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Infineon Technologies CY62128BLL-70ZRXE
- Part No.:
- CY62128BLL-70ZRXE
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62128BLL-70ZRXE.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:3,054
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Product details
Overview
CY62128BLL-70ZRXE from Cypress Semiconductor is a 128K × 8 (131,072 × 8) CMOS static RAM in Reverse TSOP Type I package, rated for automotive operation (–40°C to +125°C), with 70 ns access time, 4.5–5.5 V supply, and automatic CE-based power-down reducing standby current to 25 µA max.
For engineers reviewing the CY62128BLL-70ZRXE datasheet, CY62128BLL-70ZRXE pinout, CY62128BLL-70ZRXE application, or CY62128BLL-70ZRXE equivalent, this device serves as a drop-in-compatible, low-power SRAM for automotive infotainment memory buffers, ADAS data logging, engine control unit (ECU) scratchpad, and telematics boot ROM expansion where extended temperature reliability and TTL/CMOS compatibility are required.
Technical Context
The CY62128BLL-70ZRXE implements dual chip enable logic (CE1 active LOW, CE2 active HIGH) enabling flexible memory banking and seamless expansion across multiple devices. Its three-state I/O drivers and automatic power-down on CE deassertion reduce system-level power by >75% during idle cycles.
It supports asynchronous read/write operations with guaranteed timing margins: tAA = 70 ns, tWC = 70 ns, tHZOE = 25 ns, and tPD = 70 ns - all validated under automotive voltage (4.5–5.5 V) and temperature (–40°C to +125°C) conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 131,072 × 8 bits - provides 128 KB of byte-addressable, non-volatile-retention-capable volatile storage |
| Access Time (tAA) | 70 ns max - ensures deterministic read latency for real-time ECU firmware execution |
| VCC Range | 4.5 V to 5.5 V - compatible with automotive 5 V rail tolerances including load dump transients |
| Standby Current (ISB2) | 25 µA max at –40°C to +125°C - enables ultra-low-power sleep mode in always-on vehicle modules |
| Operating Temperature | –40°C to +125°C - qualified per AEC-Q100 Grade 2 for under-hood and dashboard-mounted electronics |
| Output Drive | TTL-compatible VOH ≥ 2.4 V / VOL ≤ 0.4 V - ensures robust interfacing with legacy microcontrollers and FPGAs |
| Data Retention Voltage | VDR = 2.0 V min - allows memory state hold during brown-out or controlled power-down sequences |
Pinout & Package
Package: 32-lead Reverse TSOP Type I (ZR32), Pb-free, 8.9 mm × 12.1 mm body, 0.5 mm pitch, JEDEC MO-153 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word decoding; no external address latching required |
| I/O0–I/O7 | Bidirectional Data Lines | True three-state I/Os with simultaneous read/write direction control via OE and WE |
| CE1 | Active LOW Chip Enable | Primary selection signal; forces high-impedance I/O and power-down when HIGH |
| CE2 | Active HIGH Chip Enable | Secondary enable enabling banked memory architectures without external logic |
| OE | Active LOW Output Enable | Controls output driver enable independently of CE; allows read-before-write handshaking |
| WE | Active LOW Write Enable | Initiates write cycle only when CE1 = LOW, CE2 = HIGH, and WE = LOW - prevents accidental writes |
| VCC | Power Supply | 5 V nominal supply; decoupling capacitor placement critical near Pin 16 per layout guidelines |
| GND | Ground Reference | Common return path for all signals; Pin 15 designated as primary ground per TSOP pinout |
Key Features
| Feature | Design Value |
|---|---|
| Dual CE architecture (CE1/CE2) | Enables hierarchical memory mapping and eliminates need for external address decoder logic in multi-SRAM systems |
| Automatic CE power-down | Reduces ISB2 to 25 µA max without software intervention - critical for battery-backed automotive modules |
| TTL/CMOS input compatibility | VIH = 2.2 V min / VIL = 0.8 V max ensures reliable interfacing with both 5 V microcontrollers and mixed-signal ASICs |
| Reverse TSOP packaging | ZR32 footprint improves PCB routing density and thermal dissipation vs. standard TSOP in constrained automotive layouts |
| Data retention at 2.0 V | Supports graceful shutdown sequences and maintains RAM contents during ignition cycling or low-battery events |
Applications
| Automotive Instrument Cluster | ADAS Sensor Fusion Buffer |
|---|---|
|
Use Scenario: Real-time rendering of speed, RPM, and warning icons with dynamic refresh rates up to 60 Hz. IC Role / Device Role / Timing Role: Frame buffer SRAM holding rendered GUI tiles; accessed via parallel bus from MCU with 70 ns tAA timing margin. Use Value: Enables flicker-free display updates while maintaining <25 µA standby draw during vehicle sleep mode. |
Use Scenario: Aggregating raw camera, radar, and IMU data streams before fusion algorithm execution. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory buffering burst sensor data at up to 25 MB/s sustained rate. Use Value: Provides deterministic 70 ns read/write latency and automotive-grade thermal stability up to +125°C ambient. |
