Infineon Technologies CY14B116S-BZ25XI

Overview

CY14B116S-BZ25XI from Infineon Technologies (formerly Cypress) is a 16-Mbit nonvolatile SRAM (nvSRAM) with ×32 organization (512K × 32), 25-ns access time, 2.7–3.6 V supply, and QuantumTrap nonvolatile storage. It performs automatic STORE on power-down using an external capacitor (VCAP) and supports software/hardware-initiated STORE/RECALL. Used in industrial control systems requiring instant data retention during unexpected power loss.

For engineers reviewing the CY14B116S-BZ25XI datasheet, CY14B116S-BZ25XI pinout, CY14B116S-BZ25XI application, or CY14B116S-BZ25XI equivalent, key selection criteria include ×32 bus width support, 25-ns timing, VCAP-based hands-off STORE, industrial temperature range (–40 °C to +85 °C), and 165-ball FBGA package compatibility.

Technical Context

This nvSRAM integrates a standard SRAM array (512K × 32) with parallel QuantumTrap nonvolatile elements per cell, enabling infinite SRAM read/write cycles and 1 million STORE cycles. STORE transfers data from volatile SRAM to nonvolatile cells either automatically at power-down (via VCAP discharge detection) or on demand via HSB pin assertion or software command.

RECALL restores data from QuantumTrap to SRAM at power-up or via software. The device supports byte-level addressing through BA/BB/BC/BD enables for ×32 mode and uses dual CE (CE1/CE2) logic in FBGA packages, with ZZ-enabled Sleep mode available only in the 165-ball FBGA variant.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm, 0.8 mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar nonvolatile SRAM applications.

Compared with FM16W08 and AS1016-32, CY14B116S-BZ25XI uniquely delivers 25-ns timing with VCAP-based deterministic STORE in a ×32 configuration - making it optimal for high-throughput, safety-critical industrial and transportation systems requiring guaranteed data capture at power failure onset.

Availability

CY14B116S-BZ25XI is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, avionics data recorders, and railway signaling equipment requiring stable component supply across extended product lifecycles.

Supply support for CY14B116S-BZ25XI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive ICs, and industrial control solutions.

CY14B116S belongs to Infineon's nvSRAM product line, engineered specifically for mission-critical applications demanding instantaneous, battery-free nonvolatile data retention during power disruption.

FAQ

What is the function of the VCAP pin, and what capacitor value is required?

The VCAP pin supplies hold-up energy for automatic STORE during power loss. A 4.7 µF solid tantalum capacitor rated ≥6.3 V must be placed within 10 mm of the pin with low-ESR (<1 Ω) and low-ESL layout. This ensures ≥25 ns of valid VCC hold-up time for complete 16-Mbit STORE at 25 ns speed.

Does CY14B116S-BZ25XI support software STORE/RECALL, and how is it implemented?

Yes - software STORE/RECALL is implemented via specific address/data sequences written to reserved locations in the memory map (e.g., STORE command: write 0x0000 to address 0x000000). These commands are latched internally and initiate atomic STORE/RECALL without CPU intervention after acknowledgment. Full timing and sequence details are defined in Section 9 of datasheet 001-67793 Rev. *P.

Is the ZZ (Sleep Mode) pin functional in all package variants of CY14B116S?

No - Sleep Mode via the ZZ pin is supported exclusively in the 165-ball FBGA package (e.g., CY14B116S-BZ25XI). It is not available in TSOP II, TSOP I, or 60-ball FBGA variants. When enabled, ZZ reduces ICC to 10 µA while preserving SRAM data and allowing immediate wake-up upon CE activation.

How does the ×32 organization affect address and data pin mapping compared to ×8 or ×16 versions?

In ×32 mode, address pins A0–A18 select 524,288 words, and DQ0–DQ31 provide full 32-bit I/O. Byte enables BA/BB/BC/BD replace BLE/BHE used in ×16 mode, allowing independent control of each 8-bit lane. Pinouts differ significantly - e.g., TSOP packages do not support ×32; only 165-ball FBGA provides full ×32 connectivity with dedicated BA–BD pins.