Infineon Technologies CY14B116N-ZSP25XIT

Overview

CY14B116N-ZSP25XIT from Infineon Technologies (formerly Cypress) is a 16-Mbit nonvolatile SRAM (nvSRAM) with ×16 organization (1024K × 16), 25-ns access time, 2.7–3.6 V supply, and QuantumTrap nonvolatile storage. It performs automatic STORE on power-down using an external capacitor (VCAP), supports software/hardware-triggered STORE/RECALL, and operates across –40 °C to +85 °C for industrial data logging and control systems.

For engineers reviewing the CY14B116N-ZSP25XIT datasheet, CY14B116N-ZSP25XIT pinout, CY14B116N-ZSP25XIT application, or CY14B116N-ZSP25XIT equivalent, key selection criteria include ×16 bus interface compatibility, AutoStore timing under voltage droop, HSB-driven STORE confirmation, and FBGA vs. TSOP II package thermal/power trade-offs in space-constrained embedded designs.

Technical Context

This nvSRAM integrates a fast 25-ns SRAM array with parallel QuantumTrap nonvolatile elements per cell, enabling infinite SRAM read/write cycles and 1 million STORE cycles. STORE transfers data from SRAM to nonvolatile storage via hardware (HSB pin), software command, or autonomous power-loss detection using VCAP.

RECALL restores data on power-up or via software; Sleep mode (enabled by ZZ pin) reduces current to 10 µA and is supported only in the 165-ball FBGA variant. The device uses dual CE (CE1/CE2) logic in FBGA packages and single CE in TSOP II, with BHE/ BLE byte enables active for ×16 operation.

Key Specifications

Pinout & Package

The CY14B116N-ZSP25XIT is packaged in a 165-ball fine-pitch ball grid array (FBGA) with 0.8 mm pitch, RoHS-compliant, and optimized for thermal dissipation and board-level reliability in high-density industrial PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar nonvolatile SRAM applications.

Compared with CY14B116N-ZS25XI, the ZSP25XIT adds Sleep mode and FBGA thermal performance; versus FM16W08-25-SG, it delivers deterministic, capacitor-driven STORE without firmware intervention - critical for safety-critical or resource-constrained edge nodes.

Availability

CY14B116N-ZSP25XIT is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, automotive ADAS gateways, and smart grid RTUs requiring stable component supply, long-life data retention, and seamless migration from legacy Cypress nvSRAMs.

Supply support for CY14B116N-ZSP25XIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and industrial control solutions with strong emphasis on reliability and functional safety.

This part belongs to Infineon's nvSRAM product line, designed specifically for mission-critical applications demanding instant nonvolatility, zero-write-endurance limits, and deterministic power-loss recovery without external controllers.

FAQ

What is the minimum VCAP capacitance required for reliable AutoStore operation?

The CY14B116N-ZSP25XIT requires a minimum 4.7 µF tantalum capacitor on VCAP to guarantee full STORE completion within 20 ms during VCC collapse from 2.7 V to 1.5 V. Ceramic capacitors are not recommended due to insufficient energy density and DC bias derating; solid tantalum with ≤1 Ω ESR ensures stable discharge profile per datasheet Figure 21.

Does the 165-ball FBGA support both ×16 and ×32 configurations?

No - the CY14B116N-ZSP25XIT is strictly a ×16-configured device (1024K × 16), as indicated by the "N" suffix and confirmed by its pinout: it includes BHE/ BLE but omits BA/ BB/ BC/ BD byte enables required for ×32. The 165-ball FBGA variant shown in Figure 6 supports only ×16 organization.

Can HSB be used simultaneously as input and output without conflict?

Yes - HSB is an open-drain bidirectional pin. During internal STORE, it actively drives LOW; when externally pulled LOW, it initiates STORE. The internal weak pull-up (typ. 100 kΩ) ensures safe release after STORE completion. No external driver conflict occurs because the device only asserts LOW and never drives HIGH actively.

Is the ZZ (Sleep) function available in all package variants of CY14B116N?

No - Sleep mode via ZZ is supported exclusively in the 165-ball FBGA package (e.g., ZSP25XIT). TSOP II and TSOP I variants lack the ZZ pin and associated internal circuitry; their lowest standby current is 650 µA, not 10 µA. This is explicitly stated in the Pin Definitions table footnote 9.