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Infineon Technologies CY14B116S-BZ35XIT
- Part No.:
- CY14B116S-BZ35XIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY14B116S-BZ35XIT.pdf
- Description:
- IC NVSRAM 16MBIT PAR 165FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,046
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Product details
Overview
CY14B116S-BZ35XIT from Infineon Technologies (formerly Cypress) is a 16-Mbit nonvolatile SRAM organized as 512K × 32, featuring QuantumTrap nonvolatile storage, 35-ns access time, 2.7–3.6 V operation, and industrial temperature range (–40 °C to +85 °C). It performs automatic STORE on power-down using an external capacitor and supports software/hardware-initiated STORE/RECALL for mission-critical data retention in systems requiring zero-battery backup.
For engineers reviewing the CY14B116S-BZ35XIT datasheet, CY14B116S-BZ35XIT pinout, CY14B116S-BZ35XIT application, or CY14B116S-BZ35XIT equivalent, this page delivers verified package mapping (165-ball FBGA), ×32 bus configuration, HSB/ZZ/Sleep mode support, and direct comparison with CY14B116N and CY14E116S for robust nvSRAM selection in automotive control units, industrial PLCs, and telecom line cards.
Technical Context
The CY14B116S-BZ35XIT integrates a 512K × 32 SRAM array with parallel QuantumTrap nonvolatile elements per cell, enabling bit-level nonvolatility without external battery or EEPROM emulation. Its dual CE architecture (CE1/CE2) and four byte-enable inputs (BA, BB, BC, BD) support full 32-bit data masking and high-speed burst writes in ×32 mode.
STORE is triggered by power loss (via VCAP), HSB pin assertion, or software command; RECALL occurs automatically at power-up or via software. Sleep mode (enabled by ZZ pin) reduces current to 10 µA and is supported exclusively in the 165-ball FBGA package - matching the physical form factor of this part.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (512K × 32), enabling single-chip replacement of legacy 4M×32 or 8M×32 volatile SRAMs with nonvolatile persistence. |
| Access Time | 35 ns - guarantees deterministic read/write timing for real-time control loops running at ≤28.6 MHz bus clock. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with modern 3.3 V system rails and low-voltage FPGA/ASIC I/O domains. |
| Data Retention | 20 years at +85 °C - validated endurance for unattended infrastructure equipment deployed in harsh environments. |
| STORE Endurance | 1 million cycles to QuantumTrap - sufficient for daily firmware updates or configuration saves over 27-year field life. |
| Sleep Current | 10 µA - enables multi-year battery-backed operation in always-on edge nodes when paired with coin-cell backup. |
| Operating Temp | –40 °C to +85 °C - qualified for under-hood automotive ECUs and factory-floor programmable logic controllers. |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm, 0.8 mm pitch, RoHS-compliant. Supports Sleep mode (ZZ pin) and full ×32 data interface with dedicated byte enables (BA–BD).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Select one of 524,288 words in ×32 mode; A18 is MSB - defines 19-bit address space required for full density access. |
| DQ0–DQ31 | Bidirectional Data I/O | Full 32-bit parallel interface; allows single-cycle read/write of 4-byte aligned data - critical for ARM Cortex-R/MIPS cache coherency. |
| BA, BB, BC, BD | Byte Enable Inputs | Active-low enables for DQ[7:0], DQ[15:8], DQ[23:16], DQ[31:24]; permits partial-word writes without read-modify-write overhead. |
| CE1 / CE2 | Dual Chip Enable | Enables memory access on falling CE1 (CE2=HIGH) or rising CE2 (CE1=LOW); supports interleaved bank access in multi-chip modules. |
| HSB | Hardware STORE Busy | Open-drain output signals STORE progress; driven LOW during STORE, HIGH after completion - used for sequencer synchronization. |
| ZZ | Sleep Mode Enable | Active-low entry into 10 µA sleep state; requires CE HIGH to activate - prevents accidental deep-sleep during active CE assertion. |
| VCAP | AutoStore Capacitor Terminal | Connects to 4.7 µF tantalum capacitor; supplies hold-up energy for complete SRAM→QuantumTrap transfer within 20 ms of VCC dropout. |
Key Features
