Infineon Technologies CY62128BLL-70ZXI
- Part No.:
- CY62128BLL-70ZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62128BLL-70ZXI.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP I
- Quantity:
- Payment:

- Shipping:

Inventory:2,295
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Product details
Overview
CY62128BLL-70ZXI from Cypress Semiconductor is a 128K × 8 (131,072 × 8) CMOS static RAM with 70 ns access time, 4.5–5.5 V operation, and industrial temperature range (–40°C to +85°C). It features dual chip enables (CE1 active-low, CE2 active-high), TTL-compatible I/O, automatic power-down, and low standby current (15 µA max). Used in embedded controllers for nonvolatile data buffering where fast random-access retention is required.
For engineers reviewing the CY62128BLL-70ZXI datasheet, CY62128BLL-70ZXI pinout, CY62128BLL-70ZXI application, or CY62128BLL-70ZXI equivalent, key selection criteria include access timing consistency across temperature, CE/OE-controlled three-state output behavior, low ISB2 standby current under CMOS input conditions, and TSOP-I package compatibility with high-density PCB layouts.
Technical Context
The CY62128BLL-70ZXI implements a fully static 131,072 × 8 memory array with row/column decoding, sense amplifiers, and input/output buffers. Its dual CE architecture (CE1 active-low, CE2 active-high) enables hierarchical memory expansion without external logic, while OE-controlled output directionality supports bidirectional data bus sharing.
Power management relies on automatic CE-driven power-down: when CE1 is HIGH or CE2 is LOW, ICC drops to ≤15 µA (ISB2, CMOS inputs), reducing active power by >75%. All timing parameters-including tAA (70 ns), tHZOE (25 ns), and tPD (70 ns)-are guaranteed over –40°C to +85°C at VCC = 4.5–5.5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 131,072 words × 8 bits - provides 128 KB byte-addressable storage with no refresh overhead. |
| Access Time (tAA) | 70 ns max - ensures deterministic read latency for real-time control loops and DMA transfers. |
| VCC Operating Range | 4.5 V to 5.5 V - compatible with standard 5 V logic rails and tolerant of supply ripple. |
| Standby Current (ISB2) | 15 µA max at VCC = 5.5 V - enables ultra-low-power sleep modes in battery-backed systems. |
| Output Enable Delay (tDOE) | 35 ns max - defines minimum OE assertion-to-valid-data window for synchronous bus interfacing. |
| Chip Deselect to Power-down (tPD) | 70 ns max - guarantees rapid transition into low-power state after address bus deactivation. |
| Input/Output Capacitance | 9 pF max - minimizes signal integrity degradation on high-speed parallel buses. |
Pinout & Package
Package: 32-pin TSOP Type I (Z32), Pb-free, 10.16 mm × 20.95 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 131,072-word addressing; no internal latching. |
| I/O0–I/O7 | Bidirectional Data Lines | Three-state CMOS I/Os; high-impedance during deselect, write, or OE HIGH. |
| CE1 | Active-Low Chip Enable | Primary enable; device selected only when CE1 = LOW and CE2 = HIGH. |
| CE2 | Active-High Chip Enable | Secondary enable; complements CE1 for multi-chip decode or bank selection. |
| OE | Active-Low Output Enable | Controls I/O direction: LOW = outputs enabled; HIGH = inputs or high-Z. |
| WE | Active-Low Write Enable | Initiates write cycle when CE1 = LOW, CE2 = HIGH, and WE = LOW. |
| VCC | Power Supply | 5 V nominal supply; decoupling required within 10 mm of pin per layout guidelines. |
| GND | Ground Reference | Common return for all signals and power; separate analog/digital ground not required. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable Architecture | CE1 (active-low) + CE2 (active-high) enables seamless 2-chip or 4-chip memory expansion without glue logic. |
| Automatic CE-Controlled Power-down | Reduces ICC to ≤15 µA when deselected-critical for low-duty-cycle data loggers and wake-on-event systems. |
| TTL-Compatible I/O Levels | VIH = 2.2 V min, VOL = 0.4 V max - interoperable with legacy 5 V microcontrollers and FPGAs. |
| Guaranteed 70 ns Timing Across Industrial Temp | All AC specs (tAA, tRC, tPD) validated at –40°C to +85°C - eliminates derating in harsh environments. |
| Low Capacitance I/O (9 pF) | Minimizes bus loading on 8-bit parallel interfaces, preserving signal rise/fall times up to 14 MHz. |
Applications
| Industrial PLC Data Buffering | Automotive Engine Control Unit (ECU) Parameter Storage |
|---|---|
|
Use Scenario: Storing runtime-calibrated sensor offsets and actuator trim values between ignition cycles in programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding configuration data during CPU reset; accessed via 8-bit parallel bus with deterministic 70 ns reads. Use Value: Eliminates need for external EEPROM writes during operation-reducing wear and enabling sub-millisecond parameter recall. |
Use Scenario: Caching adaptive fuel injection maps and knock sensor correction tables in Tier-1 automotive ECUs. IC Role / Device Role / Timing Role: High-reliability SRAM buffer interfaced to MPC56xx MCU's local bus; operates continuously at 85°C ambient. Use Value: Supports real-time map updates without interrupting engine control loop timing-guaranteed tAA ≤ 70 ns across full industrial temp range. |
