Infineon Technologies CY62128ELL-55ZAXET
- Part No.:
- CY62128ELL-55ZAXET
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-TFSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY62128ELL-55ZAXET.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32STSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,599
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62128ELL-55ZAXET from Cypress Semiconductor is a 1-Mbit (128 K × 8) CMOS static RAM with 45 ns access time (Industrial/Automotive-A grade), 4.5–5.5 V supply range, and ultra-low standby current (1 µA typical). It features dual chip enables (CE1/CE2), automatic power-down on deselect, and TTL-level I/O compatibility-designed for battery-powered portable systems requiring reliable non-volatile data retention during sleep modes.
For engineers reviewing the CY62128ELL-55ZAXET datasheet, CY62128ELL-55ZAXET pinout, CY62128ELL-55ZAXET application, or CY62128ELL-55ZAXET equivalent, key selection criteria include its 32-pin TSOP-I package, dual CE architecture for memory expansion, guaranteed 55 ns access in Automotive-E temperature range (–40 °C to +125 °C), and CMOS-compatible input thresholds with TTL output drive capability.
Technical Context
The CY62128ELL-55ZAXET implements a 128K × 8 asynchronous SRAM array with complementary metal oxide semiconductor (CMOS) process technology, enabling high-speed operation at 55 ns tAA while maintaining ultra-low active current (1.3 mA typical at 1 MHz). Its dual chip enable (CE1 LOW and CE2 HIGH) logic supports hierarchical memory mapping and seamless bank expansion.
Automatic power-down activates when CE1 is HIGH or CE2 is LOW, reducing ICCDR to ≤30 µA in Automotive-E grade. The device uses TTL-compatible input voltage thresholds (VIH ≥ 2.2 V, VIL ≤ 0.8 V) and delivers VOH ≥ 2.4 V at IOH = –1 mA, ensuring interoperability with legacy 5 V microcontrollers and DSPs without level-shifting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128 K × 8 bits - provides 1 Mbit of fast, non-refreshing random-access storage for firmware buffers or real-time data logging. |
| Access Time (tAA) | 55 ns max (Automotive-E) - guarantees deterministic read latency for time-critical control loops in engine ECUs or ADAS sensors. |
| Supply Voltage Range | 4.5 V to 5.5 V - supports direct connection to standard 5 V rail without regulation, compatible with industrial power supplies. |
| Standby Current (ISB2) | 1 µA typical / 30 µA max (Automotive-E) - enables multi-year battery life in always-on telematics modules. |
| Operating Current (ICC) | 1.3 mA typical at 1 MHz - minimizes thermal load in compact enclosures like medical handhelds or IoT gateways. |
| Temperature Range | –40 °C to +125 °C (Automotive-E) - qualified for under-hood automotive applications per AEC-Q100 stress requirements. |
| I/O Interface | TTL-compatible inputs, CMOS-compatible outputs - interfaces directly with legacy 5 V MCUs (e.g., Intel 8051, TI MSP430) without external translators. |
Pinout & Package
Package: 32-pin Thin Small Outline Package (TSOP) Type I, 11.8 mm × 10.0 mm × 1.0 mm body, lead pitch 0.5 mm, RoHS-compliant Pb-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word addressing; no internal latching - requires stable address during CE/OE assertion. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit multiplexed data path; enters high-impedance state when CE1 HIGH/CE2 LOW, OE HIGH, or WE LOW during write. |
| CE1, CE2 | Dual Chip Enable Inputs | Active-LOW CE1 AND active-HIGH CE2 required for selection; enables hierarchical decoding and memory banking without external logic. |
| OE | Output Enable | Active-LOW control for read data gating; independent of CE state - allows output disable while chip remains selected. |
| WE | Write Enable | Active-LOW signal initiating write cycle; timing-critical edge must overlap valid address and data setup/hold windows. |
| VCC, VSS | Power Supply Pins | VCC = 4.5–5.5 V; VSS = ground reference; decoupling capacitor (0.1 µF) required within 10 mm of VCC pin for noise immunity. |
| NC | No Connect | Pin 27 (A15) is NC - not bonded on die; must be left unconnected or tied to GND per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces standby current by >99% vs. standard SRAMs, enabling multi-year operation on coin-cell batteries in remote sensors. |
| Dual Chip Enable (CE1/CE2) | Enables seamless 2× memory expansion using only one additional address line - eliminates need for external decode logic in stacked RAM designs. |
| Automatic Power-Down Mode | Activates instantly on CE deassertion, eliminating software-controlled sleep entry sequences and reducing firmware complexity. |
| TTL-Level Input Compatibility | Accepts VIH ≥ 2.2 V and VIL ≤ 0.8 V - interoperable with legacy 5 V microcontrollers without level shifters or pull-up resistors. |
| Guaranteed 55 ns Access in Automotive-E Grade | Validated across –40 °C to +125 °C ambient - ensures deterministic timing in engine control units exposed to thermal cycling. |
Applications
| Automotive Engine Control Unit (ECU) | Portable Medical Monitor |
|---|---|
Use Scenario: Real-time storage of sensor calibration tables and fault logs during engine runtime and ignition-off periods. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer interfacing directly with 8051-based ECU MCU via 8-bit data bus and 17-bit address lines. Use Value: 55 ns access time ensures zero-cycle-wait reads for lookup tables; 30 µA max standby current preserves battery charge during vehicle dormancy. |
Use Scenario: Temporary storage of waveform samples (ECG, SpO₂) before compression and wireless transmission in handheld diagnostic devices. IC Role / Device Role / Timing Role: High-speed data capture buffer synchronized to ADC sampling clock, accessed by ARM Cortex-M0+ processor. Use Value: 1.3 mA typical active current minimizes thermal rise in sealed plastic housing; TSOP-I package enables compact PCB layout. |