| Feature | Design Value |
|---|---|
| QuantumTrap Nonvolatile Storage | Embedded per-cell nonvolatility eliminates external EEPROM/NVRAM, reducing BOM count and board area by 30% vs. discrete backup solutions. |
| Hands-off AutoStore on Power Loss | Zero-software intervention STORE triggered solely by VCAP discharge - ensures data integrity during unexpected brownouts or hot-swap events. |
| Software-Controlled STORE/RECALL | Issued via specific address/data sequences (e.g., write 0x000000 to 0x000000); enables deterministic save points before firmware updates or safe shutdown. |
| ×32 Bus Interface with Byte Enables | Four independent byte lanes allow concurrent 8-bit updates across 32-bit word - essential for protocol stack buffer management in networking ASICs. |
| Industrial-Temp Sleep Mode | 10 µA standby current at –40 °C to +85 °C - enables always-on telemetry in remote sensors powered by energy harvesters or supercapacitors. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
|
Use Scenario: Storing real-time sensor calibration tables and fault logs during engine runtime, surviving ignition cycling and battery disconnects. IC Role / Device Role / Timing Role: Nonvolatile scratchpad memory holding last-known-good ECU parameters; accessed at 35 ns latency during cold-start initialization. Use Value: Eliminates need for external FRAM or battery-backed SRAM, reducing failure modes and meeting ISO 16750-2 transient voltage immunity requirements. |
Use Scenario: Caching ladder logic state and I/O mapping in modular PLC backplanes where firmware updates occur in-field without power interruption. IC Role / Device Role / Timing Role: High-reliability working memory with atomic STORE/RECALL; synchronized to PLC scan cycle via HSB handshake. Use Value: Guarantees deterministic 20-year data retention of machine configuration even after 10,000+ power cycles - exceeding IEC 61131-2 lifecycle expectations. |
| Telecom Line Card Buffer | Medical Imaging Data Acquisition |
|
Use Scenario: Holding packet header metadata and QoS policy tables in 10G Ethernet PHY interfaces subject to frequent link flaps and thermal cycling. IC Role / Device Role / Timing Role: ×32 interface buffers ingress/egress packet descriptors; BA–BD pins enable selective update of priority fields without disturbing timestamp counters. Use Value: Achieves sub-35 ns descriptor reload after link recovery - maintaining <100 ns jitter budget for IEEE 1588 precision time protocol. |
Use Scenario: Capturing raw DICOM pixel streams from CT/MRI detectors during gantry rotation, where power interruptions must not corrupt image buffers. IC Role / Device Role / Timing Role: Primary frame buffer with hardware STORE triggered by VCAP during emergency spin-down; RECALL restores full 512K-word context on restart. Use Value: Prevents loss of diagnostic-grade image data during 200 ms power dropouts - satisfying IEC 62304 Class C safety-critical data integrity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar nonvolatile SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY14B116N-BZ35XIT | ×16 organization (1024K × 16), same 35 ns speed, 2.7–3.6 V, 165-ball FBGA - lacks BA/BB/BC/BD pins; uses BLE/BHE only. | Requires 16-bit bus interface; unsuitable for 32-bit microcontrollers or SoCs needing native word-aligned access. | Select when interfacing with legacy 16-bit processors (e.g., TI C2000) or space-constrained designs where half the data width suffices. |
| CY14E116S-BZ35XIT | ×32 organization, 4.5–5.5 V supply, identical 165-ball FBGA footprint and pinout - differs only in VCC range and higher active current (85 mA). | Designed for 5 V legacy systems (e.g., older PCI-based instrumentation); incompatible with 3.3 V logic without level-shifting. | Choose for retrofits into 5 V industrial backplanes where voltage rail cannot be modified, accepting 13% higher power draw. |
Compared with CY14B116N-BZ35XIT and CY14E116S-BZ35XIT, the CY14B116S-BZ35XIT uniquely delivers 32-bit native interface compatibility with 3.3 V systems and industrial temperature support - making it the sole option for new designs targeting ARM Cortex-A/R-based edge AI gateways requiring zero-latency nonvolatile buffering.
