Infineon Technologies CY23S09ZXC-1HT
- Part No.:
- CY23S09ZXC-1HT
- Manufacturer:
- Infineon Technologies
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
CY23S09ZXC-1HT.pdf
- Description:
- IC FANOUT BUFFER 16TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,143
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Product details
Overview
CY23S09ZXC-1HT from Cypress Semiconductor is a 3.3 V spread-aware zero-delay clock buffer IC with nine low-skew outputs (4+4+1 banked configuration), PLL-based jitter control, and 10–133 MHz operating range. It delivers <250 ps output-to-output skew, <200 ps cycle-to-cycle jitter, and supports system-level clock distribution in PCI, CPU, and industrial timing applications.
For engineers reviewing the CY23S09ZXC-1HT datasheet, CY23S09ZXC-1HT pinout, CY23S09ZXC-1HT application, or CY23S09ZXC-1HT equivalent, key selection criteria include spread-spectrum pass-through capability, device-to-device skew <700 ps, high-drive (-1H) output slew rate of 1 V/ns, and TSSOP-16 package compatibility with space-constrained PCB layouts.
Technical Context
The CY23S09ZXC-1HT integrates an on-chip PLL with internal feedback via CLKOUT to achieve zero input-output propagation delay (<±350 ps). Its dual-bank output architecture (Bank A: CLKA1–CLKA4; Bank B: CLKB1–CLKB4; CLKOUT) enables selective three-state control via S1/S2 inputs, including PLL shutdown and direct reference passthrough for test mode.
Designed for spread-spectrum timing systems, it preserves input frequency modulation without filtering-critical for EMI reduction in synchronized digital systems. The -1H variant provides faster rise/fall times (1.5 ns) and higher drive strength versus standard -1 versions, verified under 30 pF/10 pF load conditions up to 133 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Frequency | 10–133 MHz: Supports CPU, PCI, and high-speed serial interface clocking without external frequency translation. |
| Output-to-Output Skew | <250 ps: Ensures synchronous edge alignment across all nine outputs when equally loaded. |
| Device-to-Device Skew | <700 ps: Guarantees deterministic timing across multiple CY23S09ZXC-1HT units sharing one REF source. |
| Cycle-to-Cycle Jitter | <200 ps at 66.67 MHz: Meets tight timing margin requirements for DDR memory interfaces and FPGA clock domains. |
| Rise/Fall Time | 1.5 ns (–1H): Enables clean signal integrity on fast-edge clocks while maintaining EMI compliance. |
| Supply Voltage | 3.0–3.6 V: Compatible with standard 3.3 V logic rails and tolerant of typical board-level voltage variation. |
| Power-Down Current | 12.0 µA (commercial): Reduces standby power in idle clock trees without external enable circuitry. |
Pinout & Package
Package: 16-pin, 4.4 mm wide TSSOP (Pb-free, ZZ16 footprint), optimized for thermal performance (θJA = 108 °C/W) and high-density routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 REF | 5 V-tolerant reference clock input | Accepts upstream clock sources (e.g., crystal oscillator, PLL output) without level-shifting; weak pull-down ensures defined state at power-up. |
| 2–3, 14–15 CLKA1–CLKA4 | Bank A buffered clock outputs | Four synchronized outputs controllable as a group; driven only when S2=0,S1=1 or S2=1,S1=1 per select decoding table. |
| 6–7, 10–11 CLKB1–CLKB4 | Bank B buffered clock outputs | Four additional outputs with independent three-state control; Bank B can be disabled to reduce loading or power. |
| 16 CLKOUT | Internal PLL feedback output | Provides PLL reference path; must be loaded identically to other outputs to maintain zero input-output delay. |
| 4, 13 VDD | 3.3 V supply pins | Dual power pins improve current delivery and reduce IR drop across die; require local 0.1 µF decoupling each. |
| 5, 12 GND | Ground return pins | Dual ground pins minimize ground bounce and ensure stable PLL operation under high-frequency switching. |
| 8 S2, 9 S1 | Bank select and test mode inputs | Weak pull-up inputs configure output banks and enable PLL bypass (S2=1,S1=0) for system-level clock verification. |
Key Features
| Feature | Design Value |
|---|---|
| Spread Spectrum Pass-Through | Preserves input frequency modulation without attenuation-enables EMI reduction in PCIe, USB, and display timing systems. |
| Zero-Delay Architecture | PLL feedback via CLKOUT allows sub-nanosecond input-output alignment when outputs are equally loaded. |
| Configurable Output Banks | Two independent 4-output banks + dedicated CLKOUT support partial clock tree enable/disable for dynamic power management. |
| High-Drive (-1H) Outputs | 1.5 ns rise/fall time and 1 V/ns slew rate improve signal integrity on long traces or heavy capacitive loads. |
| Automatic PLL Power-Down | Enters <12 µA sleep mode when REF stops toggling-eliminates need for external enable logic in battery-backed systems. |
Applications
| PCI Express Clock Distribution | CPU Core Clock Fanout |
|---|---|
Use Scenario: Distributing 100 MHz reference clock to multiple PCIe root complex and endpoint devices on a server motherboard. IC Role / Device Role / Timing Role: Zero-delay buffer ensuring simultaneous clock arrival across slots with <700 ps inter-device skew. Use Value: Eliminates timing misalignment that causes PCIe link training failures or data corruption during high-throughput transfers. | Use Scenario: Driving clock signals to dual-core CPU, GPU, and memory controller from a single oscillator in embedded computing modules. IC Role / Device Role / Timing Role: Nine-output fanout buffer with banked control enabling independent core clock gating. Use Value: Reduces clock tree complexity and improves thermal efficiency by disabling unused banks during low-power states. |
| Industrial PLC Backplane Timing | Test Equipment Clock Synthesis |
