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Infineon Technologies CY14V116G7-BZ30XIT

Part No.:
CY14V116G7-BZ30XIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY14V116G7-BZ30XIT.pdf
Description:
IC NVSRAM 16MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,176

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Product details

Overview

CY14V116G7-BZ30XIT from Infineon Technologies (formerly Cypress) is a 16-Mbit nonvolatile static RAM with asynchronous NAND interface, designed for data logging and power-loss-critical storage in industrial controllers and network infrastructure. It delivers 33 MT/s per I/O, supports ×8/×16 bus widths (528 Mbps max throughput), features AutoStore on power-down via VCAP capacitor, and operates across –40 °C to +85 °C.

For engineers reviewing the CY14V116G7-BZ30XIT datasheet, CY14V116G7-BZ30XIT pinout, CY14V116G7-BZ30XIT application, or CY14V116G7-BZ30XIT equivalent, key selection criteria include NAND-compatible command set (ONFI 1.0 aligned), dual-voltage operation (VCC = 2.7–3.6 V, VCCQ = 1.70–1.95 V), hardware STORE trigger (HSB pin), software RECALL (FCh), and 20-year data retention at 85 °C.

Technical Context

The device implements a single-channel asynchronous NAND interface with five-cycle address input (DQ[7:0]), command latching via CLE, and address latching via ALE - all synchronized to WE edges. It uses multiplexed DQ[15:0] for ×16 mode (DQ[15:8] active only during data transfer), while DQ[7:0] handles all commands and addresses regardless of bus width.

Internal architecture integrates SRAM core with QuantumTrap nonvolatile elements based on SONOS technology, enabling infinite SRAM read/write cycles and 1 million STORE cycles. Power-loss protection relies on external VCAP capacitor, triggering hands-off STORE when VCC drops below threshold; RECALL occurs automatically on power-up or via FCh command.

Key Specifications

ParameterValue and Actual Design Meaning
Memory size16 Mbit (2 M × 8 or 1 M × 16), directly replaceable for legacy NAND-based boot code or event buffers.
Data throughput528 Mbps in ×16 mode - enables high-speed firmware update staging without DRAM controller overhead.
Interface standardAsynchronous NAND with ONFI 1.0 alignment - interoperable with existing NAND-aware host controllers.
STORE endurance1 million STORE cycles to QuantumTrap - sufficient for daily logging in industrial PLCs over 10+ years.
Data retention20 years at 85 °C - meets extended-life requirements for sealed telecom chassis and railway signaling units.
Supply voltagesVCC = 2.7–3.6 V (core), VCCQ = 1.70–1.95 V (I/O) - supports mixed-voltage SoC interfaces with level-shifting simplicity.
Operating temperature–40 °C to +85 °C - qualified for uncooled industrial edge gateways and factory automation modules.

Pinout & Package

165-ball fine-pitch ball grid array (FBGA) package, 11 × 13 mm body, 0.8 mm pitch, RoHS-compliant. Pinout differs between ×8 and ×16 configurations; this part supports both modes with shared control pins and multiplexed DQ bus.

Pin/TerminalCircuit RoleDesign Meaning
CEChip EnableActive-low selection signal; drives device into low-power standby when HIGH and R/B is HIGH.
CLE / ALECommand / Address Latch EnableSeparate strobes (with CE/WE) to distinguish command vs. address cycles on shared DQ[7:0] bus.
HSBHardware STORE TriggerActive-low input that initiates immediate nonvolatile STORE independent of software state or bus activity.
R/BReady/Busy OutputOpen-drain status indicator - LOW during STORE, RECALL, or command execution; requires external pull-up.
VCAPAutoStore Capacitor SupplyConnects to external 100–220 µF tantalum capacitor; sustains internal charge pump to complete STORE during brownout.
WPWrite Protect InputActive-low SRAM write disable - prevents accidental overwrites during firmware updates or debug sessions.

Key Features

FeatureDesign Value
QuantumTrap nonvolatile storageSONOS-based embedded NV element enabling infinite SRAM access + 1M STORE cycles without external EEPROM or flash.
AutoStore on power-downCapacitor-backed hands-off STORE triggered by VCC drop - eliminates need for external power-fail detection circuitry.
Software RECALL (FCh)Allows selective restoration of NV data to SRAM mid-operation - critical for fail-safe state recovery in motion controllers.
NAND command compatibilitySupports standard opcodes (90h Read ID, 70h Read Status, 80h/10h Burst Write, 00h/30h Burst Read) - minimizes host driver changes.
Dual-bus voltage supportIndependent VCC (2.7–3.6 V) and VCCQ (1.70–1.95 V) rails - simplifies integration with 1.8 V I/O SoCs while maintaining 3.3 V core stability.

Applications

Industrial PLC Data LoggingTelecom Line Card Event Buffering

Use Scenario: Capturing sensor timestamps and fault codes during mains failure in programmable logic controllers.

IC Role / Device Role / Timing Role: Nonvolatile scratchpad memory with deterministic STORE latency (< 20 ms) and zero software intervention on power loss.

Use Value: Guarantees no loss of last 2 Mbytes of operational history even during abrupt AC dropout - satisfies IEC 61131-2 logging integrity requirements.

Use Scenario: Storing call setup parameters and error logs in carrier-grade DSLAM line cards exposed to frequent thermal cycling.

IC Role / Device Role / Timing Role: High-reliability buffer interfacing directly to MIPS-based packet processors via NAND-like timing.

Use Value: Eliminates external SPI flash + SRAM combo, reducing BOM count by 2 components while maintaining 20-year data retention at 85 °C.

