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Infineon Technologies CY62126EV30LL-45ZSXIT

Part No.:
CY62126EV30LL-45ZSXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY62126EV30LL-45ZSXIT.pdf
Description:
IC SRAM 1MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,541

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Product details

Overview

CY62126EV30LL-45ZSXIT from Cypress Semiconductor is a 1-Mbit (64K × 16) CMOS static RAM with 45 ns access time, 2.2–3.6 V supply voltage, and industrial temperature range (–40 °C to +85 °C). It features ultra-low standby current (1 µA typical), automatic CE-controlled power-down, and byte-wide I/O control via BHE/ BLE for embedded memory expansion in portable electronics.

For engineers reviewing the CY62126EV30LL-45ZSXIT datasheet, CY62126EV30LL-45ZSXIT pinout, CY62126EV30LL-45ZSXIT application, or CY62126EV30LL-45ZSXIT equivalent, this SRAM delivers verified low-power MoBL® operation, pin compatibility with CY62126DV30, and dual-package support (48-ball VFBGA / 44-pin TSOP II) for space-constrained portable designs.

Technical Context

The CY62126EV30LL-45ZSXIT implements a fully static 64K × 16 RAM array with independent byte enable (BHE/ BLE) logic, enabling selective high- or low-byte writes without external gating. Its CMOS architecture ensures zero refresh requirement and deterministic timing across full voltage and temperature ranges.

Automatic power-down activates when CE is HIGH and address lines are stable, reducing ICC to ≤4 µA (ISB2). Output drivers enter high-impedance state during deselect (CE HIGH), OE HIGH, or write cycles (WE LOW), supporting bus sharing and multi-drop memory configurations.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 64K words × 16 bits - provides 128 KB of non-refreshing, random-access storage with byte-selectable I/O
Access Time 45 ns - guarantees deterministic read latency at full speed under industrial temperature and 3.6 V VCC
Supply Voltage 2.2 V to 3.6 V - supports direct interface with 2.5 V and 3.3 V logic domains without level translation
Standby Current 1 µA typical / 4 µA max - enables >1-year battery life in always-on portable systems with infrequent memory access
Active Current 1.3 mA typical at 1 MHz - balances performance and power for burst-mode data buffering in handheld devices
Operating Temperature –40 °C to +85 °C - qualified for industrial-grade reliability in automotive infotainment and industrial HMI applications
Package 48-ball VFBGA (6.0 × 8.0 mm, 0.5 mm pitch) - enables high-density PCB layout with minimal footprint and thermal resistance (θJA = 58.85 °C/W)

Pinout & Package

Package: 48-ball very fine pitch ball grid array (VFBGA), 6.0 mm × 8.0 mm, 0.5 mm pitch, RoHS-compliant Pb-free finish.

Pin/Terminal Circuit Role Design Meaning
A0–A15 Address Inputs 16-bit address bus selecting one of 64K memory locations; TTL/CMOS-compatible input thresholds
I/O0–I/O7 Data Bus (Low Byte) Bi-directional 8-bit data path enabled by BLE LOW; high-impedance when BLE or CE HIGH
I/O8–I/O15 Data Bus (High Byte) Bi-directional 8-bit data path enabled by BHE LOW; isolated from low byte for independent byte writes
CE Chip Enable Active-LOW global select; forces automatic power-down and high-Z outputs when HIGH
OE Output Enable Active-LOW read control; disables outputs (high-Z) when HIGH, regardless of CE state
WE Write Enable Active-LOW write strobe; initiates write cycle when CE and WE both LOW
BLE Byte Low Enable Active-LOW control for I/O0–I/O7; allows low-byte-only writes without affecting high byte
BHE Byte High Enable Active-LOW control for I/O8–I/O15; enables high-byte writes independent of low byte
VCC Power Supply 2.2–3.6 V core supply; decoupling required within 10 mm of VCC/VSS pairs per datasheet layout guidelines
VSS Ground Dual ground balls (pins E1, G1, H1, H4, H5, H6) minimize ground bounce in high-speed access

Key Features

Feature Design Value
MoBL® Ultra-Low Power Architecture Reduces active current to 1.3 mA at 1 MHz and standby to 1 µA typical-enabling multi-year battery life in wearables and remote sensors
Byte-Enable Selective Writes Independent BHE/ BLE control allows partial-word updates without read-modify-write cycles-critical for real-time firmware patching
Automatic CE Power-Down Enters sub-4 µA ISB2 mode when CE is HIGH and addresses stable-eliminates need for external power-gating logic
Pb-Free VFBGA Packaging 48-ball VFBGA meets JEDEC MO-220 VFBGA standard with 0.5 mm pitch-supports automated reflow and high I/O density on compact PCBs
Pin Compatibility with CY62126DV30 Enables drop-in replacement in legacy designs without layout changes-reducing qualification time for industrial upgrade paths

Applications

Portable Medical Monitor Industrial HMI Panel

Use Scenario: Real-time waveform buffering and configuration storage in battery-powered ECG monitors with <10 µA sleep budget.

IC Role / Device Role / Timing Role: Primary data buffer SRAM interfacing directly to ARM Cortex-M4 MCU via 16-bit parallel bus with byte-enable control.

Use Value: 1 µA standby current extends single-CR2032 battery life beyond 18 months; 45 ns access supports 22 kHz sampling without DMA stalls.

