has finite STORE cycles - optimal for industrial data logging where speed and capacity outweigh endurance extremes.
Availability
CY14B116N-BZ25XIT is available at Aetrix Electronics and suitable for industrial control systems, medical device configuration storage, and telecom base station parameter retention requiring stable component supply and long-lifecycle support.
Supply support for CY14B116N-BZ25XIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and industrial control solutions.
This device belongs to the nvSRAM product line originally developed by Cypress and now maintained by Infineon, designed specifically for mission-critical applications demanding instant, reliable, and maintenance-free nonvolatile data retention without batteries or external controllers.
FAQ
What is the function of the VCAP pin, and what capacitor value is required?
The VCAP pin connects an external capacitor that supplies energy during VCC collapse to complete the STORE operation. A 4.7 µF tantalum capacitor with ≤1 Ω ESR is required - this value is validated in the datasheet for 25-ns devices to ensure full STORE completion before VCC falls below 2.0 V. Using ceramic capacitors is not recommended due to insufficient charge hold time.
Does CY14B116N-BZ25XIT support Sleep mode via the ZZ pin?
No. Sleep mode is only supported in the 165-ball FBGA package variant (as confirmed in Pin Definitions, Note 9). The CY14B116N-BZ25XIT is a 54-pin TSOP II package, and the ZZ pin is not functional - standby current remains at 650 µA, with no additional power reduction via ZZ assertion.
Can this part be used as a direct replacement for standard 1024K × 16 SRAMs?
Yes - it is pin-compatible and timing-compatible with industry-standard 1024K × 16 SRAMs in 54-pin TSOP II packages. All control signals (CE, WE, OE), address (A0–A19), and data (DQ0–DQ15) match. The only design change needed is adding the VCAP capacitor and optionally wiring HSB for hardware-initiated STORE.
How many STORE cycles can the QuantumTrap element endure?
The QuantumTrap nonvolatile element is rated for 1 million STORE cycles, as specified in the datasheet's "Data Retention and Endurance" section. This exceeds typical field requirements for industrial equipment with daily power cycles over 27 years - making it suitable for applications where STORE occurs on every power-down event.
CY14B116N-BZ25XIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- NVSRAM
- Technology:
- NVSRAM (Non-Volatile SRAM)
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns
- Access Time:
- 25 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY14B116N-BZ25XIT FAQ
1.How can I place an order for CY14B116N-BZ25XIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY14B116N-BZ25XIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY14B116N-BZ25XIT reliable?
The price and inventory of CY14B116N-BZ25XIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY14B116N-BZ25XIT is usually 5 days.
3.What payment methods are accepted for CY14B116N-BZ25XIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY14B116N-BZ25XIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY14B116N-BZ25XIT?
CY14B116N-BZ25XIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY14B116N-BZ25XIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY14B116N-BZ25XIT?
For technical support, including CY14B116N-BZ25XIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY14B116N-BZ25XIT requirements.
6.How does Aetrix verify that CY14B116N-BZ25XIT is sourced from the original manufacturer or authorized distributors?
All CY14B116N-BZ25XIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY14B116N-BZ25XIT meets industry standards.
7.What is the process for return or replacement of CY14B116N-BZ25XIT?
All CY14B116N-BZ25XIT units undergo pre-shipment inspection (PSI). If there is an issue with CY14B116N-BZ25XIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY14B116N-BZ25XIT part is unused and in its original packaging.
Return procedure for CY14B116N-BZ25XIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY14B116N-BZ25XIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

