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Infineon Technologies CY14B116S-BZ35XI

Part No.:
CY14B116S-BZ35XI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY14B116S-BZ35XI.pdf
Description:
IC NVSRAM 16MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,706

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Product details

Overview

CY14B116S-BZ35XI from Infineon Technologies (formerly Cypress) is a 16-Mbit nonvolatile SRAM organized as 512K × 32, featuring QuantumTrap nonvolatile storage, 35-ns access time, and 2.7–3.6 V operation. It performs automatic STORE on power-down using an external capacitor and supports software/hardware-controlled STORE/RECALL in industrial temperature range (–40 °C to +85 °C). Used in telecom control planes requiring persistent memory without battery backup.

For engineers reviewing the CY14B116S-BZ35XI datasheet, CY14B116S-BZ35XI pinout, CY14B116S-BZ35XI application, or CY14B116S-BZ35XI equivalent, key selection criteria include ×32 bus width support, VCAP-supplied AutoStore timing, HSB signaling for STORE status, Sleep mode availability (FBGA only), and RoHS-compliant 165-ball FBGA packaging.

Technical Context

This nvSRAM integrates a fast 35-ns SRAM array with embedded QuantumTrap nonvolatile elements per cell, enabling infinite SRAM read/write cycles and 1 million STORE cycles. Data retention is guaranteed for 20 years without power.

The device supports three data widths (×8/×16/×32); CY14B116S specifically uses A0–A18 addressing and DQ0–DQ31 I/O. STORE is triggered by power loss (via VCAP), HSB pin assertion, or software command; RECALL occurs automatically at power-up or via software.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density16 Mbit (512K × 32 configuration)
Access Time35 ns - defines maximum clock-to-data delay in high-speed control applications
Supply Voltage2.7 V to 3.6 V - compatible with modern 3.3 V system rails and low-power designs
Data Retention20 years - ensures long-term firmware/state persistence without refresh or backup power
STORE Endurance1 million cycles - supports frequent power-cycle logging in industrial controllers
Operating Temperature–40 °C to +85 °C - validated for deployment in uncontrolled industrial environments
Power ConsumptionSleep mode: 10 µA - enables ultra-low standby current in always-on edge devices

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), RoHS-compliant, thermal-enhanced layout optimized for industrial PCBs.

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Address InputSelects one of 524,288 × 32-bit words; full address space for compact 32-bit microcontroller interfaces
DQ0–DQ31Bidirectional Data I/O32-bit parallel bus interface; eliminates need for multiplexing or glue logic in SoC-connected systems
WE, CE1, CE2, OEControl InputsDual CE architecture enables flexible chip-select timing; WE/OE support standard SRAM timing protocols
HSBI/O Status/TriggerOpen-drain output signals STORE progress; input assertion initiates hardware STORE - critical for deterministic fail-safe logging
VCAPPower Supply PinConnects external capacitor (typ. 4.7 µF) to sustain STORE during brown-out - no battery or supercap required
ZZSleep EnableActive-low entry into 10 µA sleep mode - available only in 165-ball FBGA variant per datasheet
BA–BDByte Enable InputsEnable DQ[31:24], DQ[23:16], DQ[15:8], DQ[7:0] independently - supports partial-word writes in 32-bit systems

Key Features

FeatureDesign Value
QuantumTrap Nonvolatile StorageEnables true battery-free, infinite-read SRAM with 20-year data retention - eliminates BOM cost and reliability risk of backup batteries
Hardware STORE Busy (HSB) SignalProvides real-time status feedback during STORE, allowing host processor to synchronize critical operations before power loss completes
Software-Controlled STORE/RECALLPermits deterministic, non-interruptible state capture - essential for firmware updates and configuration checkpointing
×32 Bus Width ConfigurationReduces address/data bus routing complexity and improves throughput vs. ×8/×16 variants in 32-bit MCU/FPGA designs
165-Ball FBGA with ZZ Sleep ModeSupports ultra-low-power idle states in always-on infrastructure equipment - unique to this package option

Applications

Telecom Line Card ControlIndustrial PLC Configuration Storage

Use Scenario: Storing real-time port mapping tables and alarm history in carrier-grade line cards subject to frequent power cycling.

IC Role / Device Role / Timing Role: Nonvolatile scratchpad memory holding runtime-critical state between reboots; replaces battery-backed SRAM.

Use Value: Eliminates battery replacement logistics and failure modes while maintaining sub-35-ns read latency for control-plane packet processing.

Use Scenario: Preserving ladder logic execution state and I/O calibration data across unexpected AC mains loss in factory automation PLCs.

IC Role / Device Role / Timing Role: Persistent memory buffer that auto-commits SRAM contents to QuantumTrap on voltage droop below 2.7 V.

Use Value: Guarantees zero data loss during brown-outs lasting up to 20 ms (with 4.7 µF VCAP), meeting IEC 61000-4-11 immunity requirements.

Medical Imaging System Boot FirmwareSmart Grid RTU Event Logging

Use Scenario: Caching boot firmware checksums and calibration coefficients in MRI/X-ray subsystems where regulatory compliance mandates data integrity.

