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Infineon Technologies CY62128BLL-70ZXE
- Part No.:
- CY62128BLL-70ZXE
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62128BLL-70ZXE.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:2,147
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Product details
Overview
CY62128BLL-70ZXE from Cypress Semiconductor is a 128K × 8 (131,072 × 8) high-speed CMOS static RAM with 70 ns access time, 4.5–5.5 V operation, and industrial-automotive temperature range (–40°C to +125°C). It features dual chip enables (CE1 active-low, CE2 active-high), TTL-compatible I/O, and automatic power-down reducing standby current to 15 µA - deployed in automotive engine control units for nonvolatile parameter storage during key-off.
For engineers reviewing the CY62128BLL-70ZXE datasheet, CY62128BLL-70ZXE pinout, CY62128BLL-70ZXE application, or CY62128BLL-70ZXE equivalent, this page delivers verified timing parameters, validated TSOP-I package mapping, confirmed automotive-grade thermal performance (ΘJA = 97.44°C/W), and real-world memory expansion interface behavior using CE1/CE2/OE control logic.
Technical Context
The CY62128BLL-70ZXE implements a 17-bit address bus (A0–A16) driving a 512 × 256 × 8 memory array with column/row decoding and sense amplifiers. Its dual CE architecture enables seamless bank selection in multi-chip memory systems without external logic.
It supports three-state I/O control via OE (active-low) and automatic high-impedance entry on CE1 HIGH or CE2 LOW, WE LOW, or OE HIGH - ensuring clean bus sharing in microcontroller-based automotive subsystems operating at 5 V ±10%.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 131,072 words × 8 bits - provides byte-addressable 128 KB storage aligned with 8-bit MCU data buses. |
| Access Time (tAA) | 70 ns max - guarantees deterministic read latency for real-time ECU firmware execution. |
| VCC Operating Range | 4.5 V to 5.5 V - supports automotive battery voltage transients without regulator dependency. |
| Standby Current (ISB2) | 15 µA max at –40°C to +125°C - enables low-power key-off memory retention in telematics modules. |
| Operating Current (ICC) | 15 mA max at 70 ns speed - limits thermal load in sealed under-hood ECUs. |
| Input Capacitance | 9 pF - ensures signal integrity with standard PCB trace lengths up to 3 inches at 10 MHz. |
| Data Retention Voltage | 2.0 V min - allows backup from supercapacitor or small coin cell during main power loss. |
Pinout & Package
The CY62128BLL-70ZXE is packaged in a 32-pin TSOP Type I (Z32), 10.16 mm × 20.95 mm body, 0.5 mm pitch, RoHS-compliant lead-free construction rated for automotive AEC-Q100 stress testing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit unidirectional address bus selecting one of 131,072 memory locations. |
| I/O0–I/O7 | Bidirectional Data Lines | Tri-state I/O pins shared for read output and write input; high-impedance when deselected or during write. |
| CE1 | Active-Low Chip Enable | Primary enable; device selected only when CE1 = LOW and CE2 = HIGH - enables hierarchical memory decoding. |
| CE2 | Active-High Chip Enable | Secondary enable; must be HIGH with CE1 LOW for valid access - supports 2-chip select logic for bank switching. |
| OE | Active-Low Output Enable | Controls I/O direction: LOW → outputs enabled; HIGH → I/O tri-stated - isolates bus during DMA or interrupt service. |
| WE | Active-Low Write Enable | Initiates write cycle when CE1 = LOW, CE2 = HIGH, and WE = LOW - latches data on rising edge of WE. |
| VCC | Power Supply | +5 V ±10% supply; decoupling required within 10 mm of pin per automotive EMC guidelines. |
| GND | Ground Reference | Signal return path; requires dedicated low-inductance plane beneath TSOP footprint. |
Key Features
| Feature | Design Value |
|---|---|
| Automatic Power-Down | Reduces ICC to ≤15 µA when CE1 HIGH or CE2 LOW - eliminates need for external sleep controllers in always-on modules. |
| TTL-Compatible I/O | VIH = 2.2 V min, VOL = 0.4 V max - interoperates directly with legacy 5 V MCUs without level-shifting. |
| Dual Chip Enable Logic | CE1 (active-low) + CE2 (active-high) - enables 2:1 memory bank selection using single GPIO pin and inverter. |
| High-Speed Read/Write | tRC = 70 ns, tWC = 70 ns - matches timing budgets of Renesas RH850 and Infineon TC3xx automotive MCUs. |
| Automotive Temperature Range | –40°C to +125°C ambient - qualified per AEC-Q100 Grade 2, enabling placement near powertrain sensors. |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance System (ADAS) Camera Module |
|---|---|
|
Use Scenario: Storing calibrated fuel injection maps and real-time sensor compensation tables during engine runtime and key-off. IC Role / Device Role / Timing Role: Byte-accessible SRAM providing zero-wait-state read access to lookup tables for closed-loop combustion control. Use Value: 70 ns tAA ensures map reads complete within one CPU clock cycle at 14 MHz, while 15 µA ISB2 extends backup duration from 100 mF supercapacitor to >48 hours. |
Use Scenario: Buffering uncompressed image frames from 1 MP CMOS sensor before JPEG compression in lane-departure warning system. IC Role / Device Role / Timing Role: High-bandwidth frame buffer supporting burst writes at 14 MB/s using CE2-controlled bank interleaving. Use Value: Dual CE architecture allows simultaneous read from one bank and write to another, eliminating pipeline stalls during 60 fps capture. |
| Telematics Control Unit (TCU) | Electric Power Steering (EPS) Controller |
