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Infineon Technologies CY62128BNLL-55ZXI
- Part No.:
- CY62128BNLL-55ZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62128BNLL-55ZXI.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:2,701
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Product details
Overview
CY62128BNLL-55ZXI from Cypress Semiconductor is a 1-Mbit (128K × 8) low-power CMOS static RAM in Pb-free 32-pin TSOP-I package, operating at 4.5–5.5 V with 55 ns access time, 82.5 mW max active power, and 110 µW max standby power. It supports industrial temperature range (–40°C to +85°C) and features dual chip enables (CE1 active-low, CE2 active-high), tri-state I/Os, and automatic power-down for embedded control and data buffering.
For engineers reviewing the CY62128BNLL-55ZXI datasheet, CY62128BNLL-55ZXI pinout, CY62128BNLL-55ZXI application, or CY62128BNLL-55ZXI equivalent, key selection criteria include its 55 ns read cycle time, 2.5–15 µA ISB2 standby current under CMOS input conditions, TTL-compatible interface, and support for memory expansion via CE1/CE2/OE logic.
Technical Context
The CY62128BNLL-55ZXI implements a full CMOS 128K × 8 SRAM array with independent row/column decoding, sense amplifiers, and input buffers. Its dual-chip-enable architecture allows seamless bank selection in multi-chip memory systems without external logic.
Power management is handled through automatic CE-driven power-down: when CE1 is HIGH or CE2 is LOW, ICC drops to ≤15 µA (ISB2), reducing consumption by >75% versus active mode. All I/O pins enter high-impedance state during deselect, OE HIGH, or write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K words × 8 bits - provides 1 Mbit of non-volatile-retentive, byte-accessible storage without refresh circuitry |
| Access Time (tAA) | 55 ns max - guarantees data valid within 55 ns after address stabilization, enabling 18.2 MHz bus operation |
| VCC Range | 4.5 V to 5.5 V - compatible with standard 5 V TTL/CMOS systems and tolerant of ±10% supply variation |
| Active Current (ICC) | 20 mA max - limits thermal load and PCB trace sizing requirements in continuous-read scenarios |
| Standby Current (ISB2) | 15 µA max - enables ultra-low-power hold mode during processor sleep or system idle states |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade reliability in factory automation and motor control environments |
| Package | 32-pin TSOP-I (Type I), 10.16 mm × 20.95 mm - surface-mount footprint optimized for high-density PCB layouts |
Pinout & Package
Package: 32-pin Thin Small Outline Package (TSOP-I), Pb-free, 10.16 mm × 20.95 mm body, 0.5 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word addressing; no internal latching - requires stable address during CE1/CE2/OE assertion |
| I/O0–I/O7 | Bi-directional Data Bus | 8-bit multiplexed data path; tri-stated automatically on CE1 HIGH, CE2 LOW, OE HIGH, or WE LOW |
| CE1 | Chip Enable 1 | Active-low primary enable; device selected only when CE1 = LOW AND CE2 = HIGH - enables hierarchical memory decoding |
| CE2 | Chip Enable 2 | Active-high secondary enable; complements CE1 for 2-input decode logic and eliminates need for external inverters |
| OE | Output Enable | Active-low control of output drivers; HIGH forces I/Os into high-Z regardless of CE state - essential for bus sharing |
| WE | Write Enable | Active-low write strobe; initiates write when CE1 = LOW, CE2 = HIGH, and WE transitions LOW - defines write cycle timing window |
| VCC | Power Supply | +4.5 V to +5.5 V core supply; decoupling capacitor (0.1 µF) required within 10 mm of pin per layout guidelines |
| GND | Ground Reference | Signal and power ground return; must be connected to low-impedance plane to maintain noise margin and timing integrity |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable (CE1/CE2) | Enables direct connection to 2-bit address decoder outputs (e.g., A17/A18), eliminating glue logic for memory banking |
| Automatic Power-down | Reduces ICC to ≤15 µA when deselected - cuts system standby power by >75% without software intervention or external control |
| TTL-Compatible I/O | VIH = 2.2 V min, VOL = 0.4 V max - ensures interoperability with legacy 5 V microcontrollers and FPGAs without level shifters |
| Tri-State Output Control | Three independent disable conditions (CE, OE, WE) guarantee bus contention avoidance in shared-data-bus architectures |
| Pb-Free TSOP-I Package | RoHS-compliant 32-pin TSOP-I footprint - matches industry-standard socketing and reflow profiles for automated assembly |
Applications
| Industrial PLC Data Buffer | Automotive Engine Control Unit (ECU) |
|---|---|
|
Use Scenario: Temporary storage of sensor sampling results and control algorithm intermediate values between MCU clock cycles. IC Role / Device Role / Timing Role: Byte-addressable, non-refreshing SRAM serving as fast scratchpad memory for real-time deterministic processing. Use Value: 55 ns tAA ensures sub-microsecond data access latency, critical for closed-loop control loops running at ≥10 kHz update rates. |
Use Scenario: Storing calibration tables, fault logs, and transient engine parameters during vehicle ignition cycles and runtime. IC Role / Device Role / Timing Role: Industrial-temperature-rated SRAM providing reliable data retention across –40°C to +85°C ambient extremes. Use Value: 15 µA ISB2 standby current enables persistent logging during key-off periods without draining battery below safe thresholds. |
