My Inquiry
My Account
Infineon Technologies CY62128BNLL-55ZXI
- Part No.:
- CY62128BNLL-55ZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62128BNLL-55ZXI.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:2,701
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62128BNLL-55ZXI from Cypress Semiconductor is a 1-Mbit (128K × 8) low-power CMOS static RAM in Pb-free 32-pin TSOP-I package, operating at 4.5–5.5 V with 55 ns access time, 82.5 mW max active power, and 110 µW max standby power. It supports industrial temperature range (–40°C to +85°C) and features dual chip enables (CE1 active-low, CE2 active-high), tri-state I/Os, and automatic power-down for embedded control and data buffering.
For engineers reviewing the CY62128BNLL-55ZXI datasheet, CY62128BNLL-55ZXI pinout, CY62128BNLL-55ZXI application, or CY62128BNLL-55ZXI equivalent, key selection criteria include its 55 ns read cycle time, 2.5–15 µA ISB2 standby current under CMOS input conditions, TTL-compatible interface, and support for memory expansion via CE1/CE2/OE logic.
Technical Context
The CY62128BNLL-55ZXI implements a full CMOS 128K × 8 SRAM array with independent row/column decoding, sense amplifiers, and input buffers. Its dual-chip-enable architecture allows seamless bank selection in multi-chip memory systems without external logic.
Power management is handled through automatic CE-driven power-down: when CE1 is HIGH or CE2 is LOW, ICC drops to ≤15 µA (ISB2), reducing consumption by >75% versus active mode. All I/O pins enter high-impedance state during deselect, OE HIGH, or write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K words × 8 bits - provides 1 Mbit of non-volatile-retentive, byte-accessible storage without refresh circuitry |
| Access Time (tAA) | 55 ns max - guarantees data valid within 55 ns after address stabilization, enabling 18.2 MHz bus operation |
| VCC Range | 4.5 V to 5.5 V - compatible with standard 5 V TTL/CMOS systems and tolerant of ±10% supply variation |
| Active Current (ICC) | 20 mA max - limits thermal load and PCB trace sizing requirements in continuous-read scenarios |
| Standby Current (ISB2) | 15 µA max - enables ultra-low-power hold mode during processor sleep or system idle states |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade reliability in factory automation and motor control environments |
| Package | 32-pin TSOP-I (Type I), 10.16 mm × 20.95 mm - surface-mount footprint optimized for high-density PCB layouts |
Pinout & Package
Package: 32-pin Thin Small Outline Package (TSOP-I), Pb-free, 10.16 mm × 20.95 mm body, 0.5 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word addressing; no internal latching - requires stable address during CE1/CE2/OE assertion |
| I/O0–I/O7 | Bi-directional Data Bus | 8-bit multiplexed data path; tri-stated automatically on CE1 HIGH, CE2 LOW, OE HIGH, or WE LOW |
| CE1 | Chip Enable 1 | Active-low primary enable; device selected only when CE1 = LOW AND CE2 = HIGH - enables hierarchical memory decoding |
| CE2 | Chip Enable 2 | Active-high secondary enable; complements CE1 for 2-input decode logic and eliminates need for external inverters |
| OE | Output Enable | Active-low control of output drivers; HIGH forces I/Os into high-Z regardless of CE state - essential for bus sharing |
| WE | Write Enable | Active-low write strobe; initiates write when CE1 = LOW, CE2 = HIGH, and WE transitions LOW - defines write cycle timing window |
| VCC | Power Supply | +4.5 V to +5.5 V core supply; decoupling capacitor (0.1 µF) required within 10 mm of pin per layout guidelines |
| GND | Ground Reference | Signal and power ground return; must be connected to low-impedance plane to maintain noise margin and timing integrity |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable (CE1/CE2) | Enables direct connection to 2-bit address decoder outputs (e.g., A17/A18), eliminating glue logic for memory banking |
| Automatic Power-down | Reduces ICC to ≤15 µA when deselected - cuts system standby power by >75% without software intervention or external control |
| TTL-Compatible I/O | VIH = 2.2 V min, VOL = 0.4 V max - ensures interoperability with legacy 5 V microcontrollers and FPGAs without level shifters |
| Tri-State Output Control | Three independent disable conditions (CE, OE, WE) guarantee bus contention avoidance in shared-data-bus architectures |
| Pb-Free TSOP-I Package | RoHS-compliant 32-pin TSOP-I footprint - matches industry-standard socketing and reflow profiles for automated assembly |
Applications
| Industrial PLC Data Buffer | Automotive Engine Control Unit (ECU) |
|---|---|
|
Use Scenario: Temporary storage of sensor sampling results and control algorithm intermediate values between MCU clock cycles. IC Role / Device Role / Timing Role: Byte-addressable, non-refreshing SRAM serving as fast scratchpad memory for real-time deterministic processing. Use Value: 55 ns tAA ensures sub-microsecond data access latency, critical for closed-loop control loops running at ≥10 kHz update rates. |
Use Scenario: Storing calibration tables, fault logs, and transient engine parameters during vehicle ignition cycles and runtime. IC Role / Device Role / Timing Role: Industrial-temperature-rated SRAM providing reliable data retention across –40°C to +85°C ambient extremes. Use Value: 15 µA ISB2 standby current enables persistent logging during key-off periods without draining battery below safe thresholds. |
