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Infineon Technologies CY62128BNLL-55SXI
- Part No.:
- CY62128BNLL-55SXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.445", 11.30mm Width)
- Datasheet:
-
CY62128BNLL-55SXI.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,192
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Product details
Overview
CY62128BNLL-55SXI from Cypress Semiconductor is a 1-Mbit (128K × 8) low-power CMOS static RAM with 55 ns access time, 4.5–5.5 V operation, industrial temperature range (–40°C to +85°C), and Pb-free 32-pin SOIC packaging. It supports automatic power-down, TTL-compatible I/O, and dual chip enable (CE1 active-low, CE2 active-high) for flexible memory expansion in embedded controllers and data acquisition systems.
For engineers reviewing the CY62128BNLL-55SXI datasheet, CY62128BNLL-55SXI pinout, CY62128BNLL-55SXI application, or CY62128BNLL-55SXI equivalent, key selection criteria include its 55 ns read cycle time, 2.5–15 µA standby current (ISB2), tri-state I/O control via OE/WE/CE signals, and compatibility with legacy 5 V bus architectures requiring deterministic timing and low leakage.
Technical Context
The CY62128BNLL-55SXI implements a fully static 128K × 8 memory array with asynchronous parallel interface logic. Its dual CE architecture enables seamless bank selection in multi-chip configurations without external gating, while automatic CE-driven power-down reduces ICC to ≤2.5 µA when deselected under CMOS input conditions.
Read operations require CE1 = LOW, CE2 = HIGH, and OE = LOW with WE = HIGH; write operations require CE1 = LOW, CE2 = HIGH, and WE = LOW. All eight I/O pins (I/O0–I/O7) enter high-impedance state during deselect, output disable, or write - ensuring clean bus sharing in shared-data-path systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 128K × 8 bits (1 Mbit); supports byte-wide data transfers without address multiplexing or external latching. |
| Access Time | 55 ns max (tAA, tRC); guarantees deterministic read latency for real-time firmware execution and buffer management. |
| VCC Range | 4.5 V to 5.5 V; compatible with standard 5 V supply rails and tolerant of ±10% regulation variation. |
| Standby Current | 2.5 µA typ., 15 µA max (ISB2, CMOS inputs); enables ultra-low-power sleep modes in battery-backed or energy-constrained systems. |
| Operating Temp | –40°C to +85°C (Industrial grade); qualified for deployment in industrial PLCs, motor drives, and outdoor telemetry hardware. |
| I/O Interface | TTL-compatible inputs/outputs; eliminates level-shifting requirements when interfacing with legacy microcontrollers and FPGAs. |
| Power-down Trigger | Automatic on CE1 HIGH or CE2 LOW; requires no software intervention or external control logic to enter low-leakage state. |
Pinout & Package
Package: 32-pin SOIC (450 mil width), Pb-free, RoHS-compliant. Pin pitch: 1.27 mm; body width: 10.16 mm; JEDEC MS-012AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word addressing; no internal address latching required. |
| I/O0–I/O7 | Bidirectional Data Lines | Tri-state controlled by OE/CE/WE; shares pins for read and write, reducing PCB trace count and package pin count. |
| CE1 | Chip Enable 1 (Active LOW) | Primary chip select; assertion initiates all internal timing sequences including power-up and access cycles. |
| CE2 | Chip Enable 2 (Active HIGH) | Secondary enable enabling hierarchical memory mapping; allows OR/NAND decoding for multi-bank systems. |
| OE | Output Enable (Active LOW) | Controls I/O direction only; does not affect internal memory state or power mode - safe for partial-bus reads. |
| WE | Write Enable (Active LOW) | Asserted with CE1/CE2 to initiate write; deasserted to enable read - prevents accidental writes during bus contention. |
| VCC | Power Supply | Single 5 V supply; no separate I/O or core voltage rails - simplifies power delivery design. |
| GND | Ground Reference | Dedicated ground pin; decoupling recommended within 10 mm of VCC pin per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Low-Power Architecture | Reduces active power to 82.5 mW max (15 mA ICC) and standby to 110 µW max (15 µA ISB2), extending runtime in always-on systems. |
| Dual Chip Enable Logic | Enables direct connection to 3-to-8 decoders or FPGA address decode logic without glue logic, supporting up to 8× memory banks. |
| Automatic Power-Down | Enters sub-µA retention mode within 55 ns of CE deassertion (tPD), eliminating need for explicit sleep commands in firmware. |
| High-Noise Immunity | Input thresholds VIH ≥ 2.2 V and VIL ≤ 0.8 V ensure reliable operation in electrically noisy industrial environments with >400 mV noise margin. |
| Data Retention at 2.0 V | Maintains stored data down to VCC = 2.0 V (VDR), supporting graceful shutdown and brown-out recovery without external backup capacitors. |
Applications
| Industrial PLC Memory Buffer | Automotive Engine Control Unit (ECU) |
|---|---|
|
Use Scenario: Real-time I/O scan buffering in programmable logic controllers with deterministic 10 ms cycle times. IC Role / Device Role / Timing Role: Byte-accessible scratchpad RAM holding input/output image tables and intermediate calculation results. Use Value: 55 ns access ensures full 128K buffer read/write completes within one CPU instruction cycle on 20 MHz MCUs, eliminating wait states. |
Use Scenario: Storing calibrated sensor lookup tables and transient fault logs in engine management systems operating across –40°C to +85°C. IC Role / Device Role / Timing Role: Non-volatile shadow RAM backed by external EEPROM; retains critical calibration data during ignition cycling. Use Value: Industrial-grade temperature rating and 2.0 V data retention allow operation during cold cranking (battery dip to 6 V) without data loss. |
