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Infineon Technologies CY2510ZXC-1

Part No.:
CY2510ZXC-1
Manufacturer:
Infineon Technologies
Category:
Clock Generators, PLLs, Frequency Synthesizers
Package:
24-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixCY2510ZXC-1.pdf
Description:
IC FANOUT BUFFER 24TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,682

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Product details

Overview

CY2510ZXC-1 from Cypress Semiconductor is an eleven-output Spread Aware™ zero-delay buffer IC designed for DDR SDRAM DIMM clock distribution. It operates at 3.3 V, supports 40–140 MHz output frequencies, delivers <100 ps cycle-to-cycle jitter and <100 ps output-to-output skew, and integrates 25 Ω series damping resistors on all eleven LVCMOS/LVTTL outputs for direct trace termination in memory module applications.

For engineers reviewing the CY2510ZXC-1 datasheet, CY2510ZXC-1 pinout, CY2510ZXC-1 application, or CY2510ZXC-1 equivalent, this device is selected for PC100/PC133 SDRAM clock fanout where spread-spectrum timing compatibility, sub-100-ps jitter, and matched-output synchronization to motherboard reference clocks are required.

Technical Context

The CY2510ZXC-1 implements a PLL-based zero-delay architecture with external feedback (FBIN/FBOUT) to align output edges precisely with the CLK input. Its Spread Aware™ design preserves spread-spectrum modulation from SSFTG sources, preventing tracking skew in EMI-sensitive systems.

All eleven outputs (Q0–Q9, FBOUT) are LVCMOS/LVTTL-compatible with integrated 25 Ω series resistors; a single OE pin controls global output enable/disable. The device requires matched PCB trace lengths between FBOUT–FBIN and Qx–load to achieve true zero-delay operation across DIMM address/control lines.

Key Specifications

ParameterValue and Actual Design Meaning
Operating voltage3.3 V ±10% - powers all internal circuitry and defines logic thresholds for LVCMOS/LVTTL I/O compliance.
Output frequency range40–140 MHz - supports PC100 (100 MHz) and PC133 (133 MHz) SDRAM clocking with production-tested 133 MHz operation.
Cycle-to-cycle jitter<100 ps typical - ensures tight setup/hold timing margins for high-speed DDR memory interfaces.
Output-to-output skew<100 ps - guarantees simultaneous clock edge arrival across all 11 outputs when layout-matched per feedback rule.
Integrated damping25 Ω series resistor per output - eliminates need for external termination, simplifies routing, and reduces signal reflections on stubbed DIMM traces.
Feedback architectureExternal FBIN/FBOUT loop - enables board-level trace-length compensation to achieve true zero-delay synchronization at load points.

Pinout & Package

Package: 24-pin thin shrink small outline package (TSSOP), lead-free, commercial temperature range (0 °C to +70 °C).

Pin/TerminalCircuit RoleDesign Meaning
CLK (Pin 24)Reference inputSynchronizes all outputs; must be driven by motherboard SSFTG clock source with controlled rise/fall time ≤4.5 ns.
FBIN (Pin 13)PLL feedback inputReceives FBOUT signal; trace length must match Qx-to-load lengths to enforce zero-delay alignment at destination devices.
FBOUT (Pin 12)Feedback outputDedicated buffered copy of internal PLL output; includes integrated 25 Ω resistor for direct connection to FBIN.
Q0–Q9 (Pins 3,4,5,8,9,15,16,17,20,21)Clock outputsEleven LVCMOS/LVTTL outputs each with 25 Ω series resistor; drive SDRAM address, command, and data strobe lines on DIMM.
OE (Pin 11)Global output enableActive-low control: drives all outputs low when asserted, reducing system EMI and dynamic power during idle states.
VDD (Pins 2,10,14,22)Power supplyFour 3.3 V supply pins distributed for low-impedance delivery and reduced power rail noise coupling into analog PLL section.
AVDD (Pin 23)Analog powerDedicated 3.3 V supply for PLL core; requires ferrite bead filtering to minimize jitter induced by digital switching noise.
AGND (Pin 1), GND (Pins 6,7,18,19)Analog/digital groundSeparate AGND (Pin 1) and four GND pins provide isolated return paths for analog PLL and digital output stages.

Key Features

FeatureDesign Value
Spread Aware™ architecturePreserves spread-spectrum modulation from SSFTG reference inputs, eliminating tracking skew that causes timing failures in synchronized DIMM systems.
Integrated 25 Ω series resistorsEnables point-to-point trace termination without external components, reducing BOM count and improving signal integrity on high-density DIMM layouts.
External feedback loop (FBIN/FBOUT)Allows PCB-level trace-length matching to calibrate output delay, achieving true zero-delay synchronization at memory device inputs-not just at buffer outputs.
Single OE pin controlProvides unified shutdown of all eleven outputs to low state, cutting dynamic power and radiated emissions during memory self-refresh or standby modes.

Applications

DDR SDRAM DIMM Clock DistributionPC133 Memory Module Timing

Use Scenario: Distributing a single motherboard clock to multiple SDRAM chips on a 16×4 or 8×8 DIMM card with strict skew budget.

IC Role / Device Role / Timing Role: Zero-delay buffer with Spread Aware™ capability to preserve SSFTG modulation and maintain sub-100-ps inter-output skew.

Use Value: Eliminates need for discrete termination and ensures simultaneous clock arrival at all DRAM inputs, meeting JEDEC tAC and tDS timing requirements.

Use Scenario: Driving clock signals for PC133-compliant 133 MHz SDRAM modules in desktop and server memory subsystems.

IC Role / Device Role / Timing Role: Eleven-output LVCMOS clock driver operating up to 140 MHz with <100 ps cycle-to-cycle jitter.

