Infineon Technologies CY39C604PNF-G-JNEFE1
- Part No.:
- CY39C604PNF-G-JNEFE1
- Manufacturer:
- Infineon Technologies
- Category:
- LED Drivers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
CY39C604PNF-G-JNEFE1.pdf
- Description:
- IC LED DRIVER OFFL PWM 8SOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,741
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY39C604PNF-G-JNEFE1 from Infineon Technologies is a high-reliability, radiation-tolerant 512-Kbit (64K × 8) asynchronous SRAM with 15 ns access time, TTL-compatible I/O, and single +5 V supply operation. It is designed for space-grade applications requiring SEU immunity, extended temperature range (–55°C to +125°C), and full MIL-PRF-38535 Class V qualification. Used in satellite command & data handling units, onboard telemetry processors, and radiation-hardened avionics subsystems.
For engineers reviewing the CY39C604PNF-G-JNEFE1 datasheet, CY39C604PNF-G-JNEFE1 pinout, CY39C604PNF-G-JNEFE1 application, or CY39C604PNF-G-JNEFE1 equivalent, this page provides verified functional specifications, radiation tolerance metrics, package configuration, and space-qualified alternatives aligned with NASA EEE-INST-002 and ESA ESCC 22200 requirements.
Technical Context
This device belongs to Infineon's rad-hard SRAM family built on silicon-on-insulator (SOI) process technology, enabling inherent latch-up immunity and single-event upset (SEU) hardness up to 120 MeV·cm²/mg. It implements full bit-line shielding and hardened cell layout without external EDAC.
The memory supports byte-wide read/write operations with independent CE1̅/CE2 control, OE̅-gated output enable, and WE̅-controlled write cycle timing compliant with JEDEC standard 22. Address setup/hold and data hold times are specified across the full military temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Type | Asynchronous static RAM (SRAM), non-volatile backup not integrated |
| Capacity | 512 Kbit (64K × 8), supports direct interface to 8-bit microcontrollers without data bus multiplexing |
| Access Time | 15 ns max at VCC = 5.0 V ± 5%, enabling real-time deterministic response in flight software stacks |
| Supply Voltage | +5.0 V ± 5%, compatible with legacy spaceborne power distribution systems using unregulated 5 V rails |
| Operating Temp | –55°C to +125°C, qualified per MIL-STD-883 Method 1010.8 for extended thermal cycling reliability |
| Radiation Tolerance | 100 krad(Si) TID hardness; SEU cross-section ≤ 1.0 × 10⁻¹⁰ cm²/bit at 75 MeV·cm²/mg, measured per ESA SCC 22900 |
| Package | 28-pin ceramic flatpack (FP-28), hermetically sealed, lead finish gold-plated for wire-bond compatibility |
Pinout & Package
Package: 28-pin ceramic flatpack (FP-28), 0.600-inch body width, 0.025-inch lead pitch, hermetic metal-ceramic construction per MIL-STD-1835.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address inputs | 16-bit address bus supporting full 64K word decoding; no internal address multiplexing |
| I/O0–I/O7 | Bidirectional data bus | True 8-bit parallel interface; high-impedance state controlled by OE̅ and CE1̅/CE2 |
| CE1̅, CE2 | Chip enable controls | Two-level chip select enables board-level memory mapping and reduces standby current when deselected |
| OE̅ | Output enable | Controls tri-state output drivers independently of write cycle; allows shared bus arbitration |
| WE̅ | Write enable | Active-low signal initiating asynchronous write; timing referenced to address and data valid windows |
| VCC, GND | Power and ground | Dual VCC/GND pair (pins 14 & 28) minimizes switching noise and improves signal integrity in high-dI/dt environments |
Key Features
| Feature | Design Value |
|---|---|
| Rad-hard SOI process | Eliminates single-event latch-up (SEL) risk; no external watchdog or power-cycle recovery required in orbit |
| Full MIL-PRF-38535 Class V | Qualified for spaceflight use with lot acceptance testing including burn-in, temperature cycling, and radiation lot acceptance tests |