| Medical Diagnostic Imaging Buffer | Network Router Packet Buffer |
|
Use Scenario: Holding digitized ultrasound frame segments during preprocessing before DMA transfer to main memory. IC Role / Device Role / Timing Role: High-speed parallel SRAM interfaced directly to ADC output bus and FPGA fabric for zero-wait-state capture. Use Value: Tri-state I/Os synchronized to CE1/CE2/OE allow clean handoff between acquisition and processing phases without bus contention. |
Use Scenario: Acting as first-level packet buffer between PHY layer and switching ASIC in Layer 2 Ethernet edge routers. IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory supporting concurrent read/write operations via separate CE/OE/WE controls. Use Value: Dual CE architecture permits interleaved access across multiple SRAM banks, increasing effective throughput beyond single-device bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62C1024AL-55QLI | Same 128K × 8 organization, 55 ns speed, but uses single CE (active-low) and lacks CE2; 32-pin SOIC only | Requires external inverter for dual-CE decode; not pin-compatible due to different pinout and absence of CE2 | Select if board space allows SOIC and system design uses simple CE gating without hierarchical bank selection |
| ON Semiconductor MC68HC11E9CP | Not an SRAM - microcontroller with integrated 512-byte RAM; no external memory interface or 128K capacity | Cannot substitute as standalone memory; serves entirely different system role (processing + minimal on-die RAM) | Reject as functional alternative - mismatched device class and insufficient memory size for this use case |
Compared with IS62C1024AL-55QLI, CY62128BNLL-55ZXI offers native dual-CE decode and TSOP-I packaging for higher density, while MC68HC11E9CP is not a memory component and cannot fulfill the 1-Mbit external SRAM requirement.
Availability
CY62128BNLL-55ZXI is available at Aetrix Electronics and suitable for industrial automation, automotive ECU subsystems, and medical imaging equipment requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for CY62128BNLL-55ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets.
The CY62128BN series delivers MoBL® (Mobile Binary Logic) low-power SRAMs optimized for battery-sensitive and thermally constrained embedded systems requiring fast, deterministic, and drop-in memory expansion.
FAQ
Is CY62128BNLL-55ZXI pin-compatible with CY62128BNLL-70ZXI?
Yes - both share identical 32-pin TSOP-I pinout, signal assignments, and power/ground locations. The only difference is access time: -55ZXI guarantees 55 ns max tAA/tRC, while -70ZXI guarantees 70 ns. No PCB redesign is needed when upgrading speed grade.
Does CY62128BNLL-55ZXI require an external clock signal?
No - it is an asynchronous static RAM with no clock input. All operations are controlled by edge- and level-sensitive control signals (CE1, CE2, OE, WE) and address stability. Timing is governed solely by setup/hold and access specifications in the datasheet.
Can CY62128BNLL-55ZXI operate at 3.3 V?
No - its absolute maximum VCC rating is 5.5 V, but minimum operating voltage is 4.5 V. It is not specified or characterized for 3.3 V operation. For 3.3 V systems, consider Cypress's CY62128EV or compatible low-voltage SRAMs.
What is the data retention capability when VCC drops below operating range?
At VCC = 2.0 V, CY62128BNLL-55ZXI retains data with ICCDR ≤15 µA (industrial temp). Retention time is indefinite as long as VCC ≥2.0 V and temperature remains within spec - no tCDR delay is required to enter retention mode.
CY62128BNLL-55ZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-TFSOP (0.724", 18.40mm Width)
- Packaging:
- -
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP I
CY62128BNLL-55ZXI FAQ
1.How can I place an order for CY62128BNLL-55ZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128BNLL-55ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128BNLL-55ZXI reliable?
The price and inventory of CY62128BNLL-55ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128BNLL-55ZXI is usually 5 days.
3.What payment methods are accepted for CY62128BNLL-55ZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128BNLL-55ZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128BNLL-55ZXI?
CY62128BNLL-55ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128BNLL-55ZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128BNLL-55ZXI?
For technical support, including CY62128BNLL-55ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128BNLL-55ZXI requirements.
6.How does Aetrix verify that CY62128BNLL-55ZXI is sourced from the original manufacturer or authorized distributors?
All CY62128BNLL-55ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128BNLL-55ZXI meets industry standards.
7.What is the process for return or replacement of CY62128BNLL-55ZXI?
All CY62128BNLL-55ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62128BNLL-55ZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128BNLL-55ZXI part is unused and in its original packaging.
Return procedure for CY62128BNLL-55ZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62128BNLL-55ZXI Tags
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M24C02-WMN6TP
STMicroelectronics
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