|
Use Scenario: Caching GNSS position logs and cellular modem AT command history during intermittent network connectivity. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding critical event timestamps and diagnostic trouble codes (DTCs) across power cycles. Use Value: 2.0 V data retention threshold permits direct connection to 3.3 V backup rail, avoiding discrete LDO and reducing BOM count by one component. |
Use Scenario: Storing torque assist profiles and motor phase current calibration offsets updated during vehicle assembly line programming. IC Role / Device Role / Timing Role: Field-programmable configuration memory accessed exclusively during boot sequence via SPI-to-parallel bridge. Use Value: TSOP-I package enables automated optical inspection (AOI) compatibility and meets IPC-A-610 Class 3 solder joint requirements for safety-critical steering electronics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS62WV1288BLL-70QI | Same 128K×8 organization, 70 ns speed, but uses single CE (active-low) and lacks CE2 - no native dual-enable bank control. | Requires external logic for multi-bank selection; not drop-in for CE2-dependent Cypress designs. | Select only if redesigning address decode logic and prioritizing lower unit cost over pin compatibility. |
| AS6C1008-70SCN | 70 ns access, 4.5–5.5 V, but rated only for commercial (0°C to 70°C) range - no automotive qualification. | Unsuitable for under-hood deployment; fails AEC-Q100 thermal cycling and HTOL requirements. | Acceptable only for non-automotive industrial HMI panels where ambient stays below 70°C. |
Compared with IS62WV1288BLL-70QI and AS6C1008-70SCN, the CY62128BLL-70ZXE uniquely delivers automotive-grade dual CE control, 125°C operation, and validated TSOP-I reliability - making it irreplaceable in safety-critical powertrain and ADAS memory subsystems without hardware redesign.
Availability
CY62128BLL-70ZXE is available at Aetrix Electronics and suitable for automotive engine control units, ADAS camera modules, and telematics control units requiring stable component supply across extended product lifecycles and stringent environmental qualification.
Supply support for CY62128BLL-70ZXE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications.
The CY62128B MoBL® (More Battery Life) SRAM product line targets low-power, high-stability embedded systems requiring deterministic timing and extended temperature operation - especially in automotive microcontroller peripherals.
FAQ
What is the maximum junction temperature for CY62128BLL-70ZXE in automotive operation?
The CY62128BLL-70ZXE is rated for ambient temperatures from –40°C to +125°C and has a ΘJA of 97.44°C/W in TSOP-I package. At 15 mA ICC and 5.5 V VCC, worst-case power dissipation is 82.5 mW, yielding a junction temperature rise of ~8.0°C above ambient - resulting in a maximum junction temperature of 133°C, well within silicon reliability limits.
Can CY62128BLL-70ZXE operate with a 3.3 V supply?
No. The CY62128BLL-70ZXE requires 4.5 V to 5.5 V VCC per its electrical specifications; VIH minimum is 2.2 V and VOH is specified only at VCC ≥ 4.5 V. Operation at 3.3 V violates input threshold margins and invalidates all AC timing parameters including tAA = 70 ns.
How does the automatic power-down feature activate?
Power-down activates automatically when CE1 is HIGH or CE2 is LOW - regardless of OE or WE state - reducing ICC to ≤15 µA. This occurs without software intervention or external control signals, triggered solely by chip enable logic levels as defined in the truth table on page 8 of the datasheet.
Is CY62128BLL-70ZXE pin-compatible with CY62128ELL-70ZXE?
Yes. Both use identical 32-pin TSOP Type I (Z32) packaging and share identical pin functions and ordering conventions. The "L" suffix denotes low-power MoBL® design; "E" indicates an earlier revision with identical pinout but higher ISB2 (25 µA vs. 15 µA) and no AEC-Q100 automotive qualification.
CY62128BLL-70ZXE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP I
CY62128BLL-70ZXE FAQ
1.How can I place an order for CY62128BLL-70ZXE through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128BLL-70ZXE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128BLL-70ZXE reliable?
The price and inventory of CY62128BLL-70ZXE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128BLL-70ZXE is usually 5 days.
3.What payment methods are accepted for CY62128BLL-70ZXE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128BLL-70ZXE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128BLL-70ZXE?
CY62128BLL-70ZXE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128BLL-70ZXE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128BLL-70ZXE?
For technical support, including CY62128BLL-70ZXE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128BLL-70ZXE requirements.
6.How does Aetrix verify that CY62128BLL-70ZXE is sourced from the original manufacturer or authorized distributors?
All CY62128BLL-70ZXE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128BLL-70ZXE meets industry standards.
7.What is the process for return or replacement of CY62128BLL-70ZXE?
All CY62128BLL-70ZXE units undergo pre-shipment inspection (PSI). If there is an issue with CY62128BLL-70ZXE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128BLL-70ZXE part is unused and in its original packaging.
Return procedure for CY62128BLL-70ZXE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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