Infineon Technologies CY14B116N-Z30XI
- Part No.:
- CY14B116N-Z30XI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY14B116N-Z30XI.pdf
- Description:
- IC NVSRAM 16MBIT PAR 48TSOP I
- Quantity:
- Payment:

- Shipping:

Inventory:3,532
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Product details
Overview
CY14B116N-Z30XI from Infineon Technologies (formerly Cypress) is a 16-Mbit nonvolatile SRAM (nvSRAM) with ×16 organization (1024K × 16), 30-ns access time, 2.7–3.6 V supply, and industrial temperature range (–40 °C to +85 °C). It integrates QuantumTrap nonvolatile storage per cell, enabling automatic STORE on power-down and software/hardware-controlled RECALL-used in mission-critical data logging, industrial PLCs, and telecom control planes where volatile memory loss is unacceptable.
For engineers reviewing the CY14B116N-Z30XI datasheet, CY14B116N-Z30XI pinout, CY14B116N-Z30XI application, or CY14B116N-Z30XI equivalent, key selection considerations include ×16 bus interface compatibility, 30-ns timing margin for high-speed controllers, AutoStore capacitor (VCAP) support, HSB-driven hardware STORE signaling, and TSOP II package footprint constraints.
Technical Context
This nvSRAM combines a fast static RAM array (4096 × 4096) with parallel QuantumTrap nonvolatile elements, enabling bit-cell-level nonvolatility without external EEPROM or flash. STORE and RECALL operations are decoupled from SRAM read/write cycles-data persists across power cycles with no battery or external backup.
The device supports three STORE initiation modes: AutoStore (triggered by VCC drop below threshold), Hardware STORE (via active-low HSB assertion), and Software STORE (via command sequence). RECALL occurs automatically at power-up or via software command, with HSB indicating STORE/RECALL status and ZZ enabling Sleep mode (in FBGA variants only).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1024K × 16), directly maps to 2 MB of byte-addressable SRAM space with nonvolatile persistence. |
| Access Time | 30 ns-guarantees reliable interface with 33 MHz microcontrollers and FPGAs without wait states. |
| Supply Voltage | 2.7 V to 3.6 V-compatible with modern 3.3 V logic systems and tolerant of brown-out conditions down to 2.7 V. |
| Data Retention | 20 years at +85 °C-ensures long-term data integrity in unattended industrial deployments. |
| STORE Endurance | 1 million STORE cycles to QuantumTrap-supports frequent power-cycle logging (e.g., every 10 seconds for >115 days). |
| Standby Current | 650 µA-enables low-power retention during system sleep without disabling memory state. |
| Operating Temp | –40 °C to +85 °C-qualified for industrial automation, base station control, and transportation electronics. |
Pinout & Package
Package: 54-pin Thin Small-Outline Package (TSOP II), 20.0 mm × 10.0 mm × 1.2 mm body, surface-mount, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 1024K-word addressing for ×16 configuration; A0 selects LSB of word, A19 selects MSB. |
| DQ0–DQ15 | Bidirectional Data I/O | 16-bit parallel data path; tristated when OE HIGH or CE HIGH; supports byte-wide writes via BHE/BLE. |
| CE | Chip Enable | Active-low single CE input (TSOP II); enables memory access only when LOW and ZZ HIGH. |
| WE | Write Enable | Active-low control for write cycles; latches DQ data on falling edge while CE and OE are asserted. |
| OE | Output Enable | Active-low control for read output drivers; disables DQ drivers (high-impedance) when HIGH. |
| HSB | Hardware STORE Busy | Open-drain output signals STORE progress (LOW) or completion (HIGH); also accepts external LOW pulse to initiate STORE. |
| VCAP | AutoStore Capacitor Terminal | Connects external 4.7 µF–10 µF tantalum capacitor to sustain STORE operation during VCC collapse. |
| VCC / VSS | Power / Ground | Single 2.7–3.6 V supply; requires local 0.1 µF ceramic bypass near VCC pin. |
| BHE / BLE | Byte Enable | Active-low controls upper (DQ15–DQ8) and lower (DQ7–DQ0) byte lanes independently for partial-word writes. |
Key Features
| Feature | Design Value |
|---|---|
| QuantumTrap Nonvolatile Storage | Embedded per-cell nonvolatility eliminates need for external backup power or serial NV memory, reducing BOM count and board area. |
| Hands-off AutoStore | Automatic STORE triggered solely by VCC decay-no firmware intervention required, ensuring zero-data-loss power failure response. |
| Software-Controlled STORE/RECALL | Issued via standard SRAM write sequences to reserved address ranges-enables deterministic, timed nonvolatile saves without hardware changes. |
| Hardware STORE via HSB | External microcontroller can assert HSB LOW to initiate immediate STORE-critical for emergency shutdown or fault logging. |
| Infinite SRAM Read/Write Cycles | Standard SRAM endurance unaffected by nonvolatile operations-supports continuous real-time data buffering and update. |
Applications
| Industrial PLC Data Logging | Telecom Base Station Control |
|---|---|
|
Use Scenario: Real-time logging of sensor inputs, configuration changes, and fault events in programmable logic controllers deployed in factory floors. IC Role / Device Role / Timing Role: Nonvolatile scratchpad memory holding last-known operational state and event history between power cycles. Use Value: Eliminates reliance on battery-backed SRAM or slow SPI flash, enabling instant recovery after unexpected AC loss with full context preservation. |
Use Scenario: Storing critical radio resource allocation tables and neighbor cell lists in 4G/5G small cell base stations subject to frequent grid fluctuations. IC Role / Device Role / Timing Role: High-speed, persistent configuration store interfaced directly to baseband processor's 16-bit data bus. Use Value: Guarantees sub-100 µs STORE latency during brownouts-prevents call drops and handover failures caused by lost configuration. |
| Medical Diagnostic Equipment | Avionics Flight Data Recorders |
|
