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Infineon Technologies CY14B116N-Z30XI

Part No.:
CY14B116N-Z30XI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixCY14B116N-Z30XI.pdf
Description:
IC NVSRAM 16MBIT PAR 48TSOP I
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,532

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Product details

Overview

CY14B116N-Z30XI from Infineon Technologies (formerly Cypress) is a 16-Mbit nonvolatile SRAM (nvSRAM) with ×16 organization (1024K × 16), 30-ns access time, 2.7–3.6 V supply, and industrial temperature range (–40 °C to +85 °C). It integrates QuantumTrap nonvolatile storage per cell, enabling automatic STORE on power-down and software/hardware-controlled RECALL-used in mission-critical data logging, industrial PLCs, and telecom control planes where volatile memory loss is unacceptable.

For engineers reviewing the CY14B116N-Z30XI datasheet, CY14B116N-Z30XI pinout, CY14B116N-Z30XI application, or CY14B116N-Z30XI equivalent, key selection considerations include ×16 bus interface compatibility, 30-ns timing margin for high-speed controllers, AutoStore capacitor (VCAP) support, HSB-driven hardware STORE signaling, and TSOP II package footprint constraints.

Technical Context

This nvSRAM combines a fast static RAM array (4096 × 4096) with parallel QuantumTrap nonvolatile elements, enabling bit-cell-level nonvolatility without external EEPROM or flash. STORE and RECALL operations are decoupled from SRAM read/write cycles-data persists across power cycles with no battery or external backup.

The device supports three STORE initiation modes: AutoStore (triggered by VCC drop below threshold), Hardware STORE (via active-low HSB assertion), and Software STORE (via command sequence). RECALL occurs automatically at power-up or via software command, with HSB indicating STORE/RECALL status and ZZ enabling Sleep mode (in FBGA variants only).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (1024K × 16), directly maps to 2 MB of byte-addressable SRAM space with nonvolatile persistence.
Access Time 30 ns-guarantees reliable interface with 33 MHz microcontrollers and FPGAs without wait states.
Supply Voltage 2.7 V to 3.6 V-compatible with modern 3.3 V logic systems and tolerant of brown-out conditions down to 2.7 V.
Data Retention 20 years at +85 °C-ensures long-term data integrity in unattended industrial deployments.
STORE Endurance 1 million STORE cycles to QuantumTrap-supports frequent power-cycle logging (e.g., every 10 seconds for >115 days).
Standby Current 650 µA-enables low-power retention during system sleep without disabling memory state.
Operating Temp –40 °C to +85 °C-qualified for industrial automation, base station control, and transportation electronics.

Pinout & Package

Package: 54-pin Thin Small-Outline Package (TSOP II), 20.0 mm × 10.0 mm × 1.2 mm body, surface-mount, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address Inputs 1024K-word addressing for ×16 configuration; A0 selects LSB of word, A19 selects MSB.
DQ0–DQ15 Bidirectional Data I/O 16-bit parallel data path; tristated when OE HIGH or CE HIGH; supports byte-wide writes via BHE/BLE.
CE Chip Enable Active-low single CE input (TSOP II); enables memory access only when LOW and ZZ HIGH.
WE Write Enable Active-low control for write cycles; latches DQ data on falling edge while CE and OE are asserted.
OE Output Enable Active-low control for read output drivers; disables DQ drivers (high-impedance) when HIGH.
HSB Hardware STORE Busy Open-drain output signals STORE progress (LOW) or completion (HIGH); also accepts external LOW pulse to initiate STORE.
VCAP AutoStore Capacitor Terminal Connects external 4.7 µF–10 µF tantalum capacitor to sustain STORE operation during VCC collapse.
VCC / VSS Power / Ground Single 2.7–3.6 V supply; requires local 0.1 µF ceramic bypass near VCC pin.
BHE / BLE Byte Enable Active-low controls upper (DQ15–DQ8) and lower (DQ7–DQ0) byte lanes independently for partial-word writes.

Key Features

Feature Design Value
QuantumTrap Nonvolatile Storage Embedded per-cell nonvolatility eliminates need for external backup power or serial NV memory, reducing BOM count and board area.
Hands-off AutoStore Automatic STORE triggered solely by VCC decay-no firmware intervention required, ensuring zero-data-loss power failure response.
Software-Controlled STORE/RECALL Issued via standard SRAM write sequences to reserved address ranges-enables deterministic, timed nonvolatile saves without hardware changes.
Hardware STORE via HSB External microcontroller can assert HSB LOW to initiate immediate STORE-critical for emergency shutdown or fault logging.
Infinite SRAM Read/Write Cycles Standard SRAM endurance unaffected by nonvolatile operations-supports continuous real-time data buffering and update.

Applications

Industrial PLC Data Logging Telecom Base Station Control

Use Scenario: Real-time logging of sensor inputs, configuration changes, and fault events in programmable logic controllers deployed in factory floors.

IC Role / Device Role / Timing Role: Nonvolatile scratchpad memory holding last-known operational state and event history between power cycles.

Use Value: Eliminates reliance on battery-backed SRAM or slow SPI flash, enabling instant recovery after unexpected AC loss with full context preservation.

Use Scenario: Storing critical radio resource allocation tables and neighbor cell lists in 4G/5G small cell base stations subject to frequent grid fluctuations.

IC Role / Device Role / Timing Role: High-speed, persistent configuration store interfaced directly to baseband processor's 16-bit data bus.

Use Value: Guarantees sub-100 µs STORE latency during brownouts-prevents call drops and handover failures caused by lost configuration.