| Engine Control Unit (ECU) | Telematics Control Unit (TCU) |
|
Use Scenario: Storing runtime-calibrated lookup tables (e.g., fuel injection maps) and diagnostic fault logs. IC Role / Device Role / Timing Role: Nonvolatile-retention-capable working memory for calibration parameters; retains data down to 2.0 V VCC. Use Value: Eliminates need for external EEPROM backup during key-off events, reducing BOM count and failure points. |
Use Scenario: Caching GNSS position fixes, cellular modem firmware segments, and OTA update payloads. IC Role / Device Role / Timing Role: Boot-time RAM extension for ARM Cortex-A application processors requiring fast code fetch from parallel interface. Use Value: Reverse TSOP (ZR32) footprint simplifies high-density routing in compact TCU modules with strict EMI constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV12816AL-10TLI | 128K × 16 organization, 10 ns access, 3.3 V only, SOIC-44 package | Requires data bus width adaptation (16-bit vs. 8-bit); incompatible with 5 V systems and automotive temp range | Select only if migrating to 3.3 V architecture and wider data path; not drop-in replaceable |
| AS6C1008-70TIN | 128K × 8, 70 ns, 5 V, industrial temp (–40°C to +85°C), standard TSOP-I (Z32) | Lacks automotive qualification; standby current 15 µA (vs. 25 µA) but fails AEC-Q100 Grade 2 testing | Acceptable for non-safety-critical cabin modules; unsuitable for powertrain or ADAS due to temp and qualification gap |
Compared with IS61LV12816AL-10TLI and AS6C1008-70TIN, the CY62128BLL-70ZRXE uniquely delivers automotive-grade temperature operation, 5 V tolerance, and reverse TSOP packaging - making it the only option among the three qualified for under-hood ECU and safety-critical ADAS subsystems.
Availability
CY62128BLL-70ZRXE is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS sensor fusion units, engine control units, and telematics control units requiring stable component supply across extended temperature and long product lifecycles.
Supply support for CY62128BLL-70ZRXE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and consumer systems.
The CY62128B MoBL® family targets low-power, high-speed parallel SRAM applications in automotive electronics where extended temperature operation, data retention, and pin-compatible scalability are essential.
FAQ
Is CY62128BLL-70ZRXE pin-compatible with CY62128BLL-70ZI?
Yes - both use identical 32-pin TSOP Type I footprints, but CY62128BLL-70ZRXE uses the Reverse TSOP variant (ZR32) with mirrored pin 1 location and adjusted pad layout. Physical board rework is required; electrical functionality remains identical.
What is the maximum clock frequency supported for read/write cycles?
The CY62128BLL-70ZRXE is an asynchronous SRAM with no internal clock. Its maximum operational frequency is determined by tRC = 70 ns, supporting up to ~14.3 MHz sustained random access - verified under automotive voltage and temperature conditions.
Does this device require external pull-up resistors on control pins?
No - all control inputs (CE1, CE2, OE, WE) have TTL-compatible thresholds and internal noise immunity. Pull-ups are unnecessary unless system-level noise or open-bus conditions demand additional margin per board-level EMC requirements.
Can CY62128BLL-70ZRXE retain data during cold cranking (VCC = 2.0 V)?
Yes - the device guarantees data retention at VDR = 2.0 V minimum, with ICCDR ≤ 15 µA typical and ≤ 25 µA maximum across –40°C to +125°C, enabling reliable state hold during automotive battery sag events.
CY62128BLL-70ZRXE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP I
CY62128BLL-70ZRXE FAQ
1.How can I place an order for CY62128BLL-70ZRXE through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128BLL-70ZRXE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128BLL-70ZRXE reliable?
The price and inventory of CY62128BLL-70ZRXE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128BLL-70ZRXE is usually 5 days.
3.What payment methods are accepted for CY62128BLL-70ZRXE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128BLL-70ZRXE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128BLL-70ZRXE?
CY62128BLL-70ZRXE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128BLL-70ZRXE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128BLL-70ZRXE?
For technical support, including CY62128BLL-70ZRXE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128BLL-70ZRXE requirements.
6.How does Aetrix verify that CY62128BLL-70ZRXE is sourced from the original manufacturer or authorized distributors?
All CY62128BLL-70ZRXE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128BLL-70ZRXE meets industry standards.
7.What is the process for return or replacement of CY62128BLL-70ZRXE?
All CY62128BLL-70ZRXE units undergo pre-shipment inspection (PSI). If there is an issue with CY62128BLL-70ZRXE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128BLL-70ZRXE part is unused and in its original packaging.
Return procedure for CY62128BLL-70ZRXE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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