Infineon Technologies CY62127DV30LL-55ZXI
- Part No.:
- CY62127DV30LL-55ZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62127DV30LL-55ZXI.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY62127DV30LL-55ZXI from Cypress Semiconductor is a 1-Mb (64K × 16) low-voltage CMOS static RAM with 45 ns access time, 2.2–3.6 V supply range, and industrial temperature rating (–40°C to +85°C). It features byte-wide control (BHE/ BLE), automatic CE power-down, and ultra-low standby current (1.5 µA typ). Used in portable embedded systems requiring battery-efficient memory retention.
For engineers reviewing the CY62127DV30LL-55ZXI datasheet, CY62127DV30LL-55ZXI pinout, CY62127DV30LL-55ZXI application, or CY62127DV30LL-55ZXI equivalent, key selection criteria include 44-pin TSOP II package compatibility, MoBL® low-power operation, byte-selectable I/O architecture, and guaranteed 55 ns read/write cycle timing at 3.6 V.
Technical Context
The CY62127DV30LL-55ZXI implements a synchronous, non-volatile-retentive SRAM array organized as 64K words × 16 bits, with independent high- and low-byte enables (BHE/BLE) enabling partial-word writes. Its power-down circuitry reduces ICC to ≤1.5 µA when CE is HIGH or both BHE and BLE are HIGH.
It supports three distinct operational states: active (CE/WE/OE controlled), output-disabled (OE HIGH), and automatic standby (CE HIGH or BHE/BLE HIGH), each with verified current draw (ICC = 5 mA max @ fMAX; ISB2 = 4 µA max). All I/O pins enter high-impedance during deselection or write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16-bit (1,048,576 bits), enabling 16-bit data bus interfacing without external multiplexing |
| Access Time | 55 ns max at VCC = 3.6 V - guarantees deterministic timing for 18.2 MHz burst reads in microcontroller co-processor interfaces |
| VCC Range | 2.2 V to 3.6 V - compatible with single-supply 2.5 V or 3.3 V logic domains and Li-ion battery discharge profiles |
| Active Current | 5 mA max @ fMAX - enables sustained operation in handheld devices with <100 mW memory subsystem power budget |
| Standby Current | 4 µA max (ISB2) - supports >1-year data retention on coin-cell backup in real-time clock modules |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded controllers in factory automation and metering |
| Package | 44-lead TSOP Type II (Z suffix) - surface-mount compatible with standard reflow profiles and IPC-7351B land patterns |
Pinout & Package
44-lead Thin Small Outline Package (TSOP Type II), 400 mil body width, lead pitch 0.8 mm. Pin 1 marked by beveled corner; pin 23 designated DNU (do not use), must be left floating or tied to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus accepting 0x0000–0xFFFF; latched on CE transition for random access |
| I/O0–I/O7 | Data Bus (Low Byte) | Bi-directional 8-bit data path enabled only when BLE = LOW and CE/OE = LOW (read) or CE/WE = LOW (write) |
| I/O8–I/O15 | Data Bus (High Byte) | Bi-directional 8-bit data path enabled only when BHE = LOW and CE/OE = LOW (read) or CE/WE = LOW (write) |
| CE | Chip Enable | Active-LOW global select; forces device into standby (ISB2) when HIGH, disabling all outputs and reducing ICC by >99% |
| OE | Output Enable | Active-LOW read control; places I/O pins in high-Z when HIGH, enabling bus sharing without external tri-state logic |
| WE | Write Enable | Active-LOW write strobe; initiates write cycle when CE = LOW; concurrent with BHE/BLE determines byte-write granularity |
| BHE, BLE | Byte High/Low Enable | Independent active-LOW controls for upper/lower data bytes; enable partial-word writes without read-modify-write overhead |
| VCC, VSS | Power Supply | Single 2.2–3.6 V supply; decoupling required within 10 mm of pins 16/17 (VCC) and 30/31 (VSS) per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power | 1.5 µA typical standby current (ISB2) extends battery life in portable instrumentation and medical sensors |
| Byte-Selectable Write | Independent BHE/BLE inputs allow 8-bit writes to either half of 16-bit word - eliminates software masking in 8-bit MCU interfaces |
| Automatic Power-Down | Hardware-driven transition to ISB2 state when CE HIGH or BHE/BLE both HIGH - no firmware intervention required |
| Pb-Free & RoHS Compliant | Meets JEDEC J-STD-020D reflow profile; compatible with lead-free assembly processes up to 260°C peak |
| Pin-Compatible Upgrade | Direct replacement for CY62127BV series - preserves PCB layout while improving speed (55 ns vs. legacy 70 ns) and power |
Applications
| Portable Medical Sensors | Industrial PLC Data Buffers |
|---|---|
|
Use Scenario: Continuous glucose monitor logging raw ADC samples at 100 Hz with local FIR filtering before BLE transmission. IC Role / Device Role / Timing Role: Offload MCU SRAM usage by storing 64K filtered samples; 55 ns access enables real-time 16-bit arithmetic without pipeline stalls. Use Value: 4 µA ISB2 current allows 3-year operation on CR2032 cell during sleep; byte-enable reduces write energy by 50% vs. full-word writes. |
Use Scenario: Storing I/O scan history and diagnostic logs in DIN-rail mounted programmable logic controller with 20 ms scan cycle. IC Role / Device Role / Timing Role: Dual-port buffer between ARM Cortex-M7 core and isolated CAN/RS-485 peripherals; operates at 3.3 V with deterministic 55 ns latency. Use Value: TSOP II package fits constrained 2-layer PCB; automatic CE power-down cuts background memory power to <10 µW during idle scan phases. |
| Smart Energy Meters | Automotive Body Control Modules |
|