Medical Diagnostic Equipment Avionics Flight Data Recorders

Use Scenario: Capturing real-time physiological waveforms and calibration parameters in portable ultrasound and ECG devices with intermittent power.

IC Role / Device Role / Timing Role: Primary working memory with embedded nonvolatility-holds unsaved patient session data until safe transfer to SSD.

Use Value: Meets IEC 62304 Class C requirements for data integrity: no data loss during unplanned power removal during acquisition.

Use Scenario: Buffering high-rate flight parameter streams (attitude, engine telemetry) in crash-survivable recorders requiring guaranteed write-on-failure.

IC Role / Device Role / Timing Role: Low-latency, radiation-tolerant (industrial grade) memory node in ARINC-664/AFDX data acquisition chain.

Use Value: Supports 30 ns STORE execution under 20 ms VCC decay-exceeds DO-160 Section 22 transient immunity for aircraft power interruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar nonvolatile SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
STK14CA8-3LF35I 35 ns access time, 2.7–3.6 V, ×16, 16-Mbit nvSRAM; uses SONOS nonvolatile technology instead of QuantumTrap. Limited to 100k STORE cycles and 10-year data retention-unsuitable for high-frequency logging or 20-year field life. Select only if 35 ns timing and lower cost outweigh cycle endurance and retention requirements.
FM16W08-30-TG 30 ns access, 2.7–3.6 V, ×16, 16-Mbit nvSRAM; uses ferroelectric RAM (FRAM) architecture with unlimited endurance. No VCAP capacitor needed; but FRAM has higher write disturb risk and lower noise immunity than QuantumTrap in EMI-heavy environments. Prefer for ultra-high-write-cycle applications (e.g., >100k STOREs/day), but verify EMI robustness in target enclosure.

Compared with STK14CA8-3LF35I and FM16W08-30-TG, CY14B116N-Z30XI delivers superior data retention (20 years vs. 10), higher STORE endurance (1M vs. 100k), and proven immunity to voltage transients-making it optimal for industrial control and telecom infrastructure where reliability trumps raw write speed.

Availability

CY14B116N-Z30XI is available at Aetrix Electronics and suitable for industrial PLCs, telecom base stations, and medical diagnostic equipment requiring stable component supply, long-lifecycle support, and guaranteed nonvolatile data integrity across power interruptions.

Supply support for CY14B116N-Z30XI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions acquired from Cypress Semiconductor.

CY14B116N-Z30XI belongs to Infineon's nvSRAM product line, engineered specifically for systems demanding zero-data-loss memory persistence without batteries, capacitors, or external controllers-targeting industrial automation, communications infrastructure, and safety-critical instrumentation.

FAQ

What is the minimum VCAP capacitance required for reliable AutoStore operation?

A 4.7 µF solid tantalum capacitor rated ≥6.3 V is the minimum recommended value per the datasheet. Lower values risk incomplete STORE during rapid VCC collapse; larger values (up to 10 µF) improve margin but increase board area and inrush current. The capacitor must be placed within 5 mm of the VCAP pin with low-inductance routing.

Can CY14B116N-Z30XI be used in a ×8 or ×32 configuration?

No-CY14B116N is fixed ×16 organization (1024K × 16). The "N" suffix explicitly denotes ×16 data width; ×8 variants use "L" (e.g., CY14B116L), and ×32 variants use "S" (e.g., CY14B116S). Pinout, address mapping, and DQ count differ across configurations-interchange is not electrically or logically compatible.

Does the HSB pin require an external pull-up resistor?

An external pull-up is optional but recommended. After STORE/RECALL, HSB is driven HIGH with standard output strength for tHHHD (≤100 ns), then held HIGH by a weak internal pull-up (~100 kΩ). An external 4.7 kΩ pull-up ensures faster, more robust HIGH-level establishment-critical for microcontroller GPIO interrupt detection.

Is Sleep mode supported in the 54-pin TSOP II package?

No-Sleep mode (activated via ZZ pin) is only available in the 165-ball FBGA package variant, as confirmed in the datasheet's Pin Definitions table and Feature Summary. The 54-pin TSOP II package lacks the ZZ pin entirely; therefore, CY14B116N-Z30XI in TSOP II operates only in Active or Standby modes, with standby current at 650 µA.

CY14B116N-Z30XI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-TFSOP (0.724", 18.40mm Width)
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
NVSRAM
Technology:
NVSRAM (Non-Volatile SRAM)
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
30ns
Access Time:
30 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TSOP I

CY14B116N-Z30XI FAQ

1.How can I place an order for CY14B116N-Z30XI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY14B116N-Z30XI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY14B116N-Z30XI reliable?

The price and inventory of CY14B116N-Z30XI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY14B116N-Z30XI is usually 5 days.

3.What payment methods are accepted for CY14B116N-Z30XI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY14B116N-Z30XI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY14B116N-Z30XI?

CY14B116N-Z30XI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY14B116N-Z30XI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY14B116N-Z30XI?

For technical support, including CY14B116N-Z30XI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY14B116N-Z30XI requirements.

6.How does Aetrix verify that CY14B116N-Z30XI is sourced from the original manufacturer or authorized distributors?

All CY14B116N-Z30XI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY14B116N-Z30XI meets industry standards.

7.What is the process for return or replacement of CY14B116N-Z30XI?

All CY14B116N-Z30XI units undergo pre-shipment inspection (PSI). If there is an issue with CY14B116N-Z30XI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY14B116N-Z30XI part is unused and in its original packaging.

Return procedure for CY14B116N-Z30XI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY14B116N-Z30XI Tags

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