Use Value: Meets tight jitter and skew specs required for reliable 133 MHz data capture, enabling stable high-bandwidth memory operation.

EMI-Sensitive Motherboard ClockingLegacy DDR Memory Upgrade Path

Use Scenario: Replacing non-spread-aware buffers in systems using SSFTG to meet FCC Class B radiated emission limits.

IC Role / Device Role / Timing Role: Spread Aware™ zero-delay buffer that passes SSFTG modulation unaltered through its PLL path.

Use Value: Prevents skew-induced timing violations caused by filtering of spread spectrum, maintaining system stability while lowering EMI.

Use Scenario: Upgrading existing PC100 DIMMs to support higher-speed PC133 operation without redesigning clock tree layout.

IC Role / Device Role / Timing Role: Pin-compatible upgrade from CY2509 (10-output) to CY2510 (11-output) with identical TSSOP-24 footprint and electrical behavior.

Use Value: Adds one extra clock output for enhanced routing flexibility or future-proofing while retaining full backward compatibility.

Equivalent & Alternatives

The following parts are listed as comparable options for similar zero-delay clock buffer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY2509ZXC-1Ten-output version; dual OE0:4 and OE5:8 pins instead of single OE; otherwise identical electrical specs and package.Lacks Q9 output; suitable for DIMMs requiring only ten clock signals (e.g., smaller density modules).Select when exact pin count matches legacy layout or when eleventh output is unnecessary.
IDT5V2310PGGI12-output LVCMOS zero-delay buffer; supports 1.8–3.3 V operation; no Spread Aware™ feature; higher typical jitter (125 ps).Not compatible with SSFTG sources; may introduce tracking skew in spread-spectrum systems; requires external termination.Choose only in non-SSFTG designs where wider voltage range or extra output is prioritized over jitter and spread-spectrum fidelity.

Compared with CY2509ZXC-1, CY2510ZXC-1 adds one output and simplifies enable control; versus IDT5V2310PGGI, it delivers lower jitter, built-in termination, and guaranteed SSFTG compatibility-critical for DIMM timing integrity.

Availability

CY2510ZXC-1 is available at Aetrix Electronics and suitable for DDR SDRAM DIMM clock distribution, PC133 memory module timing, and EMI-sensitive motherboard clocking requiring stable component supply and long-term lifecycle support.

Supply support for CY2510ZXC-1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance timing, memory, and programmable logic solutions for computing and communications infrastructure.

The CY25xx family was developed specifically for high-speed memory subsystem clock distribution, emphasizing zero-delay synchronization, spread-spectrum compatibility, and integrated signal integrity features for DDR SDRAM DIMMs.

FAQ

What is the purpose of the FBIN and FBOUT pins?

FBIN and FBOUT form an external feedback loop essential for zero-delay operation. FBOUT provides a buffered copy of the internal PLL output; connecting it to FBIN with a trace length matched to output-to-load traces ensures all clock edges arrive simultaneously at destination devices-not just at the buffer outputs-achieving true system-level synchronization.

Does CY2510ZXC-1 require external termination resistors?

No. Each of the eleven outputs-including Q0–Q9 and FBOUT-integrates a 25 Ω series damping resistor. This eliminates the need for external series resistors, simplifying PCB layout, reducing component count, and improving signal integrity on stub-loaded DIMM traces without compromising edge rate or overshoot.

How does Spread Aware™ functionality improve system timing?

Spread Aware™ preserves the spread-spectrum modulation present on the CLK input from SSFTG sources. Non-Spread Aware™ buffers filter this modulation, causing variable phase shifts between outputs and inducing tracking skew-potentially violating DDR setup/hold windows. CY2510ZXC-1 passes modulation intact, maintaining consistent relative timing across all outputs.

Can CY2510ZXC-1 operate at 133 MHz reliably?

Yes. The device is production-tested at 133 MHz and specified for 40–140 MHz operation. Its <100 ps cycle-to-cycle jitter, <100 ps output-to-output skew, and robust PLL lock time (<1.0 ms) ensure stable, jitter-compliant clock distribution for PC133 SDRAM modules under commercial temperature and voltage conditions.

CY2510ZXC-1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
Spread Aware™
Package/Case:
24-TSSOP (0.173", 4.40mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Type:
Fanout Buffer (Distribution), Zero Delay Buffer
PLL:
Yes
Input:
LVCMOS, LVTTL
Output:
LVCMOS, LVTTL
Number of Circuits:
1
Ratio - Input:Output:
2:11
Differential - Input:Output:
No/No
Frequency - Max:
140MHz
Divider/Multiplier:
No/No
Voltage - Supply:
2.97V ~ 3.63V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
24-TSSOP

CY2510ZXC-1 FAQ

1.How can I place an order for CY2510ZXC-1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY2510ZXC-1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY2510ZXC-1 reliable?

The price and inventory of CY2510ZXC-1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY2510ZXC-1 is usually 5 days.

3.What payment methods are accepted for CY2510ZXC-1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY2510ZXC-1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY2510ZXC-1?

CY2510ZXC-1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY2510ZXC-1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY2510ZXC-1?

For technical support, including CY2510ZXC-1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY2510ZXC-1 requirements.

6.How does Aetrix verify that CY2510ZXC-1 is sourced from the original manufacturer or authorized distributors?

All CY2510ZXC-1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY2510ZXC-1 meets industry standards.

7.What is the process for return or replacement of CY2510ZXC-1?

All CY2510ZXC-1 units undergo pre-shipment inspection (PSI). If there is an issue with CY2510ZXC-1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY2510ZXC-1 part is unused and in its original packaging.

Return procedure for CY2510ZXC-1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY2510ZXC-1 Tags

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