Infineon Technologies CY62128BLL-70SC
- Part No.:
- CY62128BLL-70SC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.445", 11.30mm Width)
- Datasheet:
-
CY62128BLL-70SC.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:4,293
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62128BLL-70SC from Cypress Semiconductor is a 128K × 8 (131,072 × 8) CMOS static RAM with 70 ns access time, 4.5–5.5 V operation, and industrial temperature range (–40°C to +85°C). It features TTL-compatible I/O, automatic CE-based power-down, and dual chip enable (CE1 active-low, CE2 active-high) for flexible memory expansion in embedded controllers and data acquisition systems.
For engineers reviewing the CY62128BLL-70SC datasheet, CY62128BLL-70SC pinout, CY62128BLL-70SC application, or CY62128BLL-70SC equivalent, this page delivers verified electrical specs, validated pin functions, real-world use cases, and confirmed alternatives - all grounded in Cypress Document #38-05300 Rev. *C.
Technical Context
The CY62128BLL-70SC implements a full CMOS SRAM architecture with separate address decoding (A0–A16), bidirectional I/O (I/O0–I/O7), and three-state output control via OE, CE1, and CE2. Its automatic power-down reduces standby current to ≤15 µA when CE1 is high or CE2 is low.
Read operations require CE1 = LOW, CE2 = HIGH, OE = LOW, and WE = HIGH; writes require CE1 = LOW, CE2 = HIGH, and WE = LOW. The device supports concurrent address/data bus sharing through high-impedance I/O states during deselect, OE deassertion, or write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 131,072 words × 8 bits - provides 128 KB of nonvolatile-accessible, byte-wide storage without refresh circuitry. |
| Access Time | 70 ns - guarantees maximum read latency under industrial conditions (VCC = 4.5–5.5 V, TA = –40°C to +85°C). |
| Supply Voltage | 4.5 V to 5.5 V - compatible with standard 5 V logic rails and tolerant of ±10% regulation variation. |
| Active Current (ICC) | ≤15 mA - enables low-power operation in continuously accessed buffer or cache applications. |
| Standby Current (ISB2) | ≤15 µA - achieves >75% power reduction during deselected states, critical for battery-backed or intermittent-use systems. |
| Input/Output Compatibility | TTL-level - ensures direct interfacing with legacy microcontrollers, FPGAs, and ASICs without level-shifting. |
| Data Retention Voltage | ≥2.0 V - allows reliable data hold during brown-out or backup-battery operation down to 2 V. |
Pinout & Package
The CY62128BLL-70SC is packaged in a 32-pin, 450-mil-wide SOIC (S34 package), with lead finish options including Pb-free (SXI variant). Pin layout follows JEDEC MS-012AC standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 131,072-word addressing; no internal multiplexing required. |
| I/O0–I/O7 | Bidirectional Data Lines | Shared input/output path controlled by OE and WE; tri-stated during deselect, read disable, or write cycles. |
| CE1 | Chip Enable 1 (active-low) | Primary selection signal; device enters power-down when high, enabling hierarchical memory decoding. |
| CE2 | Chip Enable 2 (active-high) | Secondary enable used with CE1 for 2-chip decode schemes (e.g., bank selection in larger arrays). |
| OE | Output Enable (active-low) | Controls I/O direction: LOW enables output drivers; HIGH places pins in high-Z for write or bus sharing. |
| WE | Write Enable (active-low) | Asserted LOW to initiate write; combined with CE1/CE2 to define valid write window per timing spec tSCE. |
| VCC | Power Supply | 5 V nominal supply; supports full-speed operation across 4.5–5.5 V range with guaranteed timing. |
| GND | Ground Reference | Common return for all signals and power; decoupling recommended within 10 mm of VCC pin. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable Architecture | CE1 (active-low) and CE2 (active-high) allow cascaded memory banks or multi-device decoding without external logic. |
| Automatic Power-Down | Reduces ISB2 to ≤15 µA when CE1 is high or CE2 is low - eliminates need for external sleep control in portable systems. |
| Three-State Output Control | OE, CE1, and CE2 jointly manage I/O impedance state, enabling clean bus arbitration and shared data bus operation. |
| Industrial Temperature Support | Rated for –40°C to +85°C operation - qualified for use in industrial PLCs, motor drives, and outdoor instrumentation. |
| Data Retention at Low Voltage | Maintains stored data down to VCC = 2.0 V - supports seamless transition to backup power during main supply failure. |
Applications
| Industrial Data Logger | Automotive Engine Control Unit (ECU) |
|---|---|
|
Use Scenario: Continuous sensor sampling at 1 kHz with burst writes to local buffer before CAN transmission. IC Role / Device Role / Timing Role: High-reliability, low-latency SRAM buffer holding 128 KB of timestamped analog/digital readings prior to protocol formatting. Use Value: 70 ns access time ensures minimal CPU wait states; ≤15 µA standby current extends battery life during idle logging intervals. |
Use Scenario: Real-time calibration table storage and runtime variable buffering in engine management firmware. IC Role / Device Role / Timing Role: Non-refresh volatile memory for lookup tables (fuel maps, ignition timing) and transient variables updated at 10 ms intervals. Use Value: Industrial-grade –40°C to +85°C rating matches ECU under-hood thermal envelope; TTL compatibility simplifies interface with legacy 8051-based MCUs. |
| Medical Patient Monitor | Programmable Logic Controller (PLC) |
|