Use Scenario: Local display frame buffer and parameter cache in DIN-rail mounted PLC operator terminals operating continuously at 70 °C ambient.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding UI assets and runtime variables, accessed via SPI-to-parallel bridge IC.

Use Value: Industrial temp rating (–40 °C to +85 °C) and 4 µA max ISB2 ensure reliable operation over 10-year field deployment without thermal derating.

Automotive Infotainment Head Unit Wireless Sensor Node Gateway

Use Scenario: Audio metadata caching and touch-screen gesture history buffer in head units requiring AEC-Q200 compliance.

IC Role / Device Role / Timing Role: Secondary SRAM co-located with SoC for low-latency UI response; powered from 3.3 V domain with shared VCC rail.

Use Value: Pin compatibility with CY62126DV30 simplifies AEC-Q200 requalification; 2.2–3.6 V range tolerates automotive load-dump transients.

Use Scenario: Edge-processing buffer aggregating LoRaWAN sensor payloads before transmission in solar-charged gateways.

IC Role / Device Role / Timing Role: Burst-mode working memory for packet assembly, checksum calculation, and retry queue management.

Use Value: Automatic CE power-down cuts average system current to <5 µA between transmissions-extending 5-year solar battery life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS62WV51216BLL-45NLI Same 64K × 16 organization, 45 ns speed, but 2.7–3.6 V only; higher ISB2 (10 µA max); TSOP II only Lacks 2.2 V support and VFBGA option-unsuitable for ultra-low-voltage or space-constrained designs Select if cost sensitivity outweighs voltage flexibility and package choice
Cypress CY62126DV30LL-45ZSXI Legacy generation with identical pinout and timing, but higher ISB2 (10 µA max) and no MoBL® optimization No automatic power-down activation on address stability-requires external logic for same low-power behavior Select only for legacy board reuse where CY62126EV30LL-45ZSXIT is unavailable

Compared with IS62WV51216BLL-45NLI and CY62126DV30LL-45ZSXI, the CY62126EV30LL-45ZSXIT uniquely combines 2.2 V operation, 1 µA standby, and VFBGA packaging-making it the only choice for next-gen portable and automotive edge nodes demanding minimum power and maximum density.

Availability

CY62126EV30LL-45ZSXIT is available at Aetrix Electronics and suitable for portable medical monitors, industrial HMI panels, automotive infotainment head units, and wireless sensor node gateways requiring stable component supply across extended product lifecycles.

Supply support for CY62126EV30LL-45ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for embedded systems.

The CY62126EV30 belongs to Cypress's MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power portable and battery-operated applications where extended runtime and small form factor are critical design constraints.

FAQ

What is the minimum VCC required to retain data in CY62126EV30LL-45ZSXIT?

The device guarantees data retention down to VDR = 1.5 V, as specified in the Data Retention Characteristics table. At this voltage, ICCDR remains ≤3 µA under industrial conditions. Operation below 2.2 V is not supported for active read/write cycles, but data hold is maintained during brown-out events or battery sag scenarios meeting the 1.5 V threshold.

Does CY62126EV30LL-45ZSXIT require an external clock or refresh signal?

No. As a static RAM, CY62126EV30LL-45ZSXIT has no clock input and requires zero refresh cycles. Data remains valid indefinitely as long as VCC ≥ 1.5 V and CE is held HIGH during retention mode. All timing is asynchronous and controlled solely by CE, OE, WE, and BHE/ BLE transitions.

Can I use only the low byte (I/O0–I/O7) while leaving BHE floating?

No. BHE must be actively driven-either HIGH (to disable high byte) or LOW (to enable)-as floating inputs violate the absolute maximum rating for VIH/VIL. Per datasheet Note 7, unused byte enables should be tied to VCC (for disable) or GND (for enable) using pull-up/down resistors to ensure CMOS-level logic states and prevent increased ICC.

Is the 48-ball VFBGA package compatible with standard reflow profiles?

Yes. The Pb-free VFBGA adheres to IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports peak reflow temperatures up to 260 °C. Cypress recommends a ramp-to-spike profile with 60–120 sec above 217 °C and cooling rate ≤6 °C/sec. Board layout must follow recommended solder mask defined pads and thermal relief for VCC/VSS balls.

CY62126EV30LL-45ZSXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
MOBL™
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
64K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY62126EV30LL-45ZSXIT FAQ

1.How can I place an order for CY62126EV30LL-45ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62126EV30LL-45ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62126EV30LL-45ZSXIT reliable?

The price and inventory of CY62126EV30LL-45ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62126EV30LL-45ZSXIT is usually 5 days.

3.What payment methods are accepted for CY62126EV30LL-45ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62126EV30LL-45ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62126EV30LL-45ZSXIT?

CY62126EV30LL-45ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62126EV30LL-45ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62126EV30LL-45ZSXIT?

For technical support, including CY62126EV30LL-45ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62126EV30LL-45ZSXIT requirements.

6.How does Aetrix verify that CY62126EV30LL-45ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY62126EV30LL-45ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62126EV30LL-45ZSXIT meets industry standards.

7.What is the process for return or replacement of CY62126EV30LL-45ZSXIT?

All CY62126EV30LL-45ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY62126EV30LL-45ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62126EV30LL-45ZSXIT part is unused and in its original packaging.

Return procedure for CY62126EV30LL-45ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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