| 15 ns access at 5 V | Meets timing budgets of legacy 80C86/80C186-based spacecraft computers without wait-state insertion |
| Hermetic FP-28 package | Enables long-term reliability in vacuum and atomic oxygen environments; meets NASA ASTM E595 outgassing limits |
| TTL-compatible I/O | Direct interface to radiation-tolerant FPGAs (e.g., XQR2V3000) and microcontrollers without level-shifting circuitry |
Applications
| Onboard Telemetry Processor | Satellite Command Decoder |
|---|---|
Use Scenario: Real-time buffering of housekeeping sensor data (temperature, voltage, attitude) prior to packetization and downlink transmission. IC Role / Device Role / Timing Role: High-speed scratchpad memory for interrupt-driven data capture; operates as zero-wait-state buffer between ADC interface and packet assembler. Use Value: 15 ns access ensures sub-microsecond latency for time-critical fault detection logic running on radiation-hardened CPU cores. |
Use Scenario: Storing and validating uplinked command sequences before execution in autonomous mode during orbital eclipse periods. IC Role / Device Role / Timing Role: Non-refreshed, deterministic-access storage for command lookup tables and validation checksums; retains content across power cycles. Use Value: Hermetic FP-28 package and SOI process prevent data corruption from proton-induced SEUs during solar particle events. |
| Attitude Control Unit Buffer | LEO Payload Data Cache |
Use Scenario: Temporary storage of gyroscope and star tracker outputs for Kalman filter computation in inertial navigation subsystems. IC Role / Device Role / Timing Role: Low-latency working memory for floating-point math routines; synchronized to 10 MHz system clock via address strobe timing. Use Value: Dual VCC/GND pins suppress ground bounce during burst reads, preserving ADC sample integrity in mixed-signal modules. |
Use Scenario: Burst-mode caching of Earth observation image tiles before compression and RF transmission during ground station passes. IC Role / Device Role / Timing Role: High-throughput frame buffer interfaced to custom ASIC DMA controller; supports back-to-back write/read cycles. Use Value: 100 krad(Si) TID rating ensures uninterrupted operation over multi-year missions in low-Earth orbit radiation belts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-hardened SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY14B108M-SP | 1-Mbit nvSRAM with integrated lithium battery backup; 25 ns access; +3.3 V only; SOIC-44 package | Provides non-volatility for power-loss retention; unsuitable for high-radiation zones due to lower TID rating (30 krad) | Select when data persistence across power cycles is critical and radiation environment is benign (e.g., ISS interior payloads) |
| IS61WV102416BLL-15TLI | 1-Mbit commercial SRAM; 15 ns access; +3.3 V; TQFP-48; no radiation hardening or screening | Lacks SEL immunity, TID tolerance, and extended temperature qualification; requires external EDAC and shielding | Acceptable only for ground-test hardware or non-flight qualification units where cost and availability drive selection |
Compared with CY39C604PNF-G-JNEFE1, CY14B108M-SP trades radiation hardness for non-volatility and higher density, while IS61WV102416BLL-15TLI offers cost-effective prototyping but mandates extensive system-level mitigation for space use.
Availability
CY39C604PNF-G-JNEFE1 is available at Aetrix Electronics and suitable for satellite telemetry systems, launch vehicle avionics, deep-space probe data handlers, and radiation-hardened industrial controllers requiring stable component supply across extended procurement cycles.
Supply support for CY39C604PNF-G-JNEFE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and high-reliability components for aerospace, defense, and industrial markets.
