Infineon Technologies CY62128ELL-55SXET
- Part No.:
- CY62128ELL-55SXET
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-SOIC (0.445", 11.30mm Width)
- Datasheet:
-
CY62128ELL-55SXET.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,575
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Product details
Overview
CY62128ELL-55SXET from Cypress Semiconductor is a 1-Mbit (128 K × 8) CMOS static RAM with 45 ns access time (Industrial/Automotive-A grade), 4.5–5.5 V supply, and ultra-low standby current (1 µA typical). It features dual chip enables (CE1/CE2), automatic power-down on deselect, and TTL-level I/O compatibility-designed for battery-sensitive embedded systems requiring non-volatile data retention during sleep.
For engineers reviewing the CY62128ELL-55SXET datasheet, CY62128ELL-55SXET pinout, CY62128ELL-55SXET application, or CY62128ELL-55SXET equivalent, key selection criteria include industrial temperature support (–40 °C to +85 °C), TSOP-I package compatibility, CE-controlled power-down behavior, and 32-pin address/data multiplexing constraints in memory expansion designs.
Technical Context
The CY62128ELL-55SXET implements a 128K × 8 asynchronous SRAM architecture with independent CE1/CE2 logic enabling hierarchical memory banking. Its automatic power-down activates when CE1 is HIGH or CE2 is LOW, reducing ICCDR to ≤4 µA while maintaining data retention at VCC ≥ 2.0 V.
It supports three read modes (CE-controlled, OE-controlled, and CE/OE-coordinated) and two write modes (WE-controlled with CE active), with guaranteed tAA = 55 ns and tDOE = 25 ns under 100 pF load. Input thresholds meet TTL voltage levels (VIH = 2.2 V min), not CMOS-compatible VIH (≥3.5 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128 K × 8 bits - provides 131,072 bytes of byte-addressable, non-refreshing storage |
| Access Time (tAA) | 55 ns max - determines minimum CPU wait states for 8051/68K/Z80 bus interfaces |
| Supply Voltage | 4.5 V to 5.5 V - compatible with legacy 5 V logic rails and regulated LDO outputs |
| Standby Current (ISB2) | 1 µA typical / 4 µA max - enables >1-year battery life in coin-cell-powered RTC backup |
| Operating Current (ICC) | 1.3 mA typical at 1 MHz - defines thermal budget for dense PCB layouts with multiple SRAMs |
| Temperature Range | –40 °C to +85 °C - qualified for industrial control panels and automotive infotainment head units |
| Output Drive | IOH = –1 mA / IOL = 2.1 mA - sufficient to drive 10 TTL loads without buffering |
Pinout & Package
Package: 32-pin Thin Small Outline Package (TSOP Type I), 11.8 mm × 10.0 mm × 1.0 mm body, JEDEC MO-153 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word decoding; no internal latching |
| I/O0–I/O7 | Bidirectional Data Bus | CMOS-compatible 8-bit data path; high-impedance when CE1 HIGH or CE2 LOW or OE HIGH |
| CE1, CE2 | Chip Enable Controls | Active-Low CE1 AND Active-High CE2 required for enable; enables hierarchical bank selection |
| OE | Output Enable | Active-Low control for read data output; does not affect power state |
| WE | Write Enable | Active-Low signal initiating write cycle; overlaps with CE to define write window |
| VCC, VSS | Power Supply | 5 V ±10% supply and ground; decoupling capacitor required within 10 mm of pins 1 and 32 |
| NC | No Connect | Pin 27 (A15) is NC - must be left unconnected; not bonded to die |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces standby current to 1 µA typical-enables multi-year operation on CR2032 batteries in portable medical monitors |
| Dual Chip Enable Logic (CE1/CE2) | Supports seamless memory expansion up to 2 MB using external address decoding without glue logic |
| Automatic Power-Down on Deselect | Eliminates need for external power-gating circuitry when CE1/CE2 are controlled by FPGA address decode |
| TTL-Level Input Compatibility | Accepts 2.2 V VIH threshold-interoperates directly with 80C51, 68HC11, and Z80 microcontrollers without level shifters |
| High-Speed Read Timing | tDOE = 25 ns guarantees sub-40 ns data valid after OE assertion-meets tight timing budgets in video frame buffer applications |
Applications
| Industrial PLC Data Buffer | Automotive Instrument Cluster |
|---|---|
Use Scenario: Stores real-time sensor logs and configuration parameters during power cycling in programmable logic controllers. IC Role / Device Role / Timing Role: Asynchronous byte-access SRAM providing non-refreshing, deterministic 55 ns read/write latency for Modbus RTU packet assembly. Use Value: 4 µA max ISB2 ensures <1 µW standby power draw-critical for fanless enclosures with limited thermal dissipation. |
Use Scenario: Holds gauge animation frames and CAN message buffers in digital instrument clusters operating across –40 °C to +85 °C. IC Role / Device Role / Timing Role: Standalone SRAM interfacing directly to Renesas RH850F1L MCU via 8-bit data bus and discrete address lines. Use Value: Dual CE inputs allow dynamic partitioning between firmware scratchpad and display frame buffer without address decoder ICs. |
| Portable ECG Monitor | POS Terminal Memory Expansion |