| Medical Diagnostic Imaging Buffer | Network Router Packet Buffer |
|
Use Scenario: Holding digitized ultrasound frame segments during preprocessing before DMA transfer to main memory. IC Role / Device Role / Timing Role: High-speed parallel SRAM interfaced directly to ADC output bus and FPGA fabric for zero-wait-state capture. Use Value: Tri-state I/Os synchronized to CE1/CE2/OE allow clean handoff between acquisition and processing phases without bus contention. |
Use Scenario: Acting as first-level packet buffer between PHY layer and switching ASIC in Layer 2 Ethernet edge routers. IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory supporting concurrent read/write operations via separate CE/OE/WE controls. Use Value: Dual CE architecture permits interleaved access across multiple SRAM banks, increasing effective throughput beyond single-device bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62C1024AL-55QLI | Same 128K × 8 organization, 55 ns speed, but uses single CE (active-low) and lacks CE2; 32-pin SOIC only | Requires external inverter for dual-CE decode; not pin-compatible due to different pinout and absence of CE2 | Select if board space allows SOIC and system design uses simple CE gating without hierarchical bank selection |
| ON Semiconductor MC68HC11E9CP | Not an SRAM - microcontroller with integrated 512-byte RAM; no external memory interface or 128K capacity | Cannot substitute as standalone memory; serves entirely different system role (processing + minimal on-die RAM) | Reject as functional alternative - mismatched device class and insufficient memory size for this use case |
Compared with IS62C1024AL-55QLI, CY62128BNLL-55ZXI offers native dual-CE decode and TSOP-I packaging for higher density, while MC68HC11E9CP is not a memory component and cannot fulfill the 1-Mbit external SRAM requirement.
Availability
CY62128BNLL-55ZXI is available at Aetrix Electronics and suitable for industrial automation, automotive ECU subsystems, and medical imaging equipment requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for CY62128BNLL-55ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets.
The CY62128BN series delivers MoBL® (Mobile Binary Logic) low-power SRAMs optimized for battery-sensitive and thermally constrained embedded systems requiring fast, deterministic, and drop-in memory expansion.
FAQ
Is CY62128BNLL-55ZXI pin-compatible with CY62128BNLL-70ZXI?
Yes - both share identical 32-pin TSOP-I pinout, signal assignments, and power/ground locations. The only difference is access time: -55ZXI guarantees 55 ns max tAA/tRC, while -70ZXI guarantees 70 ns. No PCB redesign is needed when upgrading speed grade.
Does CY62128BNLL-55ZXI require an external clock signal?
No - it is an asynchronous static RAM with no clock input. All operations are controlled by edge- and level-sensitive control signals (CE1, CE2, OE, WE) and address stability. Timing is governed solely by setup/hold and access specifications in the datasheet.
Can CY62128BNLL-55ZXI operate at 3.3 V?
No - its absolute maximum VCC rating is 5.5 V, but minimum operating voltage is 4.5 V. It is not specified or characterized for 3.3 V operation. For 3.3 V systems, consider Cypress's CY62128EV or compatible low-voltage SRAMs.
What is the data retention capability when VCC drops below operating range?
At VCC = 2.0 V, CY62128BNLL-55ZXI retains data with ICCDR ≤15 µA (industrial temp). Retention time is indefinite as long as VCC ≥2.0 V and temperature remains within spec - no tCDR delay is required to enter retention mode.
CY62128BNLL-55ZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-TFSOP (0.724", 18.40mm Width)
- Packaging:
- -
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP I
CY62128BNLL-55ZXI FAQ
1.How can I place an order for CY62128BNLL-55ZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128BNLL-55ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128BNLL-55ZXI reliable?
The price and inventory of CY62128BNLL-55ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128BNLL-55ZXI is usually 5 days.
3.What payment methods are accepted for CY62128BNLL-55ZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128BNLL-55ZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128BNLL-55ZXI?
CY62128BNLL-55ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128BNLL-55ZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128BNLL-55ZXI?
For technical support, including CY62128BNLL-55ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128BNLL-55ZXI requirements.
6.How does Aetrix verify that CY62128BNLL-55ZXI is sourced from the original manufacturer or authorized distributors?
All CY62128BNLL-55ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128BNLL-55ZXI meets industry standards.
7.What is the process for return or replacement of CY62128BNLL-55ZXI?
All CY62128BNLL-55ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62128BNLL-55ZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128BNLL-55ZXI part is unused and in its original packaging.
Return procedure for CY62128BNLL-55ZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62128BNLL-55ZXI Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
