Infineon Technologies CY62126EV30LL-55ZSXE
- Part No.:
- CY62126EV30LL-55ZSXE
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62126EV30LL-55ZSXE.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY62126EV30LL-55ZSXE from Cypress Semiconductor is a 1-Mbit (64K × 16) CMOS static RAM with 55 ns access time, 2.2–3.6 V supply range, and industrial temperature rating (–40 °C to +85 °C). It features ultra-low standby current (1 µA typical), automatic CE-controlled power-down, and dual-byte enable (BHE/ BLE) for flexible 8-bit or 16-bit data access. Used in portable embedded systems requiring battery longevity and deterministic timing.
For engineers reviewing the CY62126EV30LL-55ZSXE datasheet, CY62126EV30LL-55ZSXE pinout, CY62126EV30LL-55ZSXE application, or CY62126EV30LL-55ZSXE equivalent, key selection criteria include its 55 ns read cycle time, 1 µA ISB2 standby current at 3.6 V, TSOP II package compatibility, and byte-selectable I/O architecture for memory expansion in space-constrained designs.
Technical Context
The CY62126EV30LL-55ZSXE implements a full CMOS 64K × 16 SRAM array with independent high- and low-byte enables (BHE, BLE), enabling partial-word writes without external logic. Its automatic power-down activates when CE is HIGH and address lines are stable, reducing ICC to ≤4 µA.
Timing is governed by asynchronous control: read operations require CE and OE LOW with WE HIGH; write operations require CE and WE LOW, with BHE or BLE selecting upper/lower byte. All switching parameters-including tRC = 55 ns, tDOE = 25 ns, and tHZOE = 20 ns-are specified over full voltage (2.2–3.6 V) and temperature (–40 °C to +85 °C) ranges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K words × 16 bits - supports 128 KB of word-aligned data storage with byte-select capability |
| Access Time (tRC) | 55 ns - guarantees deterministic read latency for real-time microcontroller interfaces |
| Supply Voltage Range | 2.2 V to 3.6 V - compatible with single-supply 2.5 V or 3.3 V systems without level translation |
| Standby Current (ISB2) | Max 4 µA at 3.6 V - enables multi-year battery operation in always-on sensor nodes |
| Active Current (ICC) | Typ 1.3 mA at 1 MHz - balances performance and power for intermittent data logging |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial-grade embedded control and instrumentation |
| Package | 44-pin TSOP II - surface-mount footprint with 0.8 mm pitch, compatible with standard reflow profiles |
Pinout & Package
44-pin Thin Small Outline Package (TSOP II), 375 mil width, lead-free (Pb-free) finish. Pinout validated per Cypress datasheet 38-05486 Rev. *H, Figure 2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus for 64K-word addressing; TTL/CMOS-compatible thresholds |
| I/O0–I/O7 | Data Bus (Low Byte) | Bi-directional 8-bit data path enabled when BLE = LOW during read/write |
| I/O8–I/O15 | Data Bus (High Byte) | Bi-directional 8-bit data path enabled when BHE = LOW during read/write |
| CE | Chip Enable | Active-LOW global select; forces automatic power-down and high-Z I/O when HIGH |
| OE | Output Enable | Active-LOW read control; disables outputs (high-Z) when HIGH, independent of CE state |
| WE | Write Enable | Active-LOW write strobe; latches data on rising edge when CE and BHE/ BLE are active |
| BLE | Byte Low Enable | Active-LOW control for I/O0–I/O7; allows 8-bit writes without affecting high byte |
| BHE | Byte High Enable | Active-LOW control for I/O8–I/O15; enables independent upper-byte access |
| VCC | Power Supply | 2.2–3.6 V core supply; decoupling required within 10 mm of pins 16 and 31 |
| VSS | Ground | Dual ground pins (pins 15, 30) minimize noise coupling between address and data paths |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low standby current | 1 µA typical ISB2 enables >5-year battery life in coin-cell-powered IoT endpoints |
| Asynchronous byte-select interface | BHE/ BLE pins eliminate need for external byte-masking logic in 8-bit microcontroller systems |
| Automatic CE power-down | Reduces ICC by >99% when CE is HIGH and addresses stable-no software intervention needed |
| 55 ns read cycle with 25 ns OE access | tDOE = 25 ns ensures fast data retrieval for interrupt-driven firmware with tight latency budgets |
| Pb-free TSOP II packaging | RoHS-compliant 44-pin TSOP II (JEDEC MO-141BA) supports automated SMT assembly and IPC-A-610 Class 2 reliability |
Applications
| Portable Medical Sensors | Industrial PLC I/O Modules |
|---|---|
Use Scenario: Continuous ECG waveform buffering in handheld patient monitors powered by CR2032 batteries. IC Role / Device Role / Timing Role: Offloads MCU by storing 16-bit sampled ADC data with deterministic 55 ns read latency and zero wait states. Use Value: 1 µA standby current extends battery life to 4.2 years; byte-enable support matches 12-bit ADC output packing into lower byte only. | Use Scenario: Local data caching in DIN-rail mounted programmable logic controllers with isolated 24 V DC input modules. IC Role / Device Role / Timing Role: Non-volatile shadow RAM for retaining configuration registers and last-state I/O values during brownouts. Use Value: –40 °C to +85 °C rating ensures reliable operation in unconditioned control cabinets; 3.3 V compatibility eliminates LDO for memory rail. |
| Wireless Sensor Node Gateways | Automotive Body Control Units |