Use Scenario: Buffers raw analog-to-digital samples prior to Bluetooth LE transmission in handheld electrocardiogram devices. IC Role / Device Role / Timing Role: Low-power MoBL SRAM acting as first-stage FIFO between ADC controller and wireless SoC DMA engine. Use Value: 1.3 mA typical ICC at 1 MHz enables continuous 250 SPS sampling for >8 hours on 200 mAh Li-ion cell. |
Use Scenario: Extends main memory capacity in embedded Linux-based point-of-sale terminals running Java-based payment apps. IC Role / Device Role / Timing Role: Parallel SRAM mapped into ARM926EJ-S AHB address space for fast Java bytecode cache storage. Use Value: Pin compatibility with CY62128B allows drop-in replacement during BOM optimization without PCB redesign. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV1288BLL-55QLI | Same 128K × 8 organization, 55 ns speed, but 2.7–3.6 V supply range and CMOS I/O levels | Requires level-shifting for 5 V systems; unsuitable for direct replacement in TTL-bus designs | Select only if migrating to 3.3 V system architecture with updated I/O voltage planning |
| Cypress CY62128EV30LL-55SXI | Same pinout and timing, but 3.0–3.6 V supply and enhanced data retention at 1.8 V | Not interoperable with 5 V buses; requires full power rail redesign and new decoupling layout | Choose for next-gen low-voltage designs where legacy 5 V compatibility is not required |
Compared with IS62WV1288BLL-55QLI and CY62128EV30LL-55SXI, the CY62128ELL-55SXET uniquely supports 5 V TTL-level interfacing and industrial temperature operation without voltage translation-making it irreplaceable in legacy embedded upgrades where bus voltage and timing margins are fixed.
Availability
CY62128ELL-55SXET is available at Aetrix Electronics and suitable for industrial PLC data buffering, automotive instrument cluster memory expansion, and portable medical device data logging requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY62128ELL-55SXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for industrial, automotive, and IoT applications, with headquarters in San Jose, CA.
The CY62128E MoBL® product line delivers ultra-low-power static RAMs optimized for battery-backed data retention and energy-constrained portable electronics-prioritizing sub-microamp standby current without sacrificing 5 V bus compatibility.
FAQ
Is CY62128ELL-55SXET compatible with 3.3 V microcontrollers?
No. The CY62128ELL-55SXET requires 4.5–5.5 V supply and accepts TTL-level inputs (VIH ≥ 2.2 V), but its outputs do not meet 3.3 V CMOS logic thresholds. Direct interface with 3.3 V MCUs requires bidirectional level-shifting circuitry to avoid overvoltage damage and signal integrity loss.
What is the function of the NC pin (Pin 27) in the TSOP package?
Pin 27 is designated NC (No Connect) and is not bonded to the silicon die. It must remain unconnected on the PCB-neither tied to VCC, VSS, nor routed. Leaving it floating is electrically safe; soldering or routing to any net may cause mechanical stress or unintended coupling in high-density layouts.
Does CY62128ELL-55SXET support battery backup mode with VCC disconnected?
Yes. When VCC drops to ≥2.0 V and CE1 is held HIGH or CE2 LOW, the device enters data retention mode with ICCDR ≤4 µA. External backup voltage must be applied through a diode-OR circuit to VCC; the SRAM retains data for >20 years at 25 °C with proper decoupling and clean hold voltage.
Can CE1 and CE2 be tied together for simplified control?
Yes, but only if driven by an active-LOW signal inverted through a single transistor or gate. CE1 requires active-LOW and CE2 active-HIGH logic; tying them directly causes permanent disable. Recommended practice is to use CE1 as primary enable and pull CE2 HIGH via 10 kΩ resistor for basic operation.
CY62128ELL-55SXET Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-SOIC (0.445", 11.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC
CY62128ELL-55SXET FAQ
1.How can I place an order for CY62128ELL-55SXET through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128ELL-55SXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128ELL-55SXET reliable?
The price and inventory of CY62128ELL-55SXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128ELL-55SXET is usually 5 days.
3.What payment methods are accepted for CY62128ELL-55SXET?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128ELL-55SXET transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128ELL-55SXET?
CY62128ELL-55SXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128ELL-55SXET order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128ELL-55SXET?
For technical support, including CY62128ELL-55SXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128ELL-55SXET requirements.
6.How does Aetrix verify that CY62128ELL-55SXET is sourced from the original manufacturer or authorized distributors?
All CY62128ELL-55SXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128ELL-55SXET meets industry standards.
7.What is the process for return or replacement of CY62128ELL-55SXET?
All CY62128ELL-55SXET units undergo pre-shipment inspection (PSI). If there is an issue with CY62128ELL-55SXET, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128ELL-55SXET part is unused and in its original packaging.
Return procedure for CY62128ELL-55SXET:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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