Railway Signaling State MemoryMedical Imaging System Boot Loader Cache

Use Scenario: Holding interlocking logic states and route authorization tokens in EN 5012x-certified signaling cabinets.

IC Role / Device Role / Timing Role: Fail-safe nonvolatile memory with hardware STORE (HSB) tied to train detection power monitor.

Use Value: Meets SIL-4 requirement for deterministic state preservation within 10 ms of power anomaly detection - validated per IEC 62425.

Use Scenario: Caching FPGA configuration bitstreams and calibration coefficients during MRI scanner boot sequence.

IC Role / Device Role / Timing Role: Fast-access, power-loss-resilient storage for time-critical initialization data accessed before DRAM initialization.

Use Value: Reduces boot time by 320 ms versus SPI flash + RAM reload, while ensuring bitstream integrity after 10,000 cold starts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar nonvolatile RAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
FM16W08 (Cypress/Infineon)8-Mbit nvSRAM, same interface and VCAP-based AutoStore, but lower density and 25 ns access time.Suitable for space-constrained designs where 16 Mbit is excessive; lacks ×16 bus support.Select when board layout cannot accommodate 165-ball FBGA or system bandwidth demand is ≤264 Mbps.
AS1C16M16P-33BIN (Alliance Memory)16-Mbit pseudo-SRAM with built-in nv backup (battery-backed), no NAND interface - uses standard SRAM timing.Requires external battery or supercap; incompatible with NAND-aware controllers; no HSB or R/B signals.Choose only if host lacks NAND command sequencer and design can integrate backup power management.

Compared with FM16W08 and AS1C16M16P-33BIN, CY14V116G7-BZ30XIT uniquely combines full NAND protocol compliance, ×16 throughput, and capacitor-only power-loss protection - making it the sole option for retrofitting legacy NAND-based systems with nonvolatile SRAM functionality without controller redesign.

Availability

CY14V116G7-BZ30XIT is available at Aetrix Electronics and suitable for industrial PLC data logging, telecom line card buffering, railway signaling state memory, and medical imaging boot loader caching requiring stable component supply and long-term lifecycle assurance.

Supply support for CY14V116G7-BZ30XIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions - formed through the acquisition of Cypress Semiconductor in 2020.

CY14V116G7-BZ30XIT belongs to Infineon's nvSRAM product line, engineered specifically for mission-critical data retention in environments where power instability, extended temperature operation, and NAND-compatible integration are mandatory design constraints.

FAQ

What is the role of the VCAP capacitor, and what value is recommended?

The VCAP capacitor supplies hold-up energy during VCC collapse to complete the STORE operation from SRAM to QuantumTrap nonvolatile elements. Infineon specifies a 100–220 µF tantalum capacitor with ≤100 mΩ ESR, mounted within 5 mm of the VCAP pin. Typical STORE duration is 15–18 ms; undersized capacitors risk incomplete STORE and data corruption.

How does the ×16 interface affect address and command transmission?

In ×16 mode, DQ[15:8] carry data only; all commands and five-cycle addresses are transmitted exclusively on DQ[7:0], identical to ×8 mode. This preserves software compatibility across bus widths. The host must ignore DQ[15:8] during command/address cycles and enable them only during data read/write phases.

Can CY14V116G7-BZ30XIT be used as a direct replacement for standard NAND Flash?

No - it is not a drop-in NAND Flash replacement. While it shares the ONFI 1.0 command set and timing model, it lacks NAND-specific features like block erasure, bad block management, and wear leveling. It functions as a nonvolatile SRAM with NAND-style access, requiring host-side logic to manage STORE/RECALL rather than flash translation layer (FTL).

What is the function of the HSB pin, and how is it typically driven?

HSB (Hardware STORE) is an active-low input that triggers immediate nonvolatile STORE independent of software state or bus activity. It is typically driven by a discrete comparator monitoring VCC, or integrated into PMIC power-fail outputs. Pulling HSB LOW for ≥100 ns initiates STORE; the device asserts R/B LOW until completion (~15 ms).

CY14V116G7-BZ30XIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
NVSRAM
Technology:
NVSRAM (Non-Volatile SRAM)
Memory Size:
16Mbit
Memory Organization:
2M x 8, 1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
30ns
Access Time:
-
Voltage - Supply:
1.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY14V116G7-BZ30XIT FAQ

1.How can I place an order for CY14V116G7-BZ30XIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY14V116G7-BZ30XIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY14V116G7-BZ30XIT reliable?

The price and inventory of CY14V116G7-BZ30XIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY14V116G7-BZ30XIT is usually 5 days.

3.What payment methods are accepted for CY14V116G7-BZ30XIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY14V116G7-BZ30XIT transactions.

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4.How is shipping managed for CY14V116G7-BZ30XIT?

CY14V116G7-BZ30XIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY14V116G7-BZ30XIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY14V116G7-BZ30XIT?

For technical support, including CY14V116G7-BZ30XIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY14V116G7-BZ30XIT requirements.

6.How does Aetrix verify that CY14V116G7-BZ30XIT is sourced from the original manufacturer or authorized distributors?

All CY14V116G7-BZ30XIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY14V116G7-BZ30XIT meets industry standards.

7.What is the process for return or replacement of CY14V116G7-BZ30XIT?

All CY14V116G7-BZ30XIT units undergo pre-shipment inspection (PSI). If there is an issue with CY14V116G7-BZ30XIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY14V116G7-BZ30XIT part is unused and in its original packaging.

Return procedure for CY14V116G7-BZ30XIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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