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Infineon Technologies CY62128EV30LL-45ZXI
- Part No.:
- CY62128EV30LL-45ZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY62128EV30LL-45ZXI.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:536
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Product details
Overview
CY62128EV30LL-45ZXI from Cypress Semiconductor is a 1-Mbit (128K × 8) CMOS static RAM with 45 ns access time, 2.2–3.6 V supply voltage, and industrial temperature range (–40 °C to +85 °C). It features dual chip enables (CE1/CE2), automatic power-down, and ultra-low standby current (1 µA typical), deployed in battery-constrained portable systems including cellular handsets and handheld medical monitors.
For engineers reviewing the CY62128EV30LL-45ZXI datasheet, CY62128EV30LL-45ZXI pinout, CY62128EV30LL-45ZXI application, or CY62128EV30LL-45ZXI equivalent, key selection criteria include its MoBL® low-power architecture, dual CE logic for memory expansion, TSOP/STSOP/SOIC package compatibility, and guaranteed 45 ns timing at full industrial voltage and temperature range.
Technical Context
The device implements a fully static 128K × 8 memory array with complementary metal oxide semiconductor (CMOS) process technology, enabling zero-refresh operation and deterministic timing across voltage and temperature. Its dual chip enable (CE1 LOW + CE2 HIGH = active) supports hierarchical memory mapping and seamless bank expansion without external logic.
Automatic power-down activates when CE1 is HIGH or CE2 is LOW, reducing ICC to ≤4 µA while maintaining data retention down to 1.5 V. Output drivers enter high-impedance state during deselect, OE HIGH, or write cycles-ensuring clean bus sharing in multi-device systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 8 bits - provides byte-wide data interface compatible with 8-bit microcontrollers and legacy bus architectures. |
| Access Time | 45 ns - guarantees deterministic read latency under worst-case industrial conditions (VCC = 2.2 V, TA = +85 °C). |
| Supply Voltage Range | 2.2 V to 3.6 V - supports direct interfacing with 2.5 V and 3.3 V logic families without level translation. |
| Standby Current | 1 µA typical / 4 µA max - enables multi-year battery life in always-on sensor nodes and wearable devices. |
| Active Current | 1.3 mA typical at 1 MHz - balances performance and power for intermittent data logging applications. |
| Data Retention Voltage | 1.5 V minimum - allows memory contents to persist during brown-out or controlled power-down sequences. |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial control panels, automotive infotainment head units, and outdoor IoT gateways. |
Pinout & Package
Package: 32-pin Shrunk Thin Small Outline Package (STSOP), RoHS-compliant, body size 10.16 mm × 5.10 mm × 1.20 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word addressing; no internal latching required. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tri-state I/O lines; high-impedance when deselected, OE HIGH, or during write cycles. |
| CE1, CE2 | Dual Chip Enable Inputs | Active-Low CE1 AND Active-High CE2 logic enables hierarchical memory decoding and eliminates need for external gating. |
| OE | Output Enable | Controls output driver enable independently of CE; allows read-modify-write without toggling chip select. |
| WE | Write Enable | Active-Low signal initiating write cycle; timing referenced to CE and address stability per tSCE/tAW specs. |
| VCC, GND | Power Supply | Single 2.2–3.6 V supply; decoupling capacitor placement critical near Pin 19 (VCC) and Pin 20 (GND) per layout guidelines. |
| NC | No Connect | Pin 26 (TSOP/STSOP) and Pin 27 (SOIC) are unconnected on die; must remain floating or grounded per PCB design rules. |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces active current to 1.3 mA at 1 MHz and standby to 1 µA typical-enabling >5-year coin-cell operation in remote sensors. |
| Dual Chip Enable Logic (CE1/CE2) | Enables direct cascading of multiple SRAMs for larger memory maps without address decoder ICs or FPGA logic resources. |
| Automatic Power-Down on Deselect | Guarantees >99% power reduction when CE1 HIGH or CE2 LOW-eliminates need for external sleep controllers. |
| High-Speed 45 ns Timing | Meets real-time response requirements for 8-bit MCU-based motor control loops and digital oscilloscope front-ends. |
| Pb-Free STSOP/TSOP/SOIC Packaging | Supports automated SMT assembly with industry-standard reflow profiles; STSOP footprint saves 30% board area vs. TSOP. |
Applications
| Portable Medical Monitors | Industrial PLC Data Buffers |
|---|---|
|
Use Scenario: Continuous ECG waveform capture and local buffering in handheld patient monitors operating on single CR2032 cells. IC Role / Device Role / Timing Role: Byte-addressable SRAM storing 10–30 seconds of raw 12-bit ADC samples prior to BLE transmission. Use Value: 1 µA standby current extends battery life beyond 24 months; 45 ns access supports real-time display refresh at 60 Hz. |
Use Scenario: Temporary storage of I/O status, ladder logic variables, and fault history in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Non-refresh volatile memory holding runtime configuration and transient diagnostics between power cycles. Use Value: Industrial temp rating (–40 °C to +85 °C) ensures reliability in unconditioned control cabinets; dual CE simplifies modular backplane expansion. |
| Automotive Infotainment UI Cache | Smart Meter Firmware Overlay |
|
