Infineon Technologies CY62128BNLL-70SXAT
- Part No.:
- CY62128BNLL-70SXAT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.445", 11.30mm Width)
- Datasheet:
-
CY62128BNLL-70SXAT.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:3,914
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Product details
Overview
CY62128BNLL-70SXAT from Cypress Semiconductor is a 1-Mbit (128K × 8) low-power CMOS static RAM with 70 ns access time, 4.5–5.5 V operation, and industrial temperature range (–40°C to +85°C). It features dual chip enables (CE1 active-low, CE2 active-high), tri-state I/Os, automatic power-down, and TTL-compatible signaling. Used in embedded controllers, industrial PLCs, and legacy instrumentation requiring non-volatile SRAM retention during standby.
For engineers reviewing the CY62128BNLL-70SXAT datasheet, CY62128BNLL-70SXAT pinout, CY62128BNLL-70SXAT application, or CY62128BNLL-70SXAT equivalent, key selection criteria include its 70 ns read cycle time, 2.5 µA max standby current (ISB2), dual CE architecture for memory expansion, and Pb-free 32-pin SOIC package with 450-mil width.
Technical Context
The CY62128BNLL-70SXAT implements a full CMOS 128K × 8 asynchronous SRAM array with independent row/column decoding and sense amplifiers. Its dual CE interface (CE1 active-low, CE2 active-high) enables hierarchical memory mapping without external logic, while OE-controlled output enable allows clean bus sharing in multi-device systems.
Power management is handled via automatic CE-driven power-down: when CE1 is HIGH or CE2 is LOW, ICC drops to ≤2.5 µA (ISB2), reducing consumption by >75% versus active mode. All I/O pins enter high-impedance state during deselect, OE HIGH, or write cycles-ensuring signal integrity in shared-bus environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 128K words × 8 bits = 1 Mbit; supports byte-wide data paths without multiplexing. |
| Access Time | 70 ns max tAA; guarantees deterministic read latency for real-time control loops. |
| VCC Range | 4.5 V to 5.5 V; compatible with standard 5 V TTL/CMOS logic rails and brown-out tolerant. |
| Standby Current | 2.5 µA max ISB2 at VCC = 5.5 V; enables ultra-low-power hold mode in battery-backed systems. |
| Operating Temp | –40°C to +85°C; qualified for industrial environments including factory automation and motor drives. |
| Package | 32-pin SOIC (450 mil); industry-standard footprint with verified thermal resistance (ΘJA = 66.17°C/W). |
| Input Compatibility | TTL-compatible VIH/VIL thresholds (2.2 V / 0.8 V); interoperable with legacy 5 V microcontrollers and FPGAs. |
Pinout & Package
Package: 32-pin Small Outline Integrated Circuit (SOIC), 450 mil width, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word addressing; no address multiplexing required. |
| I/O0–I/O7 | Bidirectional Data Bus | Tri-state capable; functions as input during write, output during read, high-Z when deselected or OE HIGH. |
| CE1 | Active-Low Chip Enable | Primary selection signal; device enabled only when CE1 = LOW and CE2 = HIGH simultaneously. |
| CE2 | Active-High Chip Enable | Secondary enable; enables hierarchical decoding-e.g., bank selection in multi-SRAM systems. |
| OE | Active-Low Output Enable | Controls I/O direction: LOW → outputs enabled; HIGH → I/Os tri-stated for bus isolation. |
| WE | Active-Low Write Enable | Initiates write cycle when CE1 = LOW, CE2 = HIGH, and WE = LOW; no separate write strobe needed. |
| VCC | Power Supply | 4.5–5.5 V supply; decoupling capacitor required per JEDEC standards for noise immunity. |
| GND | Ground Reference | Common return path for all signals and power; must be low-inductance connection to minimize ground bounce. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable Interface | CE1 (active-low) + CE2 (active-high) enables seamless memory expansion up to 256K×8 using simple logic gates. |
| Automatic Power-Down | Reduces ICC to ≤2.5 µA when deselected-critical for battery-backed data logging and watchdog-safe systems. |
| 70 ns Read Cycle (tRC) | Guaranteed timing across full industrial temperature range; eliminates need for wait-state insertion in 20 MHz CPU designs. |
| TTL-Compatible I/O | VIH = 2.2 V min, VIL = 0.8 V max-ensures reliable interfacing with legacy 8051, Z80, and FPGA I/O banks. |
| Pb-Free SOIC Packaging | RoHS-compliant 32-pin SOIC (450 mil) with JEDEC-standard footprint-drop-in replacement for leaded equivalents. |
Applications
| Industrial PLC Data Buffers | Legacy Embedded Controller Memory |
|---|---|
Use Scenario: Real-time I/O scanning and register mapping in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Primary working RAM for ladder logic execution and status register storage; accessed synchronously with 20–50 µs cycle windows. Use Value: 70 ns tAA ensures zero wait states for 20 MHz microcontrollers; low ISB2 extends backup battery life beyond 10 years in unpowered mode. | Use Scenario: Main program/data memory in 8-bit/16-bit microcontroller-based medical devices (e.g., infusion pump controllers). IC Role / Device Role / Timing Role: Non-critical volatile RAM holding runtime variables, calibration tables, and temporary buffers during active operation. Use Value: Dual CE architecture simplifies memory map partitioning between firmware and application code space; TTL compatibility avoids level-shifter design overhead. |
| Automotive Body Control Modules | Test & Measurement Equipment Buffers |
