Infineon Technologies CY15B108QN-50BKXI
- Part No.:
- CY15B108QN-50BKXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
CY15B108QN-50BKXI.pdf
- Description:
- IC FRAM 8MBIT SPI 50MHZ 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,842
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY15B108QN-50BKXI from Infineon is an 8-Mbit serial ferroelectric RAM (F-RAM) organized as 1024K × 8, operating at up to 50 MHz SPI clock, with 1.8 V to 3.6 V supply, industrial temperature range (–40°C to +85°C), and 24-ball FBGA package. It delivers instant non-volatile writes, 10¹⁵ read/write endurance, and 151-year data retention for high-cycle logging in industrial controllers.
For engineers reviewing the CY15B108QN-50BKXI datasheet, CY15B108QN-50BKXI pinout, CY15B108QN-50BKXI application, or CY15B108QN-50BKXI equivalent, key selection criteria include SPI mode 0/3 compatibility, hardware/software write protection (WP pin + WRDI instruction), 256-byte dedicated special sector surviving three reflow cycles, and ultra-low deep power-down current (0.1 µA).
Technical Context
The CY15B108QN implements a true SPI slave interface with zero-write-latency architecture: data commits immediately upon byte transfer without polling, enabling deterministic timing in real-time systems. Its ferroelectric memory array eliminates erase-before-write overhead and supports full 50 MHz bus-speed writes across all address ranges.
It integrates a non-volatile status register with WPEN bit control, hardware write protect (WP pin), software block protection (1/4, 1/2, or full array), and dual identification resources - read-only Device ID (manufacturer + product ID) and writable 8-byte serial number registers - all accessible via standardized SPI opcodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 8 Mbit (1024K × 8), enabling compact firmware/data storage without external address latching |
| SPI speed | Up to 50 MHz, supporting ≤20 ns clock period for high-throughput telemetry logging |
| Write endurance | 10¹⁵ cycles, eliminating wear-leveling firmware overhead in cyclic data buffers |
| Data retention | 151 years at 85°C, ensuring unpowered archival integrity in sealed industrial enclosures |
| Supply voltage | 1.8 V to 3.6 V, compatible with mixed-voltage 3.3 V/2.5 V/1.8 V system rails |
| Deep Power Down current | 0.1 µA typical, enabling multi-year battery operation in remote sensor nodes |
| Operating temperature | –40°C to +85°C industrial grade, validated for continuous operation in motor drives and PLC backplanes |
Pinout & Package
Package: 24-ball fine-pitch ball grid array (FBGA), 6 mm × 8 mm footprint, 0.8 mm ball pitch, RoHS-compliant, suitable for automated SMT assembly and thermal cycling reliability in harsh environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS | Chip Select input | Active-low enable; device enters standby and tri-states SO when HIGH, required before every opcode |
| SCK | Serial clock input | Synchronizes all I/O; inputs sampled on rising edge, outputs driven on falling edge; supports 0–50 MHz with interruptible clock |
| SI | Serial input | Accepts opcodes, addresses, and write data; must be driven to valid logic level to meet IDD specs |
| SO | Serial output | Drives read data only during read operations; tristated otherwise; transitions aligned to SCK falling edge |
| WP | Write protect input | Hardware lock for Status Register writes when WPEN = 1; must tie to VDD if unused |
| VDD / VSS | Power / Ground | Single-supply interface; VDD accepts 1.8–3.6 V; VSS is system ground reference |
| DNU | Do Not Use | Ball E2; must float or connect to VDD - no internal connection or function |
| NC | No Connect | 12 balls (A1–A5, B1, B5, C1, C5, D1, D5, E1, E5) - electrically isolated from die |
Key Features
| Feature | Design Value |
|---|---|
| Instant non-volatile write | Zero latency: data written to memory array immediately after byte transfer - no polling or timeout handling required in host firmware |
| Dedicated 256-byte special sector | Retains content through ≥3 standard reflow soldering cycles (260°C peak), enabling board-level serialization pre-assembly |
| Multi-layer write protection | Hardware (WP pin) + software (WRDI + block protection bits) prevents accidental overwrites in field-deployed systems |
| Unique Device ID + Serial Number | Read-only 16-bit Manufacturer ID + 16-bit Product ID + 64-bit Unique ID + writable 8-byte serial register for traceability |
| Low-power Deep Power Down | 0.1 µA typical current enables >10-year coin-cell operation in battery-backed black-box recorders |
Applications
| Industrial Data Logger | Smart Metering |
|---|---|
Use Scenario: Continuous timestamped energy consumption sampling at 100 Hz with power-loss resilience. IC Role / Device Role / Timing Role: Non-volatile buffer storing last 72 hours of raw samples; writes occur on every sample interrupt without delay. Use Value: Eliminates flash wear-out risk and guarantees sub-millisecond write commit - preventing data loss during brownouts. | Use Scenario: Tamper-evident event logging (voltage sags, phase reversals, meter cover opens) in ANSI C12.22-compliant meters. IC Role / Device Role / Timing Role: Secure, high-endurance storage for cryptographic logs; WP pin hardens against firmware-level overwrite attacks. Use Value: 10¹⁵ write cycles support >100 years of daily tamper events without degradation; serial number enables forensic unit tracking. |
| PLC I/O Module | Medical Diagnostic Recorder |