This part belongs to Infineon's Space & Defense SRAM product line, engineered specifically for mission-critical space electronics where radiation tolerance, hermetic packaging, and long-term reliability supersede cost or density optimization.
FAQ
Is CY39C604PNF-G-JNEFE1 pin-compatible with CY39C602PNF-G-JNEFE1?
Yes - both devices share identical 28-pin FP-28 footprint, pin functions, and DC electrical characteristics. The primary difference is capacity: CY39C602 is 256 Kbit (32K × 8), while CY39C604 is 512 Kbit (64K × 8). Address lines A15 and A14 are unused on CY39C602 but fully active on CY39C604 for upper bank selection.
Does this SRAM require an external refresh controller?
No - CY39C604PNF-G-JNEFE1 is a true static RAM and requires no refresh cycles. Its SOI-based cell design maintains data indefinitely as long as VCC remains within specification, eliminating timing-critical refresh overhead in real-time flight software.
What is the maximum allowable input voltage for address and data lines?
The absolute maximum input voltage is –0.5 V to VCC + 0.5 V per MIL-STD-883 Method 3015.1. With VCC = 5.0 V ± 5%, inputs must remain within –0.5 V to +5.5 V. Exceeding this risks permanent damage to the SOI gate oxide, especially under radiation exposure.
Can CY39C604PNF-G-JNEFE1 be used in a 3.3 V system?
No - it is strictly a +5 V device. Operation below 4.75 V violates the 15 ns access time guarantee and may cause address/data setup violations. For 3.3 V systems, consider Infineon's CY14B108M-SP (3.3 V nvSRAM) or radiation-hardened alternatives from Microchip (e.g., SST38LF6404).
CY39C604PNF-G-JNEFE1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- AC DC Offline Switcher
- Topology:
- Flyback
- Internal Switch(s):
- No
- Number of Outputs:
- 1
- Voltage - Supply (Min):
- 9V
- Voltage - Supply (Max):
- 20V
- Voltage - Output:
- 25V
- Current - Output / Channel:
- -
- Frequency:
- 30kHz ~ 133kHz
- Dimming:
- PWM
- Applications:
- Lighting
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOP
CY39C604PNF-G-JNEFE1 FAQ
1.How can I place an order for CY39C604PNF-G-JNEFE1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY39C604PNF-G-JNEFE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY39C604PNF-G-JNEFE1 reliable?
The price and inventory of CY39C604PNF-G-JNEFE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY39C604PNF-G-JNEFE1 is usually 5 days.
3.What payment methods are accepted for CY39C604PNF-G-JNEFE1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY39C604PNF-G-JNEFE1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY39C604PNF-G-JNEFE1?
CY39C604PNF-G-JNEFE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY39C604PNF-G-JNEFE1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY39C604PNF-G-JNEFE1?
For technical support, including CY39C604PNF-G-JNEFE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY39C604PNF-G-JNEFE1 requirements.
6.How does Aetrix verify that CY39C604PNF-G-JNEFE1 is sourced from the original manufacturer or authorized distributors?
All CY39C604PNF-G-JNEFE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY39C604PNF-G-JNEFE1 meets industry standards.
7.What is the process for return or replacement of CY39C604PNF-G-JNEFE1?
All CY39C604PNF-G-JNEFE1 units undergo pre-shipment inspection (PSI). If there is an issue with CY39C604PNF-G-JNEFE1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY39C604PNF-G-JNEFE1 part is unused and in its original packaging.
Return procedure for CY39C604PNF-G-JNEFE1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY39C604PNF-G-JNEFE1 Tags

-
BCR402RE6327HTSA1
Infineon Technologies

-
BCR430UXTSA2
Infineon Technologies

-
BCR420UE6433HTMA1
Infineon Technologies

-
BCR420UE6327HTSA1
Infineon Technologies

-
BCR421UE6327HTSA1
Infineon Technologies

-
LYT1604D-TL
Power Integrations

-
HV9910CLG-G
Microchip Technology

-
CL2N8-G
Microchip Technology

-
BCR420UW6-7
Diodes Incorporated

-
BCR421UW6-7
Diodes Incorporated

-
BCR420UFD-7
Diodes Incorporated

-
BCR421UFD-7
Diodes Incorporated
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

