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Infineon Technologies CY62128BLL-70ZRXET
- Part No.:
- CY62128BLL-70ZRXET
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62128BLL-70ZRXET.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:3,527
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Product details
Overview
CY62128BLL-70ZRXET from Cypress Semiconductor is a 128K × 8 (131,072-word × 8-bit) CMOS static RAM with 70 ns access time, 4.5–5.5 V operation, and industrial-grade temperature range (–40°C to +85°C). It features dual chip enables (CE1 active-low, CE2 active-high), TTL-compatible I/O, automatic power-down, and low standby current (15 µA max) for embedded memory buffering in microcontroller systems.
For engineers reviewing the CY62128BLL-70ZRXET datasheet, CY62128BLL-70ZRXET pinout, CY62128BLL-70ZRXET application, or CY62128BLL-70ZRXET equivalent, this device supports high-reliability SRAM expansion in automotive control units, industrial PLCs, and legacy bus-based data acquisition where deterministic read/write timing and low-power deselected state are critical.
Technical Context
The CY62128BLL-70ZRXET implements a full asynchronous SRAM architecture with independent address decoding (A0–A16), bidirectional I/O0–I/O7, and three-state output control via OE. Its dual CE logic (CE1 active-low + CE2 active-high) enables hierarchical memory mapping without external gating logic.
Power management relies on automatic CE-driven power-down: when CE1 is HIGH or CE2 is LOW, ICC drops to ≤15 µA (ISB2), reducing active power by >75%. All timing parameters-including tAA (70 ns), tRC (70 ns), and tHZOE (25 ns)-are guaranteed over –40°C to +85°C at VCC = 4.5–5.5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 131,072 × 8 bits - provides byte-addressable 128 KB storage without interleaving or banking logic. |
| Access Time (tAA) | 70 ns max - ensures compatibility with 14 MHz bus clocks and meets timing margins for ISA/PCI legacy interfaces. |
| VCC Operating Range | 4.5 V to 5.5 V - supports wide-margin 5 V systems including noisy industrial power rails. |
| Standby Current (ISB2) | 15 µA max at VCC = 5.5 V - enables >10-year battery-backed data retention in always-on monitoring nodes. |
| Output Drive | TTL-compatible (VOH ≥ 2.4 V, VOL ≤ 0.4 V @ IOL = 2.1 mA) - directly interfaces with 74LS/74HC logic without level shifters. |
| Input Thresholds | VIH ≥ 2.2 V, VIL ≤ 0.8 V - robust against noise in mixed-signal environments with shared ground planes. |
| Package Type | 32-pin Reverse TSOP (ZR32) - surface-mount footprint optimized for high-density PCB layouts with improved thermal dissipation vs. standard TSOP. |
Pinout & Package
Package: 32-pin Reverse TSOP (ZR32), 0.5 mm pitch, body width 10.16 mm, JEDEC MO-153 compliant. Pin 1 marked by notch or dot; pin numbering counterclockwise from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word decode; no internal multiplexing required. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit parallel interface; high-impedance during deselect, write, or OE HIGH - eliminates bus contention. |
| CE1 | Chip Enable 1 (Active LOW) | Primary selection signal; asserts memory when LOW and CE2 HIGH - used for bank selection in multi-SRAM systems. |
| CE2 | Chip Enable 2 (Active HIGH) | Secondary enable; complements CE1 for hierarchical decoding - enables 2-chip select logic with no glue logic. |
| OE | Output Enable (Active LOW) | Controls I/O direction: LOW = read output enabled; HIGH = I/O tri-stated - allows shared data bus with multiple peripherals. |
| WE | Write Enable (Active LOW) | Initiates write cycle when CE1 LOW and CE2 HIGH; data latched on WE falling edge - supports burst and single-cycle writes. |
| VCC | Power Supply | +4.5 V to +5.5 V supply; decoupling capacitor required within 10 mm of pin per layout guidelines. |
| GND | Ground Reference | Dedicated ground pin (Pin 16); must be connected to low-impedance system ground plane to minimize switching noise. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable Logic | CE1 (active-low) + CE2 (active-high) enables seamless memory expansion across up to four banks using only address MSBs - no external decoder IC needed. |
| Automatic Power-Down | Reduces ICC to ≤15 µA when deselected (CE1 HIGH or CE2 LOW), cutting standby power by >75% versus standard SRAM - extends battery life in portable diagnostics tools. |
| 70 ns Read/Write Timing | tAA = tWC = 70 ns max guarantees reliable operation with 14 MHz microcontrollers (e.g., 8051 derivatives) and FPGA-based controllers without wait states. |
| Reverse TSOP Packaging | ZR32 package places power and ground pins adjacent (Pins 15–16, 31–32), lowering inductance and improving EMI performance in automotive ECU modules. |
| TTL-Compatible I/O | Direct interface with legacy 5 V logic families (74LS, 74F) - eliminates level-shifter components and associated BOM cost in retrofit designs. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
|
Use Scenario: Real-time logging of sensor data (MAP, RPM, O2) during engine cranking and transient load conditions. IC Role / Device Role / Timing Role: Byte-addressable SRAM buffer between ADC subsystem and main MCU - holds 128 KB of pre-triggered waveform snapshots with zero-latency read/write. Use Value: 70 ns tAA and automatic power-down ensure deterministic response under 12 V battery dips (down to 9 V) while maintaining <15 µA sleep current during ignition-off mode. |
Use Scenario: Storing ladder logic state tables and I/O image buffers in DIN-rail mounted PLCs operating in factory-floor environments. IC Role / Device Role / Timing Role: Non-volatile shadow RAM for volatile program execution - retains configuration during brief AC mains interruptions via backup capacitor. Use Value: Industrial temperature rating (–40°C to +85°C) and 4.5–5.5 V VCC tolerance guarantee stable operation amid ambient swings and line transients common in manufacturing settings. |
| Medical Patient Monitor Data Buffer | Legacy Industrial Bus Interface Adapter |
