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Infineon Technologies CY62128BLL-70SXC
- Part No.:
- CY62128BLL-70SXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.445", 11.30mm Width)
- Datasheet:
-
CY62128BLL-70SXC.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,321
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Product details
Overview
CY62128BLL-70SXC from Cypress Semiconductor is a 128K × 8 (131,072-word × 8-bit) CMOS static RAM with 70 ns access time, 4.5–5.5 V operation, and industrial-grade temperature range (–40°C to +85°C). It features TTL-compatible I/O, automatic CE-based power-down, and dual chip enable (CE1 active-low, CE2 active-high) for flexible memory expansion in embedded controllers and data acquisition systems.
For engineers reviewing the CY62128BLL-70SXC datasheet, CY62128BLL-70SXC pinout, CY62128BLL-70SXC application, or CY62128BLL-70SXC equivalent, key selection criteria include standby current (≤15 µA), read cycle time (70 ns), CE/OE/WE timing compatibility, and SOIC-32 package footprint for legacy PCB reuse.
Technical Context
The CY62128BLL-70SXC implements a full CMOS SRAM array with 512 × 256 × 8 organization, row/column decoding, and sense amplifiers. Its dual CE architecture enables seamless bank selection without external logic, while three-state I/O drivers support bus sharing in multi-device systems.
Power management relies on automatic CE-driven power-down: when CE1 is HIGH or CE2 is LOW, ICC drops to ≤15 µA (ISB2), reducing active power by >75%. All control inputs (WE, OE, CE1, CE2) are TTL-compatible with VIH ≥ 2.2 V and VIL ≤ 0.8 V at VCC = 5.0 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 128K × 8 bits (131,072 words × 8-bit wide); supports byte-wide data bus interface without multiplexing. |
| Access Time | 70 ns max (tAA, tRC); ensures reliable operation with 14 MHz bus clocks in microcontroller systems. |
| VCC Range | 4.5 V to 5.5 V; compatible with standard 5 V logic rails and tolerant of ±10% supply variation. |
| Standby Current | ≤15 µA (ISB2, CMOS inputs); enables low-power hold mode during processor sleep in portable instrumentation. |
| Active Current | ≤15 mA (ICC, max); limits thermal load in dense PCB layouts with multiple SRAMs. |
| I/O Voltage Levels | TTL-compatible: VIH ≥ 2.2 V, VIL ≤ 0.8 V; interoperable with legacy 5 V microcontrollers and FPGAs. |
| Package | 32-pin SOIC (450-mil width); industry-standard footprint for drop-in replacement and rework compatibility. |
Pinout & Package
Package: 32-pin SOIC (450-mil width), RoHS-compliant (Pb-free), industrial temperature grade (–40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 131,072-word addressing; no address multiplexing required. |
| I/O0–I/O7 | Bidirectional Data Lines | 8-bit data bus shared for read/write; high-impedance when deselected or during write cycles. |
| CE1 | Chip Enable 1 (active-low) | Primary selection signal; device enters standby when HIGH, enabling multi-chip decode schemes. |
| CE2 | Chip Enable 2 (active-high) | Secondary enable; must be HIGH with CE1 LOW for active operation; allows hierarchical memory mapping. |
| OE | Output Enable (active-low) | Controls I/O direction: LOW enables output drivers; HIGH places I/O pins in high-Z for bus sharing. |
| WE | Write Enable (active-low) | Initiates write cycle when CE1 LOW and CE2 HIGH; data latched on WE falling edge. |
| VCC | Power Supply | +5 V nominal supply; decoupling capacitor required within 10 mm of pin per layout guidelines. |
| GND | Ground Reference | Signal and power ground return; requires low-inductance connection to minimize noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable (CE1/CE2) | Enables direct connection to 16-bit address buses (e.g., A16 as CE2) without glue logic for bank switching. |
| Automatic Power-Down | Reduces ICC to ≤15 µA when CE1 HIGH or CE2 LOW-no external control needed for low-power sleep states. |
| TTL-Compatible I/O | Eliminates level-shifting components when interfacing with 5 V MCUs like 8051, PIC18, or legacy DSPs. |
| Three-State Outputs | Prevents bus contention in shared-memory systems; outputs enter high-Z on OE HIGH, CE1 HIGH, or WE LOW. |
| Data Retention at 2.0 V | Maintains stored data down to VCC = 2.0 V (VDR), supporting brown-out recovery in battery-backed systems. |
Applications
| Industrial PLC Memory Buffer | Medical Instrument Data Logger |
|---|---|
|
Use Scenario: Stores real-time sensor samples and control state variables between CPU polling intervals in programmable logic controllers. IC Role / Device Role / Timing Role: Byte-accessible SRAM buffer providing deterministic 70 ns read/write latency for deterministic scan-cycle execution. Use Value: Dual CE architecture allows seamless integration into 16-bit address-mapped I/O spaces without address decoder ICs. |
Use Scenario: Captures ECG waveform segments during transient power loss in portable diagnostic devices with backup coin-cell supply. IC Role / Device Role / Timing Role: Low-leakage SRAM maintaining critical patient data during VCC brown-out (down to 2.0 V retention voltage). Use Value: 15 µA standby current extends backup runtime; SOIC package enables manual rework on high-reliability medical PCBs. |
| Automotive Body Control Module | Legacy Industrial HMI Controller |
|