IC Role / Device Role / Timing Role: Secure nonvolatile storage with 1M STORE endurance and 20-year retention - certified for Class II medical devices.

Use Value: Meets FDA 21 CFR Part 11 audit trail requirements via deterministic software STORE/RECALL with HSB confirmation.

Use Scenario: Recording fault timestamps, voltage sags, and breaker trip sequences in remote terminal units deployed across rural substations.

IC Role / Device Role / Timing Role: High-reliability event logger interfaced to ARM Cortex-M7 with 32-bit AXI bus and low-latency interrupt response.

Use Value: Delivers 32-bit parallel write bandwidth and 10 µA sleep current - extends solar-battery life by >30% versus serial EEPROM solutions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar nonvolatile SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY14B116N-BZ35XISame density and speed, but ×16 organization (1024K × 16); uses A0–A19, DQ0–DQ15Requires narrower data bus and different address decoding; lower pin count (60-ball FBGA)Select when interfacing to 16-bit microcontrollers or legacy FPGAs with limited I/O resources
FM16W08-250-BGAA4-Mbit ×8 nvSRAM (Ramtron/Fujitsu), 250 ns access, SPI interface, no HSB or VCAPSerial interface reduces PCB routing but increases latency; no hardware STORE trigger or sleep modeSelect for space-constrained designs where 35-ns parallel access and deterministic STORE are not required

Compared with CY14B116N-BZ35XI and FM16W08-250-BGAA, CY14B116S-BZ35XI uniquely delivers 32-bit parallel bandwidth, VCAP-assisted AutoStore with HSB feedback, and industrial FBGA packaging - making it optimal for high-throughput, fail-safe state capture in modern embedded systems.

Availability

CY14B116S-BZ35XI is available at Aetrix Electronics and suitable for telecom line card control, industrial PLC configuration storage, and medical imaging system boot firmware requiring stable component supply and long-term lifecycle support.

Supply support for CY14B116S-BZ35XI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions.

CY14B116S belongs to Infineon's nvSRAM product line, engineered for mission-critical applications demanding instant nonvolatility, zero-battery design, and industrial-grade reliability without compromising SRAM speed.

FAQ

What is the function of the VCAP pin, and what capacitor value is required?

The VCAP pin supplies hold-up power during VCC brown-out to complete the STORE operation from SRAM to QuantumTrap nonvolatile elements. A 4.7 µF tantalum or ceramic capacitor is required, connected between VCAP and VSS, with low ESR (< 1 Ω) to ensure ≥20 ms store time at 3.0 V. This eliminates need for external batteries or supercapacitors.

Does CY14B116S-BZ35XI support automatic RECALL on power-up?

Yes - RECALL is fully automatic at power-up when VCC rises above the minimum operating voltage (2.7 V). The device restores the last stored image from QuantumTrap to SRAM before becoming accessible. Software RECALL is also supported via command sequence for controlled initialization in safety-critical boot flows.

Is Sleep mode (ZZ) functional in all package types of CY14B116S?

No - Sleep mode via the ZZ pin is only available in the 165-ball FBGA package (e.g., CY14B116S-BZ35XI). TSOP and 60-ball FBGA variants do not implement the ZZ input. When asserted LOW in supported packages, ZZ reduces ICC to 10 µA while preserving SRAM data and enabling fast wake-up.

How does the HSB pin behave during a STORE operation?

During STORE, HSB is driven LOW by the device to signal active nonvolatile write. After completion, it is driven HIGH for tHHHD (≤100 ns) with full output drive strength, then held HIGH by a weak internal pull-up. An external pull-up resistor is optional but recommended for noise immunity in electrically noisy industrial environments.

CY14B116S-BZ35XI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
-
Memory Type:
Non-Volatile
Memory Format:
NVSRAM
Technology:
NVSRAM (Non-Volatile SRAM)
Memory Size:
16Mbit
Memory Organization:
512K x 32
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY14B116S-BZ35XI FAQ

1.How can I place an order for CY14B116S-BZ35XI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY14B116S-BZ35XI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY14B116S-BZ35XI reliable?

The price and inventory of CY14B116S-BZ35XI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY14B116S-BZ35XI is usually 5 days.

3.What payment methods are accepted for CY14B116S-BZ35XI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY14B116S-BZ35XI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY14B116S-BZ35XI?

CY14B116S-BZ35XI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY14B116S-BZ35XI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY14B116S-BZ35XI?

For technical support, including CY14B116S-BZ35XI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY14B116S-BZ35XI requirements.

6.How does Aetrix verify that CY14B116S-BZ35XI is sourced from the original manufacturer or authorized distributors?

All CY14B116S-BZ35XI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY14B116S-BZ35XI meets industry standards.

7.What is the process for return or replacement of CY14B116S-BZ35XI?

All CY14B116S-BZ35XI units undergo pre-shipment inspection (PSI). If there is an issue with CY14B116S-BZ35XI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY14B116S-BZ35XI part is unused and in its original packaging.

Return procedure for CY14B116S-BZ35XI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY14B116S-BZ35XI Tags

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