Use Scenario: Tamper-resistant kWh accumulation with hourly tariff switching and cryptographic signature storage in Class 0.5S electricity meters. IC Role / Device Role / Timing Role: Secure scratchpad for AES-128 key expansion and rolling counter; retains data at 2.2 V during brown-out events. Use Value: 2.2 V minimum VCC supports operation down to single-cell LiFePO₄ voltage; 1.5 µA ISB2 ensures >10-year calendar life with supercap backup. |
Use Scenario: Door module storing window position calibration, seat memory profiles, and fault codes across vehicle ignition cycles. IC Role / Device Role / Timing Role: Non-volatile shadow RAM backed by EEPROM; holds 64K configuration bits with 55 ns read for fast wake-up response. Use Value: Industrial temp grade (–40°C to +85°C) ensures reliability in under-hood thermal cycling; byte-enable minimizes write wear on backup flash. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV51216BLL-55NLI | Same 512K-bit (32K × 16) density, 55 ns access, but 2.7–3.6 V only; no 2.2 V support | Lacks low-voltage operation below 2.7 V - unsuitable for battery-powered designs with deep discharge | Select if system uses regulated 3.3 V only and requires lower cost; verify timing margins at 2.7 V min |
| ON Semiconductor MC68HC11E9CP | Microcontroller with integrated 512-byte RAM - not a standalone SRAM; no byte-enable or 55 ns timing | Embedded solution only; no external memory interface capability | Not a functional alternative - only relevant for complete MCU replacement, not memory upgrade |
Compared with IS62WV51216BLL-55NLI, CY62127DV30LL-55ZXI delivers 2.2 V operation critical for battery longevity, while MC68HC11E9CP lacks external SRAM functionality entirely - making CY62127DV30LL-55ZXI the sole viable drop-in replacement for MoBL®-optimized designs.
Availability
CY62127DV30LL-55ZXI is available at Aetrix Electronics and suitable for portable medical sensors, industrial PLC data buffers, smart energy meters, and automotive body control modules requiring stable component supply across extended product lifecycles.
Supply support for CY62127DV30LL-55ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and consumer electronics, with headquarters in San Jose, CA.
CY62127DV30LL-55ZXI belongs to the MoBL® (More Battery Life™) SRAM product line, engineered specifically for ultra-low-power portable and battery-backed applications where sub-µA standby and wide VCC range are mandatory.
FAQ
What is the maximum clock frequency supported by CY62127DV30LL-55ZXI?
CY62127DV30LL-55ZXI is an asynchronous SRAM and does not use a clock signal. Its performance is defined by access time (55 ns max) and cycle time (55 ns read/write), supporting effective data throughput up to 18.2 MHz in burst mode. Timing is controlled solely by CE, OE, WE, and address setup/hold requirements per the datasheet truth table.
Can CY62127DV30LL-55ZXI operate at 2.5 V and still meet 55 ns timing?
Yes. The datasheet specifies 55 ns maximum access time across the full 2.2–3.6 V range, including 2.5 V. At 2.5 V, tAA, tACE, and tDOE remain within 55 ns limits under industrial temperature conditions (–40°C to +85°C), confirmed by characterization data in Table "Switching Characteristics" on page 5.
Is pin 23 of the TSOP II package required to be grounded?
No. Pin 23 is designated DNU (Do Not Use) and must be left floating or tied to VSS (ground) - both configurations are acceptable per datasheet Note 3. Tying it to VSS provides noise immunity; leaving it floating is electrically safe but may increase susceptibility to ESD coupling in high-noise environments.
Does CY62127DV30LL-55ZXI support true dual-port operation?
No. It is a single-port SRAM with one address bus and bidirectional I/O lines. While BHE/BLE enable simultaneous read/write to different bytes in theory, the shared address bus and common CE/OE/WE controls prevent concurrent independent access - unlike true dual-port SRAMs with separate read/write ports and arbitration logic.
CY62127DV30LL-55ZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62127DV30LL-55ZXI FAQ
1.How can I place an order for CY62127DV30LL-55ZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62127DV30LL-55ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62127DV30LL-55ZXI reliable?
The price and inventory of CY62127DV30LL-55ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62127DV30LL-55ZXI is usually 5 days.
3.What payment methods are accepted for CY62127DV30LL-55ZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62127DV30LL-55ZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62127DV30LL-55ZXI?
CY62127DV30LL-55ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62127DV30LL-55ZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62127DV30LL-55ZXI?
For technical support, including CY62127DV30LL-55ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62127DV30LL-55ZXI requirements.
6.How does Aetrix verify that CY62127DV30LL-55ZXI is sourced from the original manufacturer or authorized distributors?
All CY62127DV30LL-55ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62127DV30LL-55ZXI meets industry standards.
7.What is the process for return or replacement of CY62127DV30LL-55ZXI?
All CY62127DV30LL-55ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62127DV30LL-55ZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62127DV30LL-55ZXI part is unused and in its original packaging.
Return procedure for CY62127DV30LL-55ZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62127DV30LL-55ZXI Tags

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