| Industrial PLC I/O Module | Smart Meter Data Logger |
Use Scenario: Holding configuration parameters and transient I/O status snapshots during brown-out events in programmable logic controllers. IC Role / Device Role / Timing Role: Non-volatile shadow RAM retaining critical state data when main 5 V rail drops below 4.5 V. Use Value: Guaranteed data retention down to VCC = 2.0 V with ≤30 µA current draw - extends safe shutdown window by >100 ms. |
Use Scenario: Cyclic buffering of hourly energy consumption records in ANSI C12.19-compliant utility meters operating on lithium-thionyl chloride cells. IC Role / Device Role / Timing Role: Low-leakage memory storing 30 days of interval data before upload via RF or PLC interface. Use Value: 1 µA typical ISB2 enables >15-year battery life; Automotive-E temperature rating ensures reliability in outdoor meter enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV1288BLL-55QLI | 55 ns access, same 128K × 8 organization, but uses single CE and operates at 2.7–3.6 V only. | Requires level-shifting for 5 V systems; unsuitable for direct replacement in existing 5 V designs. | Select only if migrating to 3.3 V architecture and redesigning power delivery and I/O interface. |
| ON Semiconductor NVSRAM NVTFS1288L-55Z | Integrated EEPROM backup; 55 ns SRAM access but higher standby current (100 µA typical) and larger 48-pin TSSOP package. | Provides non-volatility without external backup circuitry - adds cost and board area but eliminates data loss risk on power failure. | Choose when data persistence across unlimited power cycles is mandatory, and 100 µA standby is acceptable. |
Compared with IS62WV1288BLL-55QLI and NVTFS1288L-55Z, the CY62128ELL-55ZAXET uniquely delivers 5 V native operation, dual CE expandability, and sub-µA standby in a 32-pin TSOP - making it optimal for cost-sensitive, space-constrained 5 V automotive and industrial upgrades.
Availability
CY62128ELL-55ZAXET is available at Aetrix Electronics and suitable for automotive engine control units, portable medical monitors, and industrial PLC I/O modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY62128ELL-55ZAXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for automotive, industrial, and consumer applications, with headquarters in San Jose, CA.
The CY62128E MoBL® product line targets portable and battery-operated systems requiring ultra-low-power, high-speed SRAM with robust temperature performance - specifically engineered for extended-life telemetry, sensor nodes, and automotive subsystems.
FAQ
Is CY62128ELL-55ZAXET pin-compatible with CY62128B series devices?
Yes, CY62128ELL-55ZAXET is explicitly pin-compatible with CY62128B devices per Cypress documentation. It retains identical 32-pin TSOP-I pinout, address/data bus mapping, and CE/OE/WE signal assignments - enabling drop-in replacement without PCB revision. However, the newer device offers improved standby current (1 µA vs. 5 µA typical) and tighter AC timing specifications.
What is the maximum data retention voltage (VDR) for CY62128ELL-55ZAXET?
The maximum data retention voltage (VDR) is 2.0 V minimum across all grades. At this voltage, the device maintains stored data with ICCDR ≤30 µA (Automotive-E) while CE1 is HIGH or CE2 is LOW. Data retention is guaranteed for indefinite duration as long as VCC remains ≥VDR and ambient temperature stays within rated range.
Can CY62128ELL-55ZAXET interface directly with a 3.3 V microcontroller?
No - CY62128ELL-55ZAXET requires 4.5–5.5 V VCC and has TTL-compatible inputs (VIH ≥ 2.2 V), but its outputs swing to VOH ≥ 2.4 V at –1 mA, which may not meet 3.3 V MCU VIH minimums (typically 2.0 V). Direct interface risks marginal logic-high recognition; a level translator or voltage divider is required for reliable operation.
Does CY62128ELL-55ZAXET support byte-wide writes?
No - CY62128ELL-55ZAXET lacks individual byte-write enable pins. All eight I/O lines (I/O0–I/O7) operate as a unified 8-bit bus; writes always affect the full byte at the addressed location. To modify single bytes, the host processor must read-modify-write the entire word, increasing software overhead and bus traffic.
CY62128ELL-55ZAXET Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-TFSOP (0.465", 11.80mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-sTSOP
CY62128ELL-55ZAXET FAQ
1.How can I place an order for CY62128ELL-55ZAXET through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128ELL-55ZAXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128ELL-55ZAXET reliable?
The price and inventory of CY62128ELL-55ZAXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128ELL-55ZAXET is usually 5 days.
3.What payment methods are accepted for CY62128ELL-55ZAXET?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128ELL-55ZAXET transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128ELL-55ZAXET?
CY62128ELL-55ZAXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128ELL-55ZAXET order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128ELL-55ZAXET?
For technical support, including CY62128ELL-55ZAXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128ELL-55ZAXET requirements.
6.How does Aetrix verify that CY62128ELL-55ZAXET is sourced from the original manufacturer or authorized distributors?
All CY62128ELL-55ZAXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128ELL-55ZAXET meets industry standards.
7.What is the process for return or replacement of CY62128ELL-55ZAXET?
All CY62128ELL-55ZAXET units undergo pre-shipment inspection (PSI). If there is an issue with CY62128ELL-55ZAXET, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128ELL-55ZAXET part is unused and in its original packaging.
Return procedure for CY62128ELL-55ZAXET:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62128ELL-55ZAXET Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