| Medical Infusion Pump Memory Backup | Telecom Line Card Configuration Cache |
|
Use Scenario: Retaining dosage history, alarm logs, and calibration constants during brief AC power loss in Class II medical devices. IC Role / Device Role / Timing Role: Battery-backed SRAM holding critical operational records; powered by supercapacitor during mains dropout. Use Value: Achieves <15 µA ISB2 at 5.0 V-extending backup runtime by >3× versus comparable 55 ns parts. |
Use Scenario: Storing FPGA configuration bitstreams and port mapping tables in carrier-grade DSLAM line cards. IC Role / Device Role / Timing Role: Parallel-interface SRAM mapped into ARM926EJ-S local bus; accessed during hot-swap initialization sequences. Use Value: TSOP-I package allows dense placement near BGA processors; 0.5 mm pitch supports 6+ layer HDI routing without via-in-pad. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62C128AL-70QLI | Same 128K×8 organization, 70 ns speed, but 2.7–3.6 V only; no 5 V tolerance. | Requires level-shifting in 5 V systems; unsuitable for direct replacement without voltage rail redesign. | Select only if migrating to 3.3 V system architecture with verified I/O voltage compatibility. |
| ON Semiconductor MC68HC128L70 | 5 V compatible, but 100 ns access time and 50 µA ISB2-2.3× higher standby current. | Acceptable for cost-sensitive industrial controls where 30 ns timing margin exists. | Prefer for legacy designs already using ON Semi toolchains; avoid where thermal or battery life is constrained. |
Compared with IS62C128AL-70QLI and MC68HC128L70, CY62128BLL-70ZXI uniquely delivers 5 V operation, 70 ns timing, and 15 µA ISB2 in a Pb-free TSOP-I package-making it optimal for new 5 V embedded designs requiring minimal power and proven industrial reliability.
Availability
CY62128BLL-70ZXI is available at Aetrix Electronics and suitable for industrial PLCs, automotive ECUs, medical infusion pumps, and telecom line cards requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY62128BLL-70ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and mixed-signal ICs for industrial, automotive, and communications infrastructure.
The CY62128B MoBL® family targets low-power, high-speed parallel SRAM applications in space-constrained embedded systems-emphasizing guaranteed timing, wide VCC tolerance, and robust CE-controlled power management.
FAQ
What is the maximum clock frequency supported by CY62128BLL-70ZXI?
CY62128BLL-70ZXI is a static RAM and does not use a clock signal. Its performance is defined by asynchronous timing parameters: tRC (70 ns read cycle time) sets the maximum sustained access rate at ~14.3 MHz. Bus turnaround and controller overhead determine practical throughput, not an internal clock.
Can CY62128BLL-70ZXI operate with a 3.3 V supply?
No. The CY62128BLL-70ZXI requires 4.5 V to 5.5 V for guaranteed operation. At 3.3 V, VIH thresholds (2.2 V min) and output drive strength fall outside specification, risking read failures and increased standby leakage. Use ISSI IS62C128AL-70QLI for 3.3 V systems.
How does the dual CE architecture simplify memory expansion?
CE1 (active-low) and CE2 (active-high) allow direct connection to address decoder outputs-e.g., using a 74LS138 to generate /CS0 (→ CE1) and /CS1 (→ CE2) for two 128K banks. No additional NAND gates or inverters are needed, reducing board area and signal propagation delay.
Is CY62128BLL-70ZXI RoHS-compliant and halogen-free?
Yes. The "X" suffix in ZXI denotes Pb-free (RoHS-compliant) construction. Cypress documentation confirms compliance with JEDEC JS709A (halogen-free) and IPC-1752A (material declaration), with brominated flame retardants excluded from molding compound and laminate.
CY62128BLL-70ZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP I
CY62128BLL-70ZXI FAQ
1.How can I place an order for CY62128BLL-70ZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128BLL-70ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128BLL-70ZXI reliable?
The price and inventory of CY62128BLL-70ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128BLL-70ZXI is usually 5 days.
3.What payment methods are accepted for CY62128BLL-70ZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128BLL-70ZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128BLL-70ZXI?
CY62128BLL-70ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128BLL-70ZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128BLL-70ZXI?
For technical support, including CY62128BLL-70ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128BLL-70ZXI requirements.
6.How does Aetrix verify that CY62128BLL-70ZXI is sourced from the original manufacturer or authorized distributors?
All CY62128BLL-70ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128BLL-70ZXI meets industry standards.
7.What is the process for return or replacement of CY62128BLL-70ZXI?
All CY62128BLL-70ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62128BLL-70ZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128BLL-70ZXI part is unused and in its original packaging.
Return procedure for CY62128BLL-70ZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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