Use Scenario: Storing configuration parameters and runtime diagnostics in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Configuration EEPROM replacement; stores firmware update metadata and calibration coefficients with guaranteed retention. Use Value: 151-year data retention at 85°C ensures parameter integrity across full product lifecycle without refresh routines. | Use Scenario: Capturing high-resolution ECG waveforms during portable diagnostic sessions with intermittent power. IC Role / Device Role / Timing Role: Low-power, high-speed buffer between ADC and SD card; absorbs burst writes during wireless upload gaps. Use Value: 0.1 µA Hibernate mode extends single-charge battery life to >14 days; 50 MHz SPI enables real-time waveform streaming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial non-volatile memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B108QN-50ZSXI | Same die, 8-pin SOIC package (300 mil), lower max SPI speed (40 MHz), higher active current (3.5 mA) | Better suited for prototyping and low-density PCBs where FBGA assembly is unavailable | Select when manual soldering or legacy footprint compatibility is required over density or speed |
| FM25V05-G | Cypress (now Infineon) 512 Kbit F-RAM, 1.7–2.2 V supply, 40 MHz SPI, 8-pin SOIC | Limited capacity restricts use to parameter storage only - insufficient for full waveform or log buffering | Choose only for cost-sensitive, low-capacity applications where 8 Mbit is unnecessary |
Compared with CY15B108QN-50ZSXI and FM25V05-G, the CY15B108QN-50BKXI uniquely combines 8 Mbit density, 50 MHz speed, FBGA miniaturization, and 0.1 µA hibernate current - making it the sole option for space-constrained, high-throughput, battery-powered industrial recorders.
Availability
CY15B108QN-50BKXI is available at Aetrix Electronics and suitable for industrial data loggers, smart metering systems, PLC I/O modules, and medical diagnostic recorders requiring stable component supply across extended product lifecycles.
Supply support for CY15B108QN-50BKXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The EXCELON™ LP F-RAM product line targets mission-critical non-volatile data capture in industrial automation, energy infrastructure, and medical devices - prioritizing write endurance, zero-latency persistence, and extended temperature reliability over cost-per-bit.
FAQ
Is CY15B108QN-50BKXI pin-compatible with standard SPI serial flash or EEPROM devices?
No - while it uses the same 4-wire SPI interface (CS, SCK, SI, SO) and shares functional pin roles, its 24-ball FBGA package differs physically from common 8-pin SOIC or WSON flash packages. Board layout requires dedicated footprint; however, firmware migration from SPI flash is straightforward due to identical command set structure and absence of erase commands.
Does the 256-byte special sector retain data during PCB rework or reballing?
Yes - the dedicated special sector is qualified to survive up to three standard JEDEC J-STD-020D reflow cycles (peak 260°C, 20–40 sec above 220°C). This enables reliable pre-programming of board IDs or calibration data before final assembly, with verified retention post-reflow per Infineon characterization data.
How does write protection behave when both WP pin and Status Register WPEN bit are active?
When WPEN = 1 in the Status Register, the WP pin becomes active-low hardware protection for Status Register writes only - it does not block memory array writes. Memory array protection is controlled separately by software block protection bits (BP0/BP1) and Write Disable (WRDI) instruction. This layered scheme allows independent lockdown of configuration vs. data regions.
Can CY15B108QN-50BKXI operate reliably at 1.8 V while sustaining 50 MHz SPI communication?
Yes - the datasheet specifies full 50 MHz operation down to VDD = 1.8 V, with timing parameters (tSU, tH, tV) validated across the entire 1.8–3.6 V range. At 1.8 V, active current is 2.5 mA (typ), meeting industrial low-power requirements without frequency derating.
CY15B108QN-50BKXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- Excelon™-LP,F-RAM™
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FRAM
- Technology:
- FRAM (Ferroelectric RAM)
- Memory Size:
- 8Mbit
- Memory Organization:
- 1M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 50 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 9 ns
- Voltage - Supply:
- 1.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
CY15B108QN-50BKXI FAQ
1.How can I place an order for CY15B108QN-50BKXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY15B108QN-50BKXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY15B108QN-50BKXI reliable?
The price and inventory of CY15B108QN-50BKXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY15B108QN-50BKXI is usually 5 days.
3.What payment methods are accepted for CY15B108QN-50BKXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY15B108QN-50BKXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY15B108QN-50BKXI?
CY15B108QN-50BKXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY15B108QN-50BKXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY15B108QN-50BKXI?
For technical support, including CY15B108QN-50BKXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY15B108QN-50BKXI requirements.
6.How does Aetrix verify that CY15B108QN-50BKXI is sourced from the original manufacturer or authorized distributors?
All CY15B108QN-50BKXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY15B108QN-50BKXI meets industry standards.
7.What is the process for return or replacement of CY15B108QN-50BKXI?
All CY15B108QN-50BKXI units undergo pre-shipment inspection (PSI). If there is an issue with CY15B108QN-50BKXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY15B108QN-50BKXI part is unused and in its original packaging.
Return procedure for CY15B108QN-50BKXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY15B108QN-50BKXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