Use Scenario: Storing sensor fusion results and actuator command history in body control units operating across –40°C to +85°C ambient. IC Role / Device Role / Timing Role: Local SRAM for CAN message buffering and diagnostic log storage; retains data during ignition-off periods via backup supply. Use Value: Industrial-grade temp rating and 2.0 V data retention voltage (VDR) support extended hold time on 3.3 V backup rails with minimal leakage. | Use Scenario: Acquisition buffer in digital oscilloscopes and logic analyzers capturing transient waveforms before host transfer. IC Role / Device Role / Timing Role: High-speed circular buffer for pre-trigger capture; requires deterministic read/write timing and bus isolation during transfers. Use Value: Tri-state I/Os and OE-controlled output disable prevent bus contention during DMA transfers to FPGA or USB controller; 70 ns tRC enables ≥14 MSPS sustained capture rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV1288BLL-70NLI | Same 128K×8 organization, 70 ns speed, but uses single CE (active-low) and operates at 2.7–3.6 V. | Requires level-shifting for 5 V systems; not drop-in compatible due to voltage and CE architecture mismatch. | Select only if migrating to 3.3 V system architecture and redesigning enable logic. |
| ON Semiconductor MC68HC11E9CP | Integrated MCU with on-chip 512-byte RAM-not a discrete SRAM; lacks external bus interface and expandability. | Replaces entire controller + memory subsystem; invalidates existing PCB layout and firmware memory map. | Not a functional alternative-only relevant for greenfield MCU selection, not SRAM replacement. |
Compared with IS62WV1288BLL-70NLI and MC68HC11E9CP, the CY62128BNLL-70SXAT uniquely delivers 5 V tolerance, dual CE expansion capability, and industrial temperature compliance in a pin-compatible SOIC package-making it irreplaceable for maintaining legacy 5 V embedded designs without board rework.
Availability
CY62128BNLL-70SXAT is available at Aetrix Electronics and suitable for industrial PLCs, automotive body control modules, legacy embedded controllers, and test equipment requiring stable component supply across long production lifecycles.
Supply support for CY62128BNLL-70SXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer markets.
The CY62128BN MoBL® (Mobile Binary Logic) SRAM product line was designed specifically for low-power, high-reliability embedded systems requiring fast, deterministic, and temperature-resilient volatile memory-especially where battery backup and long-term obsolescence mitigation are critical.
FAQ
What is the minimum VCC required for data retention on CY62128BNLL-70SXAT?
The device guarantees data retention down to VCC = 2.0 V (VDR), with maximum retention current ICCDR of 15 µA at –40°C to +85°C. This allows use with supercapacitor or lithium coin-cell backup circuits that decay below 3.0 V, provided CE1 is held HIGH or CE2 LOW to activate automatic power-down mode.
Can CY62128BNLL-70SXAT be used in a 3.3 V system?
No-CY62128BNLL-70SXAT is specified only for 4.5–5.5 V operation. Applying 3.3 V violates absolute maximum ratings and will result in undefined behavior, including failure to retain data or meet timing specifications. For 3.3 V systems, consider ISSI IS62WV1288BLL-70NLI or Alliance AS6C1008-70TIN instead.
How does the dual CE architecture improve memory expansion?
CE1 (active-low) and CE2 (active-high) allow hierarchical decoding: e.g., using a 2-to-4 decoder on higher address bits to drive CE2 of multiple CY62128BNLL-70SXAT devices, while CE1 remains tied to a common chip-select line. This eliminates external AND gates and reduces propagation delay versus single-CE schemes.
Is the 70 ns access time guaranteed over the full industrial temperature range?
Yes-the 70 ns maximum tAA (address-to-data-valid) and tRC (read cycle time) are fully characterized and guaranteed from –40°C to +85°C at VCC = 4.5 V to 5.5 V. No derating is required for industrial operation, unlike many competing SRAMs that specify speed only at 25°C.
CY62128BNLL-70SXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-SOIC (0.445", 11.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC
CY62128BNLL-70SXAT FAQ
1.How can I place an order for CY62128BNLL-70SXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128BNLL-70SXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128BNLL-70SXAT reliable?
The price and inventory of CY62128BNLL-70SXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128BNLL-70SXAT is usually 5 days.
3.What payment methods are accepted for CY62128BNLL-70SXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128BNLL-70SXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128BNLL-70SXAT?
CY62128BNLL-70SXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128BNLL-70SXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128BNLL-70SXAT?
For technical support, including CY62128BNLL-70SXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128BNLL-70SXAT requirements.
6.How does Aetrix verify that CY62128BNLL-70SXAT is sourced from the original manufacturer or authorized distributors?
All CY62128BNLL-70SXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128BNLL-70SXAT meets industry standards.
7.What is the process for return or replacement of CY62128BNLL-70SXAT?
All CY62128BNLL-70SXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY62128BNLL-70SXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128BNLL-70SXAT part is unused and in its original packaging.
Return procedure for CY62128BNLL-70SXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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