Use Scenario: Temporary waveform storage (ECG, SpO₂) during short-term power loss or wireless sync windows. IC Role / Device Role / Timing Role: Battery-backed SRAM buffer preserving up to 128 KB of clinical waveform history with guaranteed retention at 2.0 V. Use Value: Data retention voltage ≥2.0 V enables seamless failover to coin-cell backup; low ICC (≤15 mA) minimizes primary battery drain during continuous acquisition. |
Use Scenario: Ladder logic execution stack and I/O image buffering in DIN-rail mounted industrial controllers. IC Role / Device Role / Timing Role: Fast-access scratchpad memory for scan-cycle variables, status registers, and communication buffers in deterministic real-time control loops. Use Value: Dual CE inputs simplify modular backplane memory mapping; 4.5–5.5 V tolerance accommodates unregulated 5 V rail in ruggedized enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62C1024AL-70QLI | Same 128K × 8 organization, 70 ns speed, but uses single active-low CE and operates at 4.5–5.5 V; standby current 25 µA (vs. 15 µA). | Lacks CE2 pin - requires external gating for multi-bank decode; suitable where board space limits dual-CE routing. | Prefer when simplifying decode logic outweighs 10 µA standby penalty and CE2 functionality is unused. |
| ON Semiconductor MCM62C1024B-70 | Identical pinout and timing, but rated only for commercial temp (0°C to +70°C); standby current 20 µA. | Not qualified for industrial or automotive environments; lacks extended temperature validation and data retention testing below 2.0 V. | Select only for cost-sensitive consumer or lab equipment where ambient stays within 0–70°C and backup voltage margin is noncritical. |
Compared with IS62C1024AL-70QLI and MCM62C1024B-70, the CY62128BLL-70SC uniquely delivers industrial temperature support, dual CE decode capability, and lowest verified standby current (15 µA) - making it optimal for thermally demanding, battery-constrained, or hierarchically decoded systems.
Availability
CY62128BLL-70SC is available at Aetrix Electronics and suitable for industrial data loggers, automotive ECUs, medical patient monitors, and programmable logic controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY62128BLL-70SC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and mixed-signal ICs for industrial, automotive, and computing applications.
The CY62128B MoBL® family targets low-power, high-speed SRAM needs in embedded systems where deterministic timing, wide temperature operation, and robust data retention are essential.
FAQ
What is the minimum VCC required to retain data in CY62128BLL-70SC?
Data retention is guaranteed down to VCC = 2.0 V, as specified in the "Data Retention Characteristics" section of Cypress Document #38-05300 Rev. *C. At this voltage, ICCDR remains ≤15 µA, and tCDR = 0 ns - meaning retention begins immediately upon entering power-down mode with CE1 high or CE2 low.
Can CY62128BLL-70SC be used with a 3.3 V microcontroller interface?
No - the CY62128BLL-70SC is strictly a 5 V device with TTL-compatible inputs (VIH = 2.2 V min, VIL = 0.8 V max) and requires VCC = 4.5–5.5 V. Direct connection to 3.3 V logic violates VIH/VIL thresholds and risks unreliable operation; level translation is mandatory.
Does CY62128BLL-70SC support asynchronous burst reads?
No - it is a classic asynchronous SRAM with no internal burst counter or sequential address generation. Each read requires full address setup (tAA = 70 ns) and is independent; burst behavior must be implemented externally via controller logic or address sequencing.
What is the function of the NC pin on CY62128BLL-70SC's SOIC package?
Pin 18 in the 32-pin SOIC package is marked "NC" (No Connect) in Cypress's official pinout diagrams and truth table. It is internally unconnected and must remain floating - no pull-up, pull-down, or routing is permitted, as per Document #38-05300 Rev. *C, Page 3.
CY62128BLL-70SC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-SOIC (0.445", 11.30mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC
CY62128BLL-70SC FAQ
1.How can I place an order for CY62128BLL-70SC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128BLL-70SC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128BLL-70SC reliable?
The price and inventory of CY62128BLL-70SC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128BLL-70SC is usually 5 days.
3.What payment methods are accepted for CY62128BLL-70SC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128BLL-70SC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128BLL-70SC?
CY62128BLL-70SC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128BLL-70SC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128BLL-70SC?
For technical support, including CY62128BLL-70SC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128BLL-70SC requirements.
6.How does Aetrix verify that CY62128BLL-70SC is sourced from the original manufacturer or authorized distributors?
All CY62128BLL-70SC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128BLL-70SC meets industry standards.
7.What is the process for return or replacement of CY62128BLL-70SC?
All CY62128BLL-70SC units undergo pre-shipment inspection (PSI). If there is an issue with CY62128BLL-70SC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128BLL-70SC part is unused and in its original packaging.
Return procedure for CY62128BLL-70SC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62128BLL-70SC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
Oil pressure sensor diagnosis covering symptoms, location, testing, replacement, socket access, common failure cases, and the electronic signal path between the pressure sensor, wiring, ECU and gauge s…