| Medical Patient Monitor Data Cache | Network Router Packet Buffer |
|
Use Scenario: Temporary storage of waveform samples (ECG, SpO₂) prior to compression and transmission in Class II medical devices. IC Role / Device Role / Timing Role: High-reliability SRAM buffer isolating analog front-end from packetized network stack processing. Use Value: TTL compatibility and zero-cycle bus turnaround enable direct connection to 8-bit microcontroller data buses without timing glue logic. |
Use Scenario: Shared memory for packet descriptor management and small-frame buffering in low-cost residential Ethernet switches. IC Role / Device Role / Timing Role: Dual-port accessible via CPU and DMA controller using CE1/CE2 for bank arbitration. Use Value: Dual CE architecture permits concurrent CPU read and DMA write access with no external arbitration logic, reducing BOM cost. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62C1024AL-55QLI | Same 128K × 8 organization, 55 ns speed, but uses single CE (active-low only); higher ISB2 (30 µA max). | Lacks CE2 for hierarchical decode; less suitable for multi-bank systems requiring fine-grained enable control. | Select when board space is constrained and only one CE signal is available; verify standby current budget allows +100% increase. |
| ON Semiconductor MC68HC11E9CP | Integrated MCU with 512-byte on-chip RAM; no external parallel SRAM interface - incompatible pinout and protocol. | Not a drop-in replacement; requires complete firmware and PCB redesign to use internal RAM instead of external memory. | Only consider for greenfield designs where replacing discrete SRAM with integrated MCU RAM reduces total component count. |
Compared with IS62C1024AL-55QLI, CY62128BNLL-55SXI offers lower standby current and dual CE flexibility; versus MC68HC11E9CP, it provides dedicated, deterministic-access external memory without compromising MCU resource allocation.
Availability
CY62128BNLL-55SXI is available at Aetrix Electronics and suitable for industrial automation, automotive ECU subsystems, and medical data acquisition systems requiring stable component supply, long-term lifecycle support, and Pb-free compliance.
Supply support for CY62128BNLL-55SXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable solutions for industrial, automotive, and consumer applications.
The CY62128BN series belongs to Cypress's MoBL® (Mobile Bus Logic) SRAM product line, designed specifically for low-power, high-reliability embedded systems requiring fast, deterministic parallel memory access without dynamic refresh overhead.
FAQ
Is CY62128BNLL-55SXI pin-compatible with CY62128BNLL-70SXI?
Yes - both share identical 32-pin SOIC footprint, pin assignments, and electrical signaling. The only difference is access speed: -55SXI guarantees 55 ns max tAA/tRC, while -70SXI guarantees 70 ns. Firmware and PCB layouts are fully interchangeable, though timing-critical systems must validate setup/hold margins with the slower variant.
Does CY62128BNLL-55SXI support battery backup operation?
Yes - it retains data at VCC = 2.0 V (VDR) with ICCDR ≤15 µA (industrial grade), enabling direct connection to coin-cell batteries or supercapacitors for non-volatile storage during main power loss. No external power-fail detection circuitry is required for basic retention.
Can CE1 and CE2 be tied together for single-enable operation?
Yes - connect CE2 to VCC and drive CE1 as the sole chip enable. This configures the device as a standard single-CE SRAM. OE and WE retain full functionality; all timing parameters remain valid per the -55SXI specification table under "Commercial/Industrial" conditions.
What is the maximum clock frequency supported for burst reads?
CY62128BNLL-55SXI is an asynchronous SRAM and has no clock input. Burst reads are governed by tRC (55 ns min cycle time), allowing up to ~18.2 MHz sustained read throughput (1 / 55 ns). Address changes must meet tAA (55 ns) and tOHA (5 ns) constraints - no internal clock limits apply.
CY62128BNLL-55SXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-SOIC (0.445", 11.30mm Width)
- Packaging:
- -
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC
CY62128BNLL-55SXI FAQ
1.How can I place an order for CY62128BNLL-55SXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128BNLL-55SXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128BNLL-55SXI reliable?
The price and inventory of CY62128BNLL-55SXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128BNLL-55SXI is usually 5 days.
3.What payment methods are accepted for CY62128BNLL-55SXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128BNLL-55SXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128BNLL-55SXI?
CY62128BNLL-55SXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128BNLL-55SXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128BNLL-55SXI?
For technical support, including CY62128BNLL-55SXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128BNLL-55SXI requirements.
6.How does Aetrix verify that CY62128BNLL-55SXI is sourced from the original manufacturer or authorized distributors?
All CY62128BNLL-55SXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128BNLL-55SXI meets industry standards.
7.What is the process for return or replacement of CY62128BNLL-55SXI?
All CY62128BNLL-55SXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62128BNLL-55SXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128BNLL-55SXI part is unused and in its original packaging.
Return procedure for CY62128BNLL-55SXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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