Availability
CY14B116S-BZ35XIT is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC manufacturing, and medical imaging subsystem integration requiring stable component supply across multi-year production cycles.
Supply support for CY14B116S-BZ35XIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and security ICs for automotive, industrial, and IoT markets.
This part belongs to Infineon's nvSRAM product line - engineered specifically to replace battery-backed SRAM in safety-critical, maintenance-free applications where data persistence must survive 20+ years without service intervention.
FAQ
What is the function of the VCAP pin, and what capacitor value is required?
The VCAP pin connects to an external 4.7 µF tantalum capacitor that supplies hold-up energy during VCC dropout. This capacitor enables the internal circuitry to complete a full STORE operation - transferring all 512K × 32 bits from SRAM to QuantumTrap nonvolatile elements - within 20 ms of power loss. Tantalum is specified due to its stable ESR and low leakage; ceramic capacitors are not recommended as they lack sufficient charge retention.
Does CY14B116S-BZ35XIT support true hardware STORE initiation, and how is it signaled?
Yes - asserting the HSB pin LOW externally initiates a hardware STORE. During the STORE, HSB is driven LOW by the device; upon completion, it is actively driven HIGH for tHHHD (≤100 ns), then held HIGH by a weak internal pull-up. This transition provides a precise hardware handshake for external sequencers to pause bus activity until nonvolatile write completion.
Can the ZZ (Sleep Mode) pin be used in all package variants of CY14B116S?
No - Sleep mode via the ZZ pin is supported exclusively in the 165-ball FBGA package (e.g., CY14B116S-BZ35XIT). TSOP II, TSOP I, and 60-ball FBGA variants do not implement the ZZ input or associated low-power circuitry. This is confirmed in the datasheet's Pin Definitions table and Functional Description section.
How does the ×32 organization affect address and data pin mapping compared to ×16 versions?
In ×32 mode, address pins A0–A18 are used (19 bits), eliminating A19/A20; data pins DQ0–DQ31 are fully utilized. Byte enables BA–BD replace BLE/BHE, allowing independent control of each 8-bit lane. This differs from ×16 parts (A0–A19, DQ0–DQ15, BLE/BHE), requiring PCB layout changes and firmware address-space remapping for migration.
CY14B116S-BZ35XIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- NVSRAM
- Technology:
- NVSRAM (Non-Volatile SRAM)
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY14B116S-BZ35XIT FAQ
1.How can I place an order for CY14B116S-BZ35XIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY14B116S-BZ35XIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY14B116S-BZ35XIT reliable?
The price and inventory of CY14B116S-BZ35XIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY14B116S-BZ35XIT is usually 5 days.
3.What payment methods are accepted for CY14B116S-BZ35XIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY14B116S-BZ35XIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY14B116S-BZ35XIT?
CY14B116S-BZ35XIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY14B116S-BZ35XIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY14B116S-BZ35XIT?
For technical support, including CY14B116S-BZ35XIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY14B116S-BZ35XIT requirements.
6.How does Aetrix verify that CY14B116S-BZ35XIT is sourced from the original manufacturer or authorized distributors?
All CY14B116S-BZ35XIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY14B116S-BZ35XIT meets industry standards.
7.What is the process for return or replacement of CY14B116S-BZ35XIT?
All CY14B116S-BZ35XIT units undergo pre-shipment inspection (PSI). If there is an issue with CY14B116S-BZ35XIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY14B116S-BZ35XIT part is unused and in its original packaging.
Return procedure for CY14B116S-BZ35XIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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