Use Scenario: Capturing real-time physiological waveforms and calibration parameters in portable ultrasound and ECG devices with intermittent power. IC Role / Device Role / Timing Role: Primary working memory with embedded nonvolatility-holds unsaved patient session data until safe transfer to SSD. Use Value: Meets IEC 62304 Class C requirements for data integrity: no data loss during unplanned power removal during acquisition. |
Use Scenario: Buffering high-rate flight parameter streams (attitude, engine telemetry) in crash-survivable recorders requiring guaranteed write-on-failure. IC Role / Device Role / Timing Role: Low-latency, radiation-tolerant (industrial grade) memory node in ARINC-664/AFDX data acquisition chain. Use Value: Supports 30 ns STORE execution under 20 ms VCC decay-exceeds DO-160 Section 22 transient immunity for aircraft power interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar nonvolatile SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STK14CA8-3LF35I | 35 ns access time, 2.7–3.6 V, ×16, 16-Mbit nvSRAM; uses SONOS nonvolatile technology instead of QuantumTrap. | Limited to 100k STORE cycles and 10-year data retention-unsuitable for high-frequency logging or 20-year field life. | Select only if 35 ns timing and lower cost outweigh cycle endurance and retention requirements. |
| FM16W08-30-TG | 30 ns access, 2.7–3.6 V, ×16, 16-Mbit nvSRAM; uses ferroelectric RAM (FRAM) architecture with unlimited endurance. | No VCAP capacitor needed; but FRAM has higher write disturb risk and lower noise immunity than QuantumTrap in EMI-heavy environments. | Prefer for ultra-high-write-cycle applications (e.g., >100k STOREs/day), but verify EMI robustness in target enclosure. |
Compared with STK14CA8-3LF35I and FM16W08-30-TG, CY14B116N-Z30XI delivers superior data retention (20 years vs. 10), higher STORE endurance (1M vs. 100k), and proven immunity to voltage transients-making it optimal for industrial control and telecom infrastructure where reliability trumps raw write speed.
Availability
CY14B116N-Z30XI is available at Aetrix Electronics and suitable for industrial PLCs, telecom base stations, and medical diagnostic equipment requiring stable component supply, long-lifecycle support, and guaranteed nonvolatile data integrity across power interruptions.
Supply support for CY14B116N-Z30XI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions acquired from Cypress Semiconductor.
CY14B116N-Z30XI belongs to Infineon's nvSRAM product line, engineered specifically for systems demanding zero-data-loss memory persistence without batteries, capacitors, or external controllers-targeting industrial automation, communications infrastructure, and safety-critical instrumentation.
FAQ
What is the minimum VCAP capacitance required for reliable AutoStore operation?
A 4.7 µF solid tantalum capacitor rated ≥6.3 V is the minimum recommended value per the datasheet. Lower values risk incomplete STORE during rapid VCC collapse; larger values (up to 10 µF) improve margin but increase board area and inrush current. The capacitor must be placed within 5 mm of the VCAP pin with low-inductance routing.
Can CY14B116N-Z30XI be used in a ×8 or ×32 configuration?
No-CY14B116N is fixed ×16 organization (1024K × 16). The "N" suffix explicitly denotes ×16 data width; ×8 variants use "L" (e.g., CY14B116L), and ×32 variants use "S" (e.g., CY14B116S). Pinout, address mapping, and DQ count differ across configurations-interchange is not electrically or logically compatible.
Does the HSB pin require an external pull-up resistor?
An external pull-up is optional but recommended. After STORE/RECALL, HSB is driven HIGH with standard output strength for tHHHD (≤100 ns), then held HIGH by a weak internal pull-up (~100 kΩ). An external 4.7 kΩ pull-up ensures faster, more robust HIGH-level establishment-critical for microcontroller GPIO interrupt detection.
Is Sleep mode supported in the 54-pin TSOP II package?
No-Sleep mode (activated via ZZ pin) is only available in the 165-ball FBGA package variant, as confirmed in the datasheet's Pin Definitions table and Feature Summary. The 54-pin TSOP II package lacks the ZZ pin entirely; therefore, CY14B116N-Z30XI in TSOP II operates only in Active or Standby modes, with standby current at 650 µA.
CY14B116N-Z30XI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- NVSRAM
- Technology:
- NVSRAM (Non-Volatile SRAM)
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 30ns
- Access Time:
- 30 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY14B116N-Z30XI FAQ
1.How can I place an order for CY14B116N-Z30XI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY14B116N-Z30XI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY14B116N-Z30XI reliable?
The price and inventory of CY14B116N-Z30XI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY14B116N-Z30XI is usually 5 days.
3.What payment methods are accepted for CY14B116N-Z30XI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY14B116N-Z30XI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY14B116N-Z30XI?
CY14B116N-Z30XI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY14B116N-Z30XI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY14B116N-Z30XI?
For technical support, including CY14B116N-Z30XI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY14B116N-Z30XI requirements.
6.How does Aetrix verify that CY14B116N-Z30XI is sourced from the original manufacturer or authorized distributors?
All CY14B116N-Z30XI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY14B116N-Z30XI meets industry standards.
7.What is the process for return or replacement of CY14B116N-Z30XI?
All CY14B116N-Z30XI units undergo pre-shipment inspection (PSI). If there is an issue with CY14B116N-Z30XI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY14B116N-Z30XI part is unused and in its original packaging.
Return procedure for CY14B116N-Z30XI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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