Use Scenario: Holds configuration parameters and fault logs in body control units operating across –40°C to +125°C ambient ranges. IC Role / Device Role / Timing Role: Industrial-grade SRAM with extended temperature qualification ensuring data integrity under engine-bay thermal stress. Use Value: 4.5–5.5 V VCC tolerance accommodates automotive battery transients (load dump, cold crank) without external regulators. |
Use Scenario: Serves as main program/data RAM in aging human-machine interface controllers using 8-bit microcontrollers with parallel buses. IC Role / Device Role / Timing Role: Pin- and timing-compatible replacement for obsolete 128K×8 SRAMs (e.g., HM628128) in field-upgrade scenarios. Use Value: SOIC-32 footprint and identical CE/OE/WE timing allow drop-in replacement without PCB redesign or firmware changes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62C128AL-70QLI | Same 128K×8, 70 ns, SOIC-32, but uses single CE (active-low only); no CE2 input. | Lacks hierarchical decode capability; requires external logic for multi-bank systems. | Choose when board space is constrained and CE2 functionality is unused. |
| Renesas R1LV0128ES-70SI | 128K×8, 70 ns, SOIC-32, but rated only for commercial temp (0°C to +70°C); higher ISB2 (25 µA). | Not qualified for industrial environments; unsuitable for extended temperature deployments. | Select only for cost-sensitive, non-extended-temp consumer applications. |
Compared with IS62C128AL-70QLI and R1LV0128ES-70SI, the CY62128BLL-70SXC uniquely supports dual CE architecture and industrial temperature operation with lowest standby current (15 µA), making it optimal for ruggedized embedded systems requiring flexible memory mapping and low-power hold modes.
Availability
CY62128BLL-70SXC is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical data loggers, automotive body control modules, and legacy HMI controller upgrades requiring stable component supply and long-term obsolescence mitigation.
Supply support for CY62128BLL-70SXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable solutions for industrial, automotive, and computing markets.
The CY62128B MoBL® (Mobile Bus Logic) SRAM product line was designed for low-power, high-reliability embedded systems requiring deterministic timing, extended temperature operation, and pin-compatible legacy replacement capability.
FAQ
What is the minimum VCC required to retain data in CY62128BLL-70SXC?
Data retention is guaranteed down to VCC = 2.0 V (VDR), with retention current ≤15 µA under those conditions. This enables operation during brown-out events when primary supply dips but backup power remains above 2.0 V, preserving critical state information without external supervision.
Does CY62128BLL-70SXC require external pull-up resistors on control lines?
No external pull-ups are required: all control inputs (CE1, CE2, OE, WE) have internal weak pull-downs specified in the datasheet, and TTL-compatible thresholds ensure reliable logic levels with standard 5 V drive sources. External resistors may be added only for noise immunity in high-EMI environments.
Can CY62128BLL-70SXC be used in place of CY62128ELL-70SXC?
Yes-CY62128BLL-70SXC replaces the earlier CY62128ELL-70SXC with identical pinout, timing, and electrical specs. The "B" revision includes minor process enhancements and updated reliability testing but maintains full functional and mechanical compatibility for drop-in replacement in existing designs.
What is the maximum capacitive load supported on I/O pins during read operations?
The device is characterized for 100 pF total load capacitance (including PCB trace, scope probe, and connected device inputs) at 70 ns timing. Exceeding 100 pF increases tDOE and tHZOE delays beyond specification, potentially causing setup/hold violations in high-speed interfaces.
CY62128BLL-70SXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-SOIC (0.445", 11.30mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC
CY62128BLL-70SXC FAQ
1.How can I place an order for CY62128BLL-70SXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128BLL-70SXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128BLL-70SXC reliable?
The price and inventory of CY62128BLL-70SXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128BLL-70SXC is usually 5 days.
3.What payment methods are accepted for CY62128BLL-70SXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128BLL-70SXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128BLL-70SXC?
CY62128BLL-70SXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128BLL-70SXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128BLL-70SXC?
For technical support, including CY62128BLL-70SXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128BLL-70SXC requirements.
6.How does Aetrix verify that CY62128BLL-70SXC is sourced from the original manufacturer or authorized distributors?
All CY62128BLL-70SXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128BLL-70SXC meets industry standards.
7.What is the process for return or replacement of CY62128BLL-70SXC?
All CY62128BLL-70SXC units undergo pre-shipment inspection (PSI). If there is an issue with CY62128BLL-70SXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128BLL-70SXC part is unused and in its original packaging.
Return procedure for CY62128BLL-70SXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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