Use Scenario: Caching GUI assets (icons, fonts, menu trees) in automotive head units to reduce boot time and NAND flash wear. IC Role / Device Role / Timing Role: High-speed parallel interface SRAM acting as instruction/data cache between ARM Cortex-A53 and eMMC controller. Use Value: 2.2–3.6 V operation tolerates vehicle battery fluctuations; 45 ns latency prevents UI stutter during concurrent Bluetooth/Audio processing. |
Use Scenario: Storing decrypted firmware patches and configuration overlays during over-the-air (OTA) updates in ANSI C12.22-compliant smart electricity meters. IC Role / Device Role / Timing Role: Secure, fast-access working memory for cryptographic verification and patch application before flash programming. Use Value: Data retention down to 1.5 V ensures integrity during brown-out events common in grid-edge deployments; Pb-free STSOP fits compact meter PCBs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS62WV1288BLL-45NLI | Same 128K × 8 organization, 45 ns speed, and –40 °C to +85 °C rating; uses single CE (active-low) instead of dual CE1/CE2. | Lacks hierarchical enable logic-requires external gating for multi-SRAM systems; higher standby current (5 µA max). | Select when board space is constrained and memory map is flat (single-bank); verify CE timing compatibility with host controller. |
| Renesas R1LV0108ESB-45GBG | Identical pinout and timing; supports 1.65–3.6 V range but specifies only 3.0 V typical VCC for 45 ns operation. | Lower min VCC enables use with 1.8 V I/O domains; however, industrial temp validation at 2.2 V not documented. | Prefer for mixed-voltage designs where 1.8 V logic coexists with 3.3 V peripherals; confirm 2.2 V timing margin via Renesas AN-942. |
Compared with IS62WV1288BLL-45NLI and R1LV0108ESB-45GBG, CY62128EV30LL-45ZXI delivers superior system-level power efficiency via dual CE–driven automatic power-down and guaranteed 45 ns performance across its full 2.2–3.6 V range-critical for battery longevity and voltage-margin-critical industrial designs.
Availability
CY62128EV30LL-45ZXI is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC data buffers, and automotive infotainment UI cache requiring stable component supply, long-term lifecycle support, and RoHS-compliant STSOP packaging.
Supply support for CY62128EV30LL-45ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for industrial, automotive, and consumer electronics markets.
CY62128EV30 belongs to the MoBL® (More Battery Life) SRAM product line, engineered specifically for ultra-low-power, high-speed volatile memory in portable and energy-constrained embedded systems.
FAQ
What is the minimum VCC required to retain data in CY62128EV30LL-45ZXI?
The device guarantees data retention down to VCC = 1.5 V, as specified in the Data Retention Characteristics table (Page 6, Parameter VDR). At this voltage, ICCDR remains ≤3 µA, and the memory maintains stored contents indefinitely as long as CE1 is HIGH or CE2 is LOW-enabling robust brown-out recovery in battery-powered systems.
Can CY62128EV30LL-45ZXI operate reliably at 2.2 V and +85 °C?
Yes. The datasheet explicitly qualifies the 45 ns access time and all electrical parameters-including ICC, ISB, VOH, VOL, and switching characteristics-over the full industrial range of 2.2 V to 3.6 V and –40 °C to +85 °C. No derating is required for timing or power at these extremes.
Is pin 26 (NC) on the STSOP package required to be grounded or left floating?
Pin 26 is designated NC (No Connect) and is unconnected on the die. Per Cypress Application Note AN9856, it must be left electrically floating-neither tied to VCC nor GND-to avoid parasitic coupling or unintended current paths that could affect standby current or noise immunity.
How does the dual CE (CE1/CE2) logic differ from standard single CE SRAMs in system design?
CE1 (active-low) and CE2 (active-high) form a logical AND function: the device activates only when CE1 = LOW AND CE2 = HIGH. This enables direct daisy-chaining of multiple CY62128EV30LL devices using decoded address bits-e.g., A17 drives CE2 of Bank 1 and CE1 of Bank 2-eliminating external AND gates and reducing BOM count and propagation delay.
CY62128EV30LL-45ZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- MOBL™
- Package/Case:
- 32-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP I
CY62128EV30LL-45ZXI FAQ
1.How can I place an order for CY62128EV30LL-45ZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62128EV30LL-45ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62128EV30LL-45ZXI reliable?
The price and inventory of CY62128EV30LL-45ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62128EV30LL-45ZXI is usually 5 days.
3.What payment methods are accepted for CY62128EV30LL-45ZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62128EV30LL-45ZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62128EV30LL-45ZXI?
CY62128EV30LL-45ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62128EV30LL-45ZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62128EV30LL-45ZXI?
For technical support, including CY62128EV30LL-45ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62128EV30LL-45ZXI requirements.
6.How does Aetrix verify that CY62128EV30LL-45ZXI is sourced from the original manufacturer or authorized distributors?
All CY62128EV30LL-45ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62128EV30LL-45ZXI meets industry standards.
7.What is the process for return or replacement of CY62128EV30LL-45ZXI?
All CY62128EV30LL-45ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62128EV30LL-45ZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62128EV30LL-45ZXI part is unused and in its original packaging.
Return procedure for CY62128EV30LL-45ZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62128EV30LL-45ZXI Tags
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