Use Scenario: Synchronizing I/O modules, motion controllers, and fieldbus gateways in harsh-temperature industrial automation racks. IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +85°C) clock distributor preserving spread-spectrum features for EMI-compliant operation. Use Value: Maintains deterministic timing across distributed nodes despite voltage fluctuations and temperature drift. | Use Scenario: Generating multiple phase-aligned clock domains for mixed-signal ATE systems requiring precise stimulus/response timing. IC Role / Device Role / Timing Role: High-jitter-performance buffer providing <200 ps cycle-to-cycle stability for ADC/DAC sampling clocks. Use Value: Enables accurate measurement resolution by minimizing aperture uncertainty in high-speed digitizers. |
Equivalent & Alternatives
CY23S09ZXC-1HT has two functionally compatible alternatives with documented differences in drive strength, package, and temperature grade.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY23S09SXC-1HT | Same functionality but in 16-pin SOIC (SZ16) instead of TSSOP (ZZ16); θJA = 108 °C/W vs. 108 °C/W (identical thermal rating). | SOIC offers easier hand-soldering and legacy board compatibility; TSSOP saves 40% board area. | Select CY23S09SXC-1HT for prototyping or repair; choose CY23S09ZXC-1HT for volume production where PCB real estate is constrained. |
| ICS8309AM-01LFT | Lower max frequency (100 MHz vs. 133 MHz); no spread-aware design; 2.5 V/3.3 V dual-supply capable. | Not suitable for spread-spectrum systems; requires external level-shifting if interfacing with 5 V REF sources. | Use only if spread spectrum is absent and 133 MHz operation is unnecessary; verify jitter specs (<300 ps) against system timing budget. |
Compared with CY23S09SXC-1HT and ICS8309AM-01LFT, CY23S09ZXC-1HT uniquely combines TSSOP space savings, 133 MHz capability, and guaranteed spread-spectrum transparency-making it optimal for next-generation compact, EMI-sensitive timing designs.
Availability
CY23S09ZXC-1HT is available at Aetrix Electronics and suitable for PCI Express clock distribution, CPU core clock fanout, and industrial PLC backplane timing requiring stable component supply across commercial temperature ranges.
Supply support for CY23S09ZXC-1HT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in programmable system-on-chip (PSoC), memory, and timing solutions for industrial, automotive, and consumer electronics.
The CY23S09 product line delivers cost-optimized, spread-aware zero-delay buffers targeting high-reliability clock distribution in compute, communications, and automation systems where deterministic skew and EMI control are critical.
FAQ
What is the purpose of the CLKOUT pin on CY23S09ZXC-1HT?
The CLKOUT pin serves as the internal PLL feedback path and must be loaded identically to other outputs to achieve zero input-output propagation delay. Even if unused, it requires a capacitive load matching the other outputs (e.g., 30 pF below 100 MHz) to prevent timing offset. Its voltage swing and edge rate are identical to CLKA/CLKB outputs.
How does the CY23S09ZXC-1HT handle spread-spectrum clock inputs?
It preserves the input spread-spectrum modulation without filtering or distortion, enabling EMI reduction in downstream circuits. Unlike non-spread-aware buffers, it avoids introducing tracking skew between reference and output edges-verified in Cypress Application Note AN1234 and Whitepaper EMI and Spread Spectrum Technology.
Can Bank B outputs be disabled independently of Bank A?
Yes. When S2=0 and S1=0, both Bank A and Bank B are three-stated. When S2=0 and S1=1, only Bank A is active; Bank B remains three-stated. This allows dynamic power reduction and noise isolation in multi-domain clock trees without external logic.
What is the difference between -1 and -1H speed grades?
The -1H grade provides faster rise/fall times (1.5 ns vs. 2.5 ns), higher output drive strength (12 mA sink/source vs. 8 mA), and improved slew rate (1 V/ns vs. unspecified). These enhancements reduce signal degradation on long traces or high-capacitance loads, making -1H preferred for >100 MHz operation and dense PCB layouts.
CY23S09ZXC-1HT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Type:
- Fanout Buffer (Distribution), Zero Delay Buffer
- PLL:
- Yes with Bypass
- Input:
- LVCMOS, LVTTL
- Output:
- LVCMOS
- Number of Circuits:
- 1
- Ratio - Input:Output:
- 1:9
- Differential - Input:Output:
- No/No
- Frequency - Max:
- 133.33MHz
- Divider/Multiplier:
- No/No
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 16-TSSOP
CY23S09ZXC-1HT FAQ
1.How can I place an order for CY23S09ZXC-1HT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY23S09ZXC-1HT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY23S09ZXC-1HT reliable?
The price and inventory of CY23S09ZXC-1HT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY23S09ZXC-1HT is usually 5 days.
3.What payment methods are accepted for CY23S09ZXC-1HT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY23S09ZXC-1HT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY23S09ZXC-1HT?
CY23S09ZXC-1HT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY23S09ZXC-1HT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY23S09ZXC-1HT?
For technical support, including CY23S09ZXC-1HT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY23S09ZXC-1HT requirements.
6.How does Aetrix verify that CY23S09ZXC-1HT is sourced from the original manufacturer or authorized distributors?
All CY23S09ZXC-1HT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY23S09ZXC-1HT meets industry standards.
7.What is the process for return or replacement of CY23S09ZXC-1HT?
All CY23S09ZXC-1HT units undergo pre-shipment inspection (PSI). If there is an issue with CY23S09ZXC-1HT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY23S09ZXC-1HT part is unused and in its original packaging.
Return procedure for CY23S09ZXC-1HT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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