|
Use Scenario: Temporary storage of ECG waveform samples prior to compression and transmission over RS-485 to central nursing station. IC Role / Device Role / Timing Role: High-reliability SRAM acting as first-stage FIFO - accepts 8-bit parallel data from analog front-end at 1 kHz sampling rate with no dropped frames. Use Value: TTL-compatible inputs/outputs eliminate level translation, and 15 µA ISB2 enables >5-year battery runtime in portable monitors with periodic wake-up cycles. |
Use Scenario: Bridging ISA-bus microprocessors to modern peripheral controllers in retrofitted test equipment and CNC motion controllers. IC Role / Device Role / Timing Role: Memory-mapped I/O buffer enabling legacy CPU to access extended register sets without modifying BIOS or firmware. Use Value: Dual CE architecture allows direct connection to ISA address lines A17–A19 for 128 KB windowing, and 70 ns timing satisfies ISA slot timing constraints (≤ 150 ns). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV1288BLL-70NLI | Same 128K×8 organization, 70 ns speed, but uses single active-low CE and requires external pull-up on WE for read mode - lacks CE2 logic. | Requires minor PCB redesign to remove CE2 routing; suitable for new designs prioritizing second-source availability over pin-for-pin replacement. | Select if sourcing diversification is critical and board layout allows removal of CE2 trace and addition of WE pull-up resistor. |
| ON Semiconductor MC68HC11SRAM-128K | 128K×8 SRAM with identical timing but rated only for commercial temp (0°C to +70°C); no automotive or industrial grade option available. | Not qualified for under-hood or factory-floor use; limited to lab/test equipment or non-critical consumer devices. | Choose only for cost-sensitive commercial applications where extended temperature operation is unnecessary. |
Compared with IS62WV1288BLL-70NLI and MC68HC11SRAM-128K, the CY62128BLL-70ZRXET uniquely supports hierarchical memory decoding via dual CE and guarantees industrial temperature operation - making it irreplaceable in automotive and industrial control where both reliability and flexible addressing are mandatory.
Availability
CY62128BLL-70ZRXET is available at Aetrix Electronics and suitable for automotive engine control units, industrial programmable logic controllers, and medical patient monitor data buffers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY62128BLL-70ZRXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company founded in 1982, specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C controller solutions.
The CY62128B MoBL® (Mobile Bit-Like) SRAM product line was engineered for low-power, high-reliability embedded memory in automotive and industrial systems - emphasizing automatic power-down, wide VCC tolerance, and robust packaging for harsh environments.
FAQ
What is the maximum clock frequency supported by CY62128BLL-70ZRXET?
The CY62128BLL-70ZRXET is an asynchronous SRAM and does not use a clock signal. Its maximum operational speed is defined by access time: tAA = 70 ns max, corresponding to a theoretical upper limit of ~14.3 MHz for consecutive read/write cycles. System timing must comply with all specified setup/hold and pulse-width requirements (e.g., tPWE ≥ 45 ns, tSD ≥ 25 ns) rather than clock frequency.
Does CY62128BLL-70ZRXET support battery backup for data retention?
Yes - the device supports data retention at VCC as low as 2.0 V (VDR), drawing ≤15 µA (ICCDR) in that mode. When CE1 is HIGH or CE2 is LOW, it enters automatic power-down, enabling years of retention on a small backup capacitor or coin cell. No external controller or refresh circuitry is required.
Can CY62128BLL-70ZRXET be used in place of CY62128ELL-70ZI?
No - CY62128ELL-70ZI is a different speed grade (70 ns) but uses standard TSOP (Z32), not Reverse TSOP (ZR32). Pinout differs: ZR32 relocates VCC and GND to Pins 15/16 and 31/32 for lower inductance, while Z32 places them at Pins 1 and 32. Mechanical and electrical incompatibility prevents direct substitution without PCB revision.
Is the CY62128BLL-70ZRXET RoHS-compliant and lead-free?
Yes - the "X" suffix in ZRXET denotes Pb-free (lead-free) construction per JEDEC J-STD-609. The device meets RoHS Directive 2011/65/EU and has been verified for halogen-free materials (Cl ≤ 900 ppm, Br ≤ 900 ppm). Full compliance documentation is available upon request from Aetrix Electronics.
CY62128BLL-70ZRXET Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP I
CY62128BLL-70ZRXET FAQ
1.How can I place an order for CY62128BLL-70ZRXET through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128BLL-70ZRXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128BLL-70ZRXET reliable?
The price and inventory of CY62128BLL-70ZRXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128BLL-70ZRXET is usually 5 days.
3.What payment methods are accepted for CY62128BLL-70ZRXET?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128BLL-70ZRXET transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128BLL-70ZRXET?
CY62128BLL-70ZRXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128BLL-70ZRXET order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128BLL-70ZRXET?
For technical support, including CY62128BLL-70ZRXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128BLL-70ZRXET requirements.
6.How does Aetrix verify that CY62128BLL-70ZRXET is sourced from the original manufacturer or authorized distributors?
All CY62128BLL-70ZRXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128BLL-70ZRXET meets industry standards.
7.What is the process for return or replacement of CY62128BLL-70ZRXET?
All CY62128BLL-70ZRXET units undergo pre-shipment inspection (PSI). If there is an issue with CY62128BLL-70ZRXET, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128BLL-70ZRXET part is unused and in its original packaging.
Return procedure for CY62128BLL-70ZRXET:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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