Use Scenario: LoRaWAN gateway aggregating sensor data from 32-node mesh networks before uplink transmission. IC Role / Device Role / Timing Role: Temporary packet buffer between RF transceiver and host MCU, supporting burst reads/writes via BHE/ BLE. Use Value: Dual-byte interface reduces SPI-to-parallel bridge complexity; 55 ns tRC enables full 128-byte packet reads in <10 µs. | Use Scenario: Door module controller storing window position calibration, mirror angle presets, and fault logs. IC Role / Device Role / Timing Role: Fast-access scratchpad memory for real-time CAN message preprocessing and EEPROM wear-leveling metadata. Use Value: Automatic power-down cuts quiescent draw below 5 µA during sleep mode-critical for ISO 16750-2 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV102416BLL-55NLI | Same 64K × 16 organization, 55 ns speed, but 2.7–3.6 V only; no 2.2 V support | Lacks ultra-low 2.2 V operation-unsuitable for battery-powered systems below 2.7 V | Select if system uses fixed 3.3 V rail and requires second-source availability |
| Cypress CY62126DV30LL-55ZSXI | Pin-compatible predecessor with identical timing but higher ISB2 (max 10 µA) and no MoBL® low-power enhancements | Higher standby current limits battery lifetime in always-on applications | Choose only for legacy design continuity where CY62126EV30LL-55ZSXE is unavailable |
Compared with IS62WV102416BLL-55NLI, CY62126EV30LL-55ZSXE delivers wider voltage flexibility and lower standby power; versus CY62126DV30LL-55ZSXI, it achieves 60% lower ISB2 while maintaining identical pinout and timing-making it the optimal upgrade for power-sensitive industrial designs.
Availability
CY62126EV30LL-55ZSXE is available at Aetrix Electronics and suitable for portable medical sensors, industrial PLC I/O modules, and wireless sensor node gateways requiring stable component supply across extended product lifecycles.
Supply support for CY62126EV30LL-55ZSXE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and consumer electronics.
The MoBL® (More Battery Life) SRAM product line targets ultra-low-power embedded systems, emphasizing sub-µA standby current, wide voltage operation, and robust AC timing across temperature extremes.
FAQ
What is the maximum clock frequency supported by CY62126EV30LL-55ZSXE?
CY62126EV30LL-55ZSXE is an asynchronous SRAM and does not use a clock signal. Its maximum operational speed is defined by access time: tRC = 55 ns, corresponding to a maximum effective cycle rate of ~18.2 MHz. System timing must satisfy all setup/hold constraints (e.g., tSA = 0 ns, tHA = 0 ns, tSD = 25 ns) relative to CE, OE, WE, and BHE/ BLE edges-not a system clock.
Can CY62126EV30LL-55ZSXE operate reliably at 2.2 V across the full industrial temperature range?
Yes. The device is fully specified for 2.2 V to 3.6 V operation over –40 °C to +85 °C. At 2.2 V and +85 °C, tRC remains ≤55 ns, ISB2 stays ≤4 µA, and VIH/VIL thresholds meet guaranteed levels (VIH ≥ 1.8 V, VIL ≤ 0.6 V). No derating is required per datasheet Table "Electrical Characteristics" and "Operating Range".
How does the automatic power-down feature interact with OE and BHE/ BLE signals?
Automatic power-down activates solely on CE HIGH state-regardless of OE, BHE, or BLE status. When CE is HIGH, ICC drops to ≤4 µA and all I/Os enter high-Z, even if OE is LOW or BHE/ BLE are asserted. OE and BHE/ BLE only affect output drivers during active (CE LOW) operation; they have no effect on power-down entry or exit.
Is the 44-pin TSOP II package of CY62126EV30LL-55ZSXE compatible with standard JEDEC reflow profiles?
Yes. The Pb-free TSOP II package complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports peak reflow temperatures up to 260 °C for ≤60 seconds. Recommended profile includes ramp-up ≤3 °C/s, preheat 150–200 °C for 60–120 s, soak 200–220 °C for 60–120 s, and time above liquidus (TAL) 235–245 °C for 40–80 s.
CY62126EV30LL-55ZSXE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62126EV30LL-55ZSXE FAQ
1.How can I place an order for CY62126EV30LL-55ZSXE through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62126EV30LL-55ZSXE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62126EV30LL-55ZSXE reliable?
The price and inventory of CY62126EV30LL-55ZSXE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62126EV30LL-55ZSXE is usually 5 days.
3.What payment methods are accepted for CY62126EV30LL-55ZSXE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62126EV30LL-55ZSXE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62126EV30LL-55ZSXE?
CY62126EV30LL-55ZSXE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62126EV30LL-55ZSXE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62126EV30LL-55ZSXE?
For technical support, including CY62126EV30LL-55ZSXE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62126EV30LL-55ZSXE requirements.
6.How does Aetrix verify that CY62126EV30LL-55ZSXE is sourced from the original manufacturer or authorized distributors?
All CY62126EV30LL-55ZSXE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62126EV30LL-55ZSXE meets industry standards.
7.What is the process for return or replacement of CY62126EV30LL-55ZSXE?
All CY62126EV30LL-55ZSXE units undergo pre-shipment inspection (PSI). If there is an issue with CY62126EV30LL-55ZSXE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62126EV30LL-55ZSXE part is unused and in its original packaging.
Return procedure for CY62